Clip based speaker retention to a mounting surface

Abstract

The technology disclosed herein enables retention of an audio component on a mounting surface using a clip and a flange. In a particular embodiment, an apparatus includes a mounting surface including a flange. The flange is substantially cylindrical and includes a first portion for positioning a frame of an audio component therein under a retaining rim of the flange. The rim includes a second portion of the flange with a smaller inner diameter than the first portion of the flange. When the frame is positioned in the first portion of the flange, a clip positioned in the first portion of the flange between the frame and the retaining rim of the flange retains the audio component within the flange. Manipulating the shape of the clip allows the clip to fit through the retaining rim and into the first portion of the flange.

What is claimed is: 
     
         1 . An apparatus comprising:
 a mounting surface comprising a flange;   wherein the flange includes a first portion for positioning a frame of an audio component therein under a retaining rim of the flange comprising a second portion of the flange with a smaller inner diameter than the first portion of the flange;   wherein the flange is substantially cylindrical;   wherein, when the frame is positioned in the first portion of the flange, a clip positioned in the first portion of the flange between the frame and the retaining rim of the flange retains the audio component within the flange; and   wherein manipulating the shape of the clip allows the clip to fit through the retaining rim and into the first portion of the flange.   
     
     
         2 . The apparatus of  claim 1 , wherein the clip includes a gap in a perimeter of the clip. 
     
     
         3 . The apparatus of  claim 2 , wherein, on each side of the gap, the clip includes a tool grip point corresponding to a tool for positioning the clip. 
     
     
         4 . The apparatus of  claim 1 , wherein, when the frame is position in the first portion of the flange, at least one vibration dampening element positioned in the first portion of the flange isolates the audio component from the mounting surface and the clip. 
     
     
         5 . The apparatus of  claim 4 , wherein the at least one vibration dampening element is of similar shape to the frame. 
     
     
         6 . The apparatus of  claim 1 , wherein the audio component faces the mounting surface. 
     
     
         7 . The apparatus of  claim 6 , wherein the mounting surface includes at least one opening through which sound passes. 
     
     
         8 . The apparatus of  claim 1 , wherein the audio component faces away from the mounting surface and an opening in the mounting surface allows portions of the audio component, other than the frame, to pass through the mounting surface. 
     
     
         9 . The apparatus of  claim 1 , comprising:
 a device that uses the audio component, wherein the device includes the mounting surface.   
     
     
         10 . The apparatus of  claim 1 , wherein the audio component comprises a microphone. 
     
     
         11 . A method for retaining an audio component to a mounting surface, comprising:
 positioning a frame of an audio component into a first portion of a flange of a mounting surface.   wherein the frame is positioned under a retaining rim of the flange comprising a second portion of the flange with a smaller inner diameter than the first portion of the flange;   wherein the flange is substantially cylindrical;   wherein, when the frame is positioned in the first portion of the flange, a clip positioned in the first portion of the flange between the frame and the retaining rim of the flange retains the audio component within the flange; and   wherein manipulating the shape of the clip allows the clip to fit through the retaining rim and into the first portion of the flange.   
     
     
         12 . The method of  claim 11 , wherein the clip includes a gap in a perimeter of the clip. 
     
     
         13 . The method of  claim 12 , wherein manipulating the shape of the clip comprises:
 squeezing the clip to reduce a size of the gap such that the clip fits through the rim and into the first portion of the flange; and   releasing the clip once the clip is in the first portion of the flange.   
     
     
         14 . The method of  claim 13 , wherein manipulating the shape of the clip comprises:
 gripping the clip on each side of the gap using a positioning tool gripping onto grip points on each side of the gap.   
     
     
         15 . The method of  claim 11 , wherein, when the frame is position in the first portion of the flange, at least one vibration dampening element positioned in the first portion of the flange isolates the audio component from the mounting surface and the clip. 
     
     
         16 . The method of  claim 15 , wherein the at least one vibration dampening element is of similar shape to the frame. 
     
     
         17 . The method of  claim 11 , wherein the audio component faces the mounting surface. 
     
     
         18 . The method of  claim 17 , wherein the mounting surface includes at least one opening through which sound passes. 
     
     
         19 . The method of  claim 11 , wherein the audio component faces away from the mounting surface and an opening in the mounting surface allows portions of the audio component, other than the frame, to pass through the mounting surface. 
     
     
         20 . The method of  claim 11 , wherein the mounting surface is included in a device that uses the audio component.