Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus

Abstract

A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

What is claimed is: 
     
         1 . A device comprising:
 a silicon substrate including a first face and a second face on a side opposite to the first face;   a first electrode formed on the first face of the silicon substrate;   a second electrode formed on the first face of the silicon substrate;   an integrated circuit being electrically connected to the first electrode and the second electrode;   a rear face electrode formed on the second face of the silicon substrate;   a groove portion formed in the silicon substrate;   an insulating film formed on side walls of the groove portion;   a conductive portion formed inside the groove portion on the insulating portion, the conductive portion being electrically connected to the second electrode and the rear face electrode;   a second silicon substrate including a second silicon substrate first face and a second silicon substrate second face on a side opposite to the second semiconductor first face; and   an electronic element formed on the first face of the second silicon substrate, the electronic element being electrically connected to the rear face electrode;   wherein the integrated circuit is configured to apply a voltage to the electronic element via the second electrode and conductive portion; and   wherein the first electrode, the integrated circuit, the second electrode, the conductive portion, the rear face electrode and the electronic element are electrically connected in that order.