Wafer-holding device and deposition equipment using the same

Abstract

The present disclosure provides a wafer-holding device and a deposition equipment using the same, wherein the wafer-holding device includes a carrier, a first-lid ring and a second-lid ring. The carrier has a carrying surface for carrying a wafer thereon, and includes a first aligner disposed to enclose the carrying surface. The second-lid ring is connected to the first-lid ring, and includes a second aligner. The first-lid ring has a circumference larger than that of the second-lid ring, for carrying the second-lid ring thereon. The carrier is movable, and when the carrier carries the wafer thereon toward the lid rings, the first aligner thereon contacts, engages with the second aligner of the second-lid ring, thereby the second aligner is positioned to contact a specific area of the wafer and hold the wafer on the carrier, for the deposition equipment to perform a thin-film-deposition process to the wafer.

We claim: 
     
         1 . A wafer-holding device, comprising:
 a carrier for carrying at least one wafer and comprising at least one first aligner and a carrying surface for carrying the at least one wafer, wherein the at least one first aligner encloses a periphery of the carrying surface;   a first-lid ring positioned above the carrier; and   a second-lid ring connected to the first-lid ring and comprising a second aligner that corresponds to the at least one first aligner, wherein the first-lid ring has a circumference larger than that of the second-lid ring; the first-lid ring is for carrying the second-lid ring; and when the carrier moves toward the second-lid ring, the second-lid ring contacts the at least one wafer, the second aligner of the second-lid ring engages with the at least one first aligner of the carrier, hence the second-lid ring is aligned with the carrier.   
     
     
         2 . The wafer-holding device according to  claim 1 , wherein the first-lid ring comprises a first opening; and the second-lid ring protrudes radially-inward from the first-lid ring to partially cover the first opening. 
     
     
         3 . The wafer-holding device according to  claim 1 , further comprising:
 a carrying member disposed on the carrier and below the at least one wafer, wherein the carrying member comprises a first-carrying portion formed with a gap notch, and a second-carrying portion disposed within the gap notch; and   at least one elevating unit connected to the first-carrying portion of the carrying member for moving the first-carrying portion and the at least one wafer related to the carrier, wherein when the at least one elevating unit moves the first-carrying portion away from the carrier, the first-carrying portion carries the at least one wafer away from the carrying surface of the carrier.   
     
     
         4 . The wafer-holding device according to  claim 1 , wherein the at least one first aligner is a cavity formed with an inclined wall; and the second aligner is a protrusion formed with an inclined surface corresponding to the inclined wall of the at least one first aligner, for aligning the second-lid ring with the carrier. 
     
     
         5 . The wafer-holding device according to  claim 1 , wherein the first-lid ring comprises at least one third aligner; the second-lid ring comprises at least one fourth aligner; the second aligner and the at least one fourth aligner are disposed on a bottom surface of the second-lid ring, in a manner that the at least one fourth aligner is positioned radially-outer than the second aligner; and the second-lid ring is connected to the first-lid ring in a manner that the at least one fourth aligner engages with the at least one third aligner. 
     
     
         6 . The wafer-holding device according to  claim 5 , wherein the at least one third aligner of the first-lid ring comprises a cavity, and a protrusion between the cavity of the at least one third aligner and the at least one first aligner of the carrier; the at least one fourth aligner of the second-lid ring comprises a protrusion, and a cavity between the protrusion of the at least one fourth aligner and the second aligner; and the at least one third aligner and the at least one fourth aligner are for guiding and positioning the second-lid ring on the first-lid ring. 
     
     
         7 . The wafer-holding device according to  claim 5 , further comprising a ring member that is connected to the carrier and that encloses the periphery of the carrying surface of the carrier, wherein the first-lid ring comprises at least one fifth aligner; the ring member comprises at least one sixth aligner; and when ring member moves with the carrier to contact the first-lid ring, the at least one fifth aligner engages with the at least one sixth aligner, such that to align the ring member with the first-lid ring. 
     
     
         8 . The wafer-holding device according to  claim 7 , wherein the at least one fifth aligner of the first-lid ring is an annular protrusion formed with an inclined surface; the at least one sixth aligner of the ring member is an annular cavity formed with an inclined wall corresponding to the inclined surface of the at least one fifth aligner; and the ring member is guided to align with the first-lid ring by the inclined wall of the at least one sixth aligner and the inclined surface of the at least one fifth aligner. 
     
     
         9 . The wafer-holding device according to  claim 1 , wherein the at least one first aligner of the carrier is a cavity formed with an inclined wall; the second aligner the second-lid ring is a protrusion formed with an inclined surface corresponding to the inclined wall of the at least one first aligner; and the second-lid ring is aligned with the carrier in a manner that the second aligner the second-lid ring is guided by and enters the at least one first aligner. 
     
     
         10 . A deposition equipment, comprising:
 a chamber comprising a containing space;   at least one blocking member disposed within the containing space of the chamber, wherein the at least one blocking member has an end that is formed with an opening and that has an inner flange formed at the opening;   a wafer-holding device comprising:
 a carrier that comprises at least one first aligner and a carrying surface for carrying at least one wafer, wherein the at least one first aligner encloses a periphery of the carrying surface; 
 a first-lid ring that is disposed on the inner flange; and 
 a second-lid ring that is connected to the first-lid ring and that comprises a second aligner that corresponds to the at least one first aligner, wherein the first-lid ring has a circumference larger than that of the second-lid ring; the first-lid ring is for carrying the second-lid ring; and 
   a support member connected to the carrier for moving the carrier related to the at least one blocking member, wherein when the support member moves the carrier toward the at least one blocking member, the second-lid ring contacts the at least one wafer on the carrier, the second aligner of the second-lid ring engages with the at least one first aligner of the carrier, hence the second-lid ring is aligned with the carrier.   
     
     
         11 . The deposition equipment according to  claim 10 , wherein the first-lid ring comprises a first opening; and the second-lid ring protrudes radially-inward from the first-lid ring to partially cover the first opening. 
     
     
         12 . The deposition equipment according to  claim 10 , further comprising:
 a carrying member disposed on the carrier and below the at least one wafer, wherein the carrying member comprises a first-carrying portion formed with a gap notch, and a second-carrying portion disposed within the gap notch, and wherein the chamber comprises a wafer passage facing the gap notch; and   at least one elevating unit connected to the first-carrying portion of the carrying member for moving the first-carrying portion and the at least one wafer related to the carrier, wherein when the at least one elevating unit moves the first-carrying portion away from the carrier, the first-carrying portion carries the at least one wafer away from the carrying surface of the carrier.   
     
     
         13 . The deposition equipment according to  claim 12 , wherein the at least one first aligner is a cavity formed with an inclined wall; and the second aligner is a protrusion formed with an inclined surface corresponding to the inclined wall of the at least one first aligner, for aligning the second-lid ring with the carrier. 
     
     
         14 . The deposition equipment according to  claim 10 , wherein the first-lid ring comprises at least one third aligner; the second-lid ring comprises at least one fourth aligner; the second aligner and the at least one fourth aligner are disposed on a bottom surface of the second-lid ring, in a manner that the at least one fourth aligner is positioned radially-outer than the second aligner; and the second-lid ring is connected to the first-lid ring in a manner that the at least one fourth aligner engages with the at least one third aligner. 
     
     
         15 . The deposition equipment according to  claim 14 , wherein the at least one third aligner of the first-lid ring comprises a cavity, and a protrusion between the cavity of the at least one third aligner and the at least one first aligner of the carrier; the at least one fourth aligner of the second-lid ring comprises a protrusion, and a cavity between the protrusion of the at least one fourth aligner and the second aligner; and the at least one third aligner and the at least one fourth aligner are for guiding and positioning the second-lid ring on the first-lid ring. 
     
     
         16 . The deposition equipment according to  claim 14 , further comprising a ring member that is connected to the carrier and that encloses the periphery of the carrying surface of the carrier, wherein the first-lid ring comprises at least one fifth aligner; the ring member comprises at least one sixth aligner; and when ring member moves with the carrier to contact the first-lid ring, the at least one fifth aligner engages with the at least one sixth aligner, such that to align the ring member with the first-lid ring. 
     
     
         17 . The deposition equipment according to  claim 16 , wherein the at least one fifth aligner of the first-lid ring is an annular protrusion formed with an inclined surface; the at least one sixth aligner of the ring member is an annular cavity formed with an inclined wall corresponding to the inclined surface of the at least one fifth aligner; and the ring member is guided to align with the first-lid ring by the inclined wall of the at least one sixth aligner and the inclined surface of the at least one fifth aligner. 
     
     
         18 . The deposition equipment according to  claim 16 , wherein the first-lid ring comprises a lid rim positioned radially-outer than the at least one fifth aligner; and the inner flange of the at least one blocking member is positioned between the lid rim and the at least one fifth aligner for carrying the first-lid ring. 
     
     
         19 . The deposition equipment according to  claim 10 , wherein the at least one first aligner of the carrier is a cavity formed with an inclined wall; the second aligner the second-lid ring is a protrusion formed with an inclined surface corresponding to the inclined wall of the at least one first aligner; and the second-lid ring is aligned with the carrier in a manner that the second aligner the second-lid ring is guided by and enters the at least one first aligner. 
     
     
         20 . The deposition equipment according to  claim 11 , further comprising a target material disposed within the containing space of the chamber and facing the carrier or the at least one wafer thereon.