Inventor · disambiguated record
Anup Pancholi
Also filed as: PANCHOLI ANUP
24 granted patents·11 pending applications·33 citations·filing 2017–2025
93Inventor score
Top patents by PatentIndex Score
35 records- 0195US10361337B2Micro light-emitting diode (LED) display and fluidic self-assembly of sameINTEL CORP·Filed 2017·Granted Jul 23, 2019·11 cites·7 claims
- 0293US10439101B2Micro light-emitting diode (LED) elements and displayINTEL CORP·Filed 2017·Granted Oct 8, 2019·7 cites·8 claims
- 0390US11251158B2Monolithic chip stacking using a die with double-sided interconnect layersINTEL CORP·Filed 2017·Granted Feb 15, 2022·4 cites·18 claims
- 0489US2025316650A1Monolithic chip stacking using a die with double-sided interconnect layersINTEL CORP·Filed 2025·Application pending·0 cites
- 0586US11037817B2Apparatus with multi-wafer based device and method for forming suchINTEL CORP·Filed 2017·Granted Jun 15, 2021·4 cites·16 claims
- 0685US12463180B2Monolithic chip stacking using a die with double-sided interconnect layersINTEL CORP·Filed 2023·Granted Nov 4, 2025·0 cites·20 claims
- 0785US11948831B2Apparatus with multi-wafer based device and method for forming suchINTEL CORP·Filed 2021·Granted Apr 2, 2024·1 cites·25 claims
- 0884US12362325B2Monolithic chip stacking using a die with double-sided interconnect layersINTEL CORP·Filed 2023·Granted Jul 15, 2025·0 cites·14 claims
- 0982US10923622B2Micro light-emitting diode (LED) elements and displayINTEL CORP·Filed 2019·Granted Feb 16, 2021·2 cites·9 claims
- 1079US2025291138A1Methods for fabrication of optical structures on photonic glass layer substratesAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1178US11177243B2Micro light-emitting diode display fabrication and assemblyINTEL CORP·Filed 2018·Granted Nov 16, 2021·2 cites·21 claims
- 1277US11784165B2Monolithic chip stacking using a die with double-sided interconnect layersINTEL CORP·Filed 2021·Granted Oct 10, 2023·0 cites·20 claims
- 1373US12487417B2Photonic glass layer substrate with embedded optical structures for communicating with an electro optical integrated circuitAPPLIED MATERIALS INC·Filed 2022·Granted Dec 2, 2025·0 cites·20 claims
- 1473US12345934B2Methods for fabrication of optical structures on photonic glass layer substratesAPPLIED MATERIALS INC·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 1573US11908981B2Laser printing of color converter devices on micro led display devices and methodsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·17 claims
- 1672US11908687B2III-N multichip modules and methods of fabricationINTEL CORP·Filed 2021·Granted Feb 20, 2024·0 cites·17 claims
- 1771US11527683B2Laser printing of color converter devices on micro LED display devices and methodsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 13, 2022·1 cites·8 claims
- 1870US12444707B2Method for collective dishing of singulated diesAPPLIED MATERIALS INC·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 1968US11037916B2Apparatus with multi-wafer based device comprising embedded active devices and method for forming suchINTEL CORP·Filed 2017·Granted Jun 15, 2021·1 cites·18 claims
- 2065US11211245B2III-N multichip modules and methods of fabricationINTEL CORP·Filed 2020·Granted Dec 28, 2021·0 cites·20 claims
- 2165US2021135048A1Micro light-emitting diode (led) elements and displayINTEL CORP·Filed 2021·Application pending·0 cites
- 2263US11610936B2Micro light-emitting diode displays having color conversion devices and assembly approachesINTEL CORP·Filed 2019·Granted Mar 21, 2023·0 cites·28 claims
- 2363US2022037572A1Micro light-emitting diode display fabrication and assemblyINTEL CORP·Filed 2021·Application pending·0 cites
- 2462US2025385237A1Monolithic-like integration of semiconductor structuresGOOGLE LLC·Filed 2025·Application pending·0 cites
- 2557US11245053B2Micro-LED structures for full color displays and methods of manufacturing the sameINTEL CORP·Filed 2019·Granted Feb 8, 2022·0 cites·30 claims
- 2654US2019296184A1Micro light-emitting diode (led) display and fluidic self-assembly of sameINTEL CORP·Filed 2019·Application pending·0 cites
- 2752US2025208210A1System-Level Testing of a Processing Device Incorporated in a Silicon WaferGOOGLE LLC·Filed 2023·Application pending·0 cites
- 2851US12389728B2Micro-LED displays including solder structures and methodsINTEL CORP·Filed 2020·Granted Aug 12, 2025·0 cites·9 claims
- 2951US2024021571A1Hybrid bonding of semiconductor structures to advanced substrate panelsAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3047US11659722B2Thin-film-transistor based complementary metal-oxide-semiconductor (CMOS) circuitINTEL CORP·Filed 2018·Granted May 23, 2023·0 cites·21 claims
- 3144US10714446B2Apparatus with multi-wafer based device comprising embedded active and/or passive devices and method for forming suchINTEL CORP·Filed 2017·Granted Jul 14, 2020·0 cites·15 claims
- 3242US2021020537A1Integrated heat spreader (ihs) with solder thermal interface material (stim) bleed-out restricting featureINTEL CORP·Filed 2019·Application pending·0 cites
- 3340US2020043901A1Laser transfer printing for making micro led display devices and methodINTEL CORP·Filed 2018·Application pending·0 cites
- 3437US11637093B2Micro light-emitting diode display fabrication and assemblyINTEL CORP·Filed 2018·Granted Apr 25, 2023·0 cites·15 claims
- 3535US2019058081A1Micro light-emitting diode (led) display and assembly apparatusAHMED KHALED·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →