Assembly of flexible and integrated module packages with leadframes

Abstract

Described is a packaged component having a first surface and an opposite second surface. The packaged component may comprise a first element a second element, and a third element. The first element may have a first surface and an opposite second surface. The second element may have a first surface and an opposite second surface. The third element may electrically connect a portion of the first element to a portion of the second element. The second surface of the first element may be adjacent to the second surface of the packaged component, and the second surface of the second element may be adjacent to the second surface of the packaged component.

We claim: 
     
         1 . A method for forming a packaged component, the packaged component having a first surface and an opposite second surface, the method comprising:
 providing a first element, wherein the first element includes a first surface and an opposite second surface;   placing the second surface, of the first element, adjacent to the second surface of the packaged component;   providing a second element, wherein the second element includes a first surface and an opposite second surface;   placing the second surface, of the second element, adjacent to the second surface of the packaged component; and   electrically connecting, via a third element, a portion of the first element to a portion of the second element.   
     
     
         2 . The method of  claim 1  comprising:
 covering portions of the first element, the second element, and the third element with an encapsulation. 
 
     
     
         3 . The method of  claim 1  comprising:
 mounting a fourth element on the first surface of the second element; and 
 electrically connecting the fourth element to one or more portions of the first surface of the second element. 
 
     
     
         4 . The method of  claim 3 , wherein electrically connecting the fourth element comprises connecting face-to-face the second element with the fourth element. 
     
     
         5 . The method of  claim 3 , wherein the first element comprises a portion of a lead-frame, wherein the lead-frame is part of a lead-frame panel which includes a plurality of pockets, wherein most of a peripheral region of an individual pocket includes a plurality of leads that extend from the lead-frame panel towards the individual pocket. 
     
     
         6 . The method of  claim 5  comprising:
 applying an adhesive between a bottom surface of the lead-frame panel and a carrier. 
 
     
     
         7 . The method of  claim 5  comprising:
 connecting the second element to at least one lead of the plurality of leads via a bonding wire; and 
 encapsulating the bonding wire in a molding compound such that a top surface of the fourth element is free from the molding compound. 
 
     
     
         8 . The method of  claim 1 , wherein the second element comprises a semiconductor base chip. 
     
     
         9 . The method of  claim 1 , wherein the second element comprises a programmable interposer which includes an integrated circuit. 
     
     
         10 . The method of  claim 1 , wherein the second surface of the first element and the second surface of the second element are substantially co-planar. 
     
     
         11 . A method comprising:
 forming a lead-frame panel;   attaching the lead-frame panel to a carrier;   applying an adhesive to the carrier;   attaching a base die to the adhesive;   bonding a wire to a lead of the lead-frame panel and/or to pads of the base die;   building a package body with an open cavity such that the base die has an exposed surface;   encapsulating the lead of the base die with a molding compound;   attaching one or more integrated circuit components and/or passive devices to the base die; and   encapsulating the one or more integrated circuit components and/or passive devices, and areas around the open cavity to form a packaged module.   
     
     
         12 . The method of  claim 11  comprising:
 removing the carrier and the adhesive. 
 
     
     
         13 . The method of  claim 12  comprising:
 testing the packaged module. 
 
     
     
         14 . The method of  claim 11 , wherein the base die includes a programmable interposer which includes an integrated circuit. 
     
     
         15 . The method of  claim 11 , wherein the lead-frame panel which includes a plurality of pockets, wherein most of a peripheral region of an individual pocket includes a plurality of leads that extend from the lead-frame panel towards the individual pocket. 
     
     
         16 . A method for forming a packaged component, the packaged component having a first surface and an opposite second surface, the method comprising:
 providing a first electrically-conductive element having a first surface and an opposite second surface;   providing a semiconductor element having the first surface and an opposite second surface; and   providing a second electrically-conductive element connecting the first electrically-conductive element to the semiconductor element, wherein the second surface of the first electrically-conductive element and the second surface of the semiconductor element are substantially co-planar.   
     
     
         17 . The method of  claim 16 , wherein the semiconductor element is a first semiconductor element, wherein the method comprising:
 mounting a second semiconductor element on the first surface of the first semiconductor element; and   electrically connecting the second semiconductor element to one or more portions of the first surface of the first semiconductor element.   
     
     
         18 . The method of  claim 16  comprising:
 covering portion of the first electrically-conductive element, the semiconductor element, and the second electrically-conductive element with an encapsulating element. 
 
     
     
         19 . The method of  claim 16 , wherein the first electrically-conductive element comprises a portion of a lead-frame, wherein the lead-frame is part of a lead-frame panel which includes a plurality of pockets, wherein most of a peripheral region of an individual pocket includes a plurality of leads that extend from the lead-frame panel towards the individual pocket. 
     
     
         20 . The method of  claim 16 , wherein a first distance from the second surface of the first electrically-conductive element to the first surface of the first electrically-conductive element is greater than or equal to a second distance from a plane through the second surface of the first electrically-conductive element to a plane through the second surface of the semiconductor element, wherein the first distance is measured in a direction normal to the first surface of the first electrically-conductive element to the second surface of the first electrically-conductive element.