Heat transfer system for electronic enclosures

Abstract

Heat transfer systems and methods are disclosed. A heat transfer system includes an electronic enclosure housing at least one electronic component and including a volume for a first fluid. A sealed cavity is disposed within the electronic enclosure and contains within itself a second fluid that is physically separated from the first fluid. A heat transfer device has a first surface configured to directly interface with the first fluid and a second surface configured to directly interface with the second fluid.

What is claimed is: 
     
         1 . A heat transfer system for electronic enclosures, the system comprising:
 an electronic enclosure housing at least one electronic component and including a volume for a first fluid;   a sealed cavity disposed within the electronic enclosure and containing within itself a second fluid that is physically separated from the first fluid; and   a heat transfer device having a first surface configured to directly interface with the first fluid and a second surface configured to directly interface with the second fluid.   
     
     
         2 . The heat transfer system of  claim 1 , and further comprising a cold plate, wherein the heat transfer device is configured to couple to the cold plate to form the sealed cavity between itself and the cold plate, and the cold plate is configured to provide the sealed cavity with access to the second fluid so that the second fluid may flow through the sealed cavity. 
     
     
         3 . The heat transfer system of  claim 2 , wherein a recess is formed within the cold plate, and the heat transfer device is inserted into the recess to form the sealed cavity. 
     
     
         4 . The heat transfer system of  claim 3 , wherein the recess has a raised lip running around its perimeter that interfaces with a central plate of the heat transfer device. 
     
     
         5 . The heat transfer system of  claim 2 , wherein the sealed cavity between the heat transfer device and the cold plate is sealed by adhesive bonding, brazing, welding, friction stir welding, an O-ring or other elastomer seal. 
     
     
         6 . The heat transfer system of  claim 2 , wherein the first surface comprises a top surface of the heat transfer device and top surface protrusions extending from the top surface into the electronic enclosure, and the second surface comprises a bottom surface of the heat transfer device and bottom surface protrusions extending from the bottom surface into the sealed cavity. 
     
     
         7 . The heat transfer system of  claim 6 , wherein the top surface protrusions have a geometry that is optimized for gas flow, and the bottom surface protrusions have a geometry that is optimized for liquid flow. 
     
     
         8 . The heat transfer system of  claim 6 , wherein the top surface protrusions have a stacked, fin-shaped geometry, and wherein heat pipes are integrated into the top surface protrusions. 
     
     
         9 . The heat transfer system of  claim 6 , wherein a channel passes through the top surface protrusions and connects to the sealed cavity formed between the heat transfer device and the cold plate such that the second fluid may flow through the sealed cavity and through the channel. 
     
     
         10 . A method for transferring heat within an electronic enclosure, the method comprising:
 providing an electronic enclosure housing at least one electronic component and including a volume for a first fluid;   providing a sealed cavity within the electronic enclosure configured to contain a second fluid that is physically separated from the first fluid; and   transferring heat from the first fluid to the second fluid using a heat transfer device, wherein the heat transfer device comprises a first surface configured to directly interface with the first fluid and a second surface configured to directly interface with the second fluid.   
     
     
         11 . The method of  claim 10 , further comprising:
 providing a cold plate within the electronic enclosure;   coupling the heat transfer device to the cold plate to form the sealed cavity between the heat transfer device and the cold plate; and   configuring the cold plate to provide the sealed cavity with access to the second fluid so that the second fluid may flow through the sealed cavity.   
     
     
         12 . The method of  claim 11 , further comprising:
 forming a recess is formed within the cold plate; and   inserting the heat transfer device into the recess to form the sealed cavity.   
     
     
         13 . The method of  claim 11 , further comprising:
 forming the sealed cavity between the heat transfer device and the cold plate by adhesive bonding, brazing, welding, friction stir welding, an O-ring or other elastomer seal.   
     
     
         14 . The method of  claim 11 , wherein the first surface comprises a top surface of the heat transfer device and top surface protrusions extending from the top surface into the electronic enclosure, and the second surface comprises a bottom surface of the heat transfer device and bottom surface protrusions extending from the bottom surface into the sealed cavity. 
     
     
         15 . The method of  claim 14 , further comprising:
 passing a channel through the top surface protrusions;   connecting the channel to the sealed cavity formed between the heat transfer device and the cold plate; and   flowing the second fluid through the sealed cavity and through the channel.   
     
     
         16 . A heat transfer device for cooling a first fluid contained within an enclosure housing at least one electronic component, the heat transfer device comprising:
 first means for directly interfacing with the first fluid; and   second means for directly interfacing with a second fluid that is physically separated from the first fluid, and for transferring heat from the first fluid to the second fluid,   wherein the heat transfer device is a single integrated piece.   
     
     
         17 . The heat transfer device of  claim 16 , wherein:
 the first means comprises a top surface of a central plate; and   the second means comprises a bottom surface of the central plate that is configured to couple to a cold plate and to form a sealed cavity between the bottom surface and the cold plate, the cold plate being configured to provide the sealed cavity with access to the second fluid so that the second fluid may flow through the sealed cavity.   
     
     
         18 . The heat transfer device of  claim 17 , further comprising top surface protrusions optimized for gas flow that extend from the top surface, and bottom surface protrusions optimized for liquid flow that extend from the bottom surface. 
     
     
         19 . The heat transfer device of  claim 18 , wherein the top surface protrusions have a stacked, fin-shaped geometry, and wherein heat pipes are integrated into the top surface protrusions. 
     
     
         20 . The heat transfer device of  claim 18 , wherein a channel passes through the top surface protrusions and connects to the sealed cavity formed between the heat transfer device and the cold plate such that the second fluid may flow through the sealed cavity and through the channel.