Micro light-emitting diode display fabrication and assembly

Abstract

Micro light-emitting diode (LED) display fabrication and assembly are described. In an example, a micro-light emitting diode (LED) display panel includes a display backplane substrate having a plurality of metal bumps thereon. A plurality of LED pixel elements includes ones of LED pixel elements bonded to corresponding ones of the plurality of metal bumps of display backplane substrate. One or more of the plurality of LED pixel elements has a graphene layer thereon. The graphene layer is on a side of the one or more of the plurality of LED pixel elements opposite the side of the metal bumps.

What is claimed is: 
     
         1 . A micro-light emitting diode (LED) display panel, comprising:
 a display backplane substrate having a plurality of metal bumps thereon;   a plurality of LED pixel elements comprising ones of LED pixel elements bonded to corresponding ones of the plurality of metal bumps of display backplane substrate, one or more of the plurality of LED pixel elements having a graphene layer thereon, the graphene layer on a side of the one or more of the plurality of LED pixel elements opposite the side of the metal bumps.   
     
     
         2 . The micro-light emitting diode (LED) display panel of  claim 1 , wherein the plurality of LED pixel elements is a plurality of nanowire-based LED pixel elements. 
     
     
         3 . The micro-light emitting diode (LED) display panel of  claim 2 , wherein the plurality of nanowire-based LED pixel elements comprises GaN nanowires. 
     
     
         4 . The micro-light emitting diode (LED) display panel of  claim 1 , wherein the plurality of LED pixel elements is a plurality of nanopyramid-based LED pixel elements. 
     
     
         5 . The micro-light emitting diode (LED) display panel of  claim 4 , wherein the plurality of nanopyramid-based LED pixel elements comprises GaN nanopyramids. 
     
     
         6 . A microstructure, comprising:
 a metal bump; and   an LED pixel element bonded to the metal bump, the LED pixel element having a graphene layer thereon, the graphene layer on a side of the LED pixel element opposite a side bonded to the metal bump.   
     
     
         7 . The microstructure of  claim 6 , wherein the LED pixel element is a nanowire-based LED pixel element. 
     
     
         8 . The microstructure of  claim 7 , wherein the nanowire-based LED pixel element comprises a GaN nanowire. 
     
     
         9 . The microstructure of  claim 6 , wherein the LED pixel element is a nanopyramid-based LED pixel element. 
     
     
         10 . The microstructure of  claim 9 , wherein the nanowire-based LED pixel element comprises a GaN nanopyramid. 
     
     
         11 . An electronic device, comprising:
 a processor; and   a display coupled to the processor, the display comprising:
 a display backplane substrate having a plurality of metal bumps thereon; 
 a plurality of LED pixel elements comprising ones of LED pixel elements bonded to corresponding ones of the plurality of metal bumps of display backplane substrate, one or more of the plurality of LED pixel elements having a graphene layer thereon, the graphene layer on a side of the one or more of the plurality of LED pixel elements opposite the side of the metal bumps. 
   
     
     
         12 . The electronic device of  claim 11 , further comprising:
 a memory coupled to the processor.   
     
     
         13 . The electronic device of  claim 11 , further comprising:
 a network coupled to the processor.   
     
     
         14 . The electronic device of  claim 11 , further comprising:
 a battery coupled to the processor.   
     
     
         15 . The electronic device of  claim 11 , wherein the electronic device is a device selected from the group consisting of a smartphone, a tablet, a notebook, a smartwatch, and a computing device. 
     
     
         16 . An electronic device, comprising:
 a processor; and   a microstructure coupled to the processor, the microstructure comprising:
 a metal bump; and 
 an LED pixel element bonded to the metal bump, the LED pixel element having a graphene layer thereon, the graphene layer on a side of the LED pixel element opposite a side bonded to the metal bump. 
   
     
     
         17 . The electronic device of  claim 16 , further comprising:
 a memory coupled to the processor.   
     
     
         18 . The electronic device of  claim 16 , further comprising:
 a network coupled to the processor.   
     
     
         19 . The electronic device of  claim 16 , further comprising:
 a battery coupled to the processor.   
     
     
         20 . The electronic device of  claim 16 , wherein the electronic device is a device selected from the group consisting of a smartphone, a tablet, a notebook, a smartwatch, and a computing device.