Three dimensional circuit formation

Abstract

Devices, methods, and systems for forming an electrical circuit out of a conductor embedded in two layers of substrate are disclosed. Portions of the two layers of substrate and the conductor are removed, forming a cavity through the two layers and the conductor. A blocker material is deposited along the wall of the cavity. A portion of the blocker material and adjacent layer of the substrate is removed forming another cavity in contact with a part of the conductor. A surface of the second cavity is then electroless plated by a conductive metal to form part of the electrical circuit.

What is claimed is: 
     
         1 . A circuit board comprising a first conductor separated from a second conductor by a plating blocker material. 
     
     
         2 . The circuit board of  claim 1 , wherein the plating blocker material blocks chemical plating. 
     
     
         3 . The circuit board of claim  11 , wherein the plating blocker material deactivates a chemical plating catalyst. 
     
     
         4 . The circuit board of  claim 1 , wherein at least one of the first conductor or the second conductor is further electrically coupled to at least one additional conductor layer. 
     
     
         5 . The circuit board of  claim 1 , wherein at least one of the first conductor or the second conductor is positioned at least partially in a trench, a blind via, a buried via, or a through hole. 
     
     
         6 . The circuit board of  claim 1 , wherein at least one of the first conductor or the second conductor is positioned on the plating blocker material. 
     
     
         7 . The circuit board of  claim 1 , further comprising a first dielectric material and a second dielectric material positioned on the plating blocker material, wherein the first conductor is deposited on the first dielectric material and the second conductor is deposited on the second dielectric material. 
     
     
         8 . The circuit board of  claim 1 , wherein the circuit board is a multilayer printed circuit board. 
     
     
         9 . The circuit board of  claim 1 , wherein the first conductor is selected from the group consisting of copper, nickel, tin, silver, gold, aluminum, palladium, platinum, rhodium, or alloy or combination thereof.