Cleaning formulation for removing residues on surfaces

Abstract

This disclosure relates to a cleaning composition that contains 1) hydroxylamine; 2) alkanolamine; 3) an alkylene glycol; 4) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.

What is claimed is: 
     
         1 . A cleaning composition, comprising:
 1) hydroxylamine in an amount of from about 0.5% to about 20% by weight of the composition;   2) an alkanolamine in an amount of at most about 3% by weight of the composition;   3) an alkylene glycol in an amount of at most about 30% by weight of the composition; and   4) water in an amount of at most about 90% by weight of the composition;   wherein the pH of the composition is from about 7 to about 11 and the composition is non-corrosive.   
     
     
         2 . The composition of  claim 1 , wherein the hydroxylamine is in an amount of from about 5% to about 15% by weight of the composition. 
     
     
         3 . The composition of  claim 1 , wherein the alkanolamine is in an amount of at most about 2.5% by weight of the composition. 
     
     
         4 . The composition of  claim 1 , wherein the alkanolamine is in an amount of at most about 1.5% by weight of the composition. 
     
     
         5 . The composition of  claim 1 , wherein the alkanolamine is in an amount of at least about 0.1% by weight of the composition. 
     
     
         6 . The composition of  claim 1 , wherein the alkylene glycol is in an amount of at most about 20% by weight of the composition. 
     
     
         7 . The composition of  claim 1 , wherein the alkylene glycol is in an amount of at least about 1% by weight of the composition. 
     
     
         8 . The composition of  claim 1 , wherein the composition further comprises a metal corrosion inhibitor. 
     
     
         9 . The composition of  claim 8 , wherein the metal corrosion inhibitor comprises a substituted or unsubstituted benzotriazole. 
     
     
         10 . The composition of  claim 9 , wherein the benzotriazole is in an amount of from about 0.05% to about 1% by weight of the composition. 
     
     
         11 . The composition of  claim 1 , wherein the composition comprises a chelating agent. 
     
     
         12 . The composition of  claim 2 , wherein the alkanolamine is in an amount of at most about 2.5% by weight of the composition. 
     
     
         13 . The composition of  claim 12 , wherein the alkanolamine is in an amount of at most about 1.5% by weight of the composition. 
     
     
         14 . The composition of  claim 13 , wherein the alkanolamine is in an amount of at least about 0.1% by weight of the composition. 
     
     
         15 . The composition of  claim 14 , wherein the alkylene glycol is in an amount of at most about 20% by weight of the composition. 
     
     
         16 . The composition of  claim 14 , wherein the alkylene glycol is in an amount of at least about 1% by weight of the composition. 
     
     
         17 . The composition of  claim 16 , wherein the composition further comprises a metal corrosion inhibitor. 
     
     
         18 . The composition of  claim 17 , wherein the metal corrosion inhibitor comprises a substituted or unsubstituted benzotriazole. 
     
     
         19 . The composition of  claim 18 , wherein the benzotriazole is in an amount of from about 0.05% to about 1% by weight of the composition. 
     
     
         20 . The composition of  claim 17 , wherein the composition comprises a chelating agent.