Inventor · disambiguated record
Jing-Cheng Lin
Also filed as: LIN JING · LIN JING CHENG
550 granted patents·73 pending applications·12,513 citations·filing 2000–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD333TAIWAN SEMICONDUCTOR MFG94SKY TECH INC54LIN JING-CHENG35SAMSUNG ELECTRONICS CO LTD30
Top patents by PatentIndex Score
623 records- 0199US11488843B2Underfill between a first package and a second packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 1, 2022·6 cites·20 claims
- 0299US11417580B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·9 cites·20 claims
- 0399US10510634B2Package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·58 cites·20 claims
- 0499US10170341B1Release film as isolation film in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 1, 2019·37 cites·20 claims
- 0599US10153222B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·79 cites·20 claims
- 0699US9929050B2Mechanisms for forming three-dimensional integrated circuit (3DIC) stacking structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 27, 2018·219 cites·18 claims
- 0799US9443783B23DIC stacking device and method of manufactureLIN JING-CHENG·Filed 2012·Granted Sep 13, 2016·891 cites·20 claims
- 0899US9048222B2Method of fabricating interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 2, 2015·1.1k cites·20 claims
- 0999US8877554B2Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 4, 2014·621 cites·20 claims
- 1099US8860229B1Hybrid bonding with through substrate via (TSV)TAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 14, 2014·72 cites·20 claims
- 1199US8829676B2Interconnect structure for wafer level packageYU CHEN-HUA·Filed 2011·Granted Sep 9, 2014·610 cites·20 claims
- 1299US8785299B2Package with a fan-out structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 22, 2014·583 cites·19 claims
- 1399US8703542B2Wafer-level packaging mechanismsLIN JING-CHENG·Filed 2012·Granted Apr 22, 2014·584 cites·20 claims
- 1499US8361842B2Embedded wafer-level bonding approachesTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 29, 2013·628 cites·14 claims
- 1598US11935866B2Semiconductor device having reduced bump height variationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 19, 2024·4 cites·20 claims
- 1698US11891695B2Vibrating deposition deviceSKY TECH INC·Filed 2022·Granted Feb 6, 2024·3 cites·20 claims
- 1798US11532469B1Shielding device and thin-film-deposition equipment with the sameSKY TECH INC·Filed 2021·Granted Dec 20, 2022·8 cites·20 claims
- 1898US11482403B1Thin-film-deposition equipment for detecting shielding mechanismSKY TECH INC·Filed 2021·Granted Oct 25, 2022·6 cites·20 claims
- 1998US11443957B2Metal oxide layered structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·4 cites·20 claims
- 2098US10867965B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·23 cites·20 claims
- 2198US10529690B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 7, 2020·35 cites·20 claims
- 2298US9842826B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 12, 2017·20 cites·20 claims
- 2398US9460987B2Interconnect structure for package-on-package devices and a method of fabricatingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·22 cites·20 claims
- 2498US9391041B2Fan-out wafer level package structureTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 12, 2016·37 cites·19 claims
- 2598US9378982B2Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 28, 2016·45 cites·20 claims
- 2698US9111914B2Fan out package, semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 18, 2015·40 cites·20 claims
- 2798US9087821B2Hybrid bonding with through substrate via (TSV)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 21, 2015·41 cites·20 claims
- 2898US9064879B2Packaging methods and structures using a die attach filmHUNG JUI-PIN·Filed 2011·Granted Jun 23, 2015·836 cites·20 claims
- 2998US9000584B2Packaged semiconductor device with a molding compound and a method of forming the sameLIN JING-CHENG·Filed 2011·Granted Apr 7, 2015·1k cites·20 claims
- 3098US8952544B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 10, 2015·42 cites·17 claims
- 3198US8803316B2TSV structures and methods for forming the sameLIN YUNG-CHI·Filed 2011·Granted Aug 12, 2014·381 cites·20 claims
- 3298US8778738B1Packaged semiconductor devices and packaging devices and methodsTAIWAN SEMICONDUCTOR MANFACTURING COMPANY LTD·Filed 2013·Granted Jul 15, 2014·615 cites·20 claims
- 3398US8779599B2Packages including active dies and dummy dies and methods for forming the sameLIN JING-CHENG·Filed 2011·Granted Jul 15, 2014·48 cites·14 claims
- 3498US8643148B2Chip-on-Wafer structures and methods for forming the sameLIN JING-CHENG·Filed 2012·Granted Feb 4, 2014·116 cites·19 claims
- 3598US8426961B2Embedded 3D interposer structureSHIH YING-CHING·Filed 2010·Granted Apr 23, 2013·188 cites·21 claims
- 3698US8411459B2Interposer-on-glass package structuresYU CHEN-HUA·Filed 2010·Granted Apr 2, 2013·51 cites·13 claims
- 3798US8105875B1Approach for bonding dies onto interposersHU HSIEN-PIN·Filed 2010·Granted Jan 31, 2012·192 cites·13 claims
- 3897US12266612B2Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·2 cites·20 claims
- 3997US11767591B2Detachable atomic layer deposition apparatus for powdersSKY TECH INC·Filed 2021·Granted Sep 26, 2023·8 cites·8 claims
- 4097US11527391B1Position-detectable shielding device and thin-film-deposition equipment with the sameSKY TECH INC·Filed 2021·Granted Dec 13, 2022·6 cites·20 claims
- 4197US11476101B1Double-layer shielding device and thin-film-deposition equipment with the sameSKY TECH INC·Filed 2021·Granted Oct 18, 2022·6 cites·20 claims
- 4297US11251071B2Raised via for terminal connections on different planesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
- 4397US10461069B2Hybrid bonding with through substrate via (TSV)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·14 cites·20 claims
- 4497US10153175B2Metal oxide layered structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 11, 2018·14 cites·20 claims
- 4597US10109613B23DIC stacking device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 23, 2018·17 cites·20 claims
- 4697US9922903B2Interconnect structure for package-on-package devices and a method of fabricatingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·12 cites·20 claims
- 4797US9831224B2Solution for reducing poor contact in info packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 28, 2017·17 cites·20 claims
- 4897US9570421B2Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 14, 2017·27 cites·20 claims
- 4997US9461018B1Fan-out PoP structure with inconsecutive polymer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·671 cites·20 claims
- 5097US9425121B2Integrated fan-out structure with guiding trenches in buffer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 23, 2016·25 cites·20 claims
Showing the top 50 of 623 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →