Assignee
SHENZHEN CHIPULLER CHIP TECH CO LTD
CN·10 granted patents·3 pending applications·1 citations·filing 2017–2022
Top patents by PatentIndex Score
13 records- 0168US11995387B2Over-the-air hardware updateSHENZHEN CHIPULLER CHIP TECH CO LTD·Filed 2022·Granted May 28, 2024·0 cites·13 claims
- 0268US11728909B2Method and apparatus to use active semiconductor interposers for RF signal chain in modular stacked integrated circuitsSHENZHEN CHIPULLER CHIP TECH CO LTD·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 0365US11418196B2Method and apparatus for dynamic routing using heterogeneous and disjoint networksSHENZHEN CHIPULLER CHIP TECH CO LTD·Filed 2018·Granted Aug 16, 2022·1 cites·25 claims
- 0464US11720729B2Methods for automated hardware system synthesisSHENZHEN CHIPULLER CHIP TECH CO LTD·Filed 2022·Granted Aug 8, 2023·0 cites·20 claims
- 0562US11329734B2Method and apparatus to use active semiconductor interposers for RF signal chain in modular stacked integrated circuitsSHENZHEN CHIPULLER CHIP TECH CO LTD·Filed 2020·Granted May 10, 2022·0 cites·20 claims
- 0661US2022319967A1Assembly of flexible and integrated module packages with leadframesSHENZHEN CHIPULLER CHIP TECH CO LTD·Filed 2022·Application pending·0 cites
- 0760US11947972B2Coordinating power transitions between a smart interconnect and heterogeneous componentsSHENZHEN CHIPULLER CHIP TECH CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·10 claims
- 0859US11379642B2Methods for automated hardware system synthesisSHENZHEN CHIPULLER CHIP TECH CO LTD·Filed 2020·Granted Jul 5, 2022·0 cites·19 claims
- 0956US2023124949A1True power shedding apparatus and method to reduce power consumptionSHENZHEN CHIPULLER CHIP TECH CO LTD·Filed 2022·Application pending·0 cites
- 1055US11573623B2True power sheddingSHENZHEN CHIPULLER CHIP TECH CO LTD·Filed 2021·Granted Feb 7, 2023·0 cites·20 claims
- 1153US11361138B2Over-the-air hardware updateSHENZHEN CHIPULLER CHIP TECH CO LTD·Filed 2017·Granted Jun 14, 2022·0 cites·23 claims
- 1253US2022329245A1Method and apparatus for dynamic routing using heterogeneous and disjoint networksSHENZHEN CHIPULLER CHIP TECH CO LTD·Filed 2022·Application pending·0 cites
- 1349US11476182B2Assembly of flexible and integrated module packages with leadframesSHENZHEN CHIPULLER CHIP TECH CO LTD·Filed 2018·Granted Oct 18, 2022·0 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →