Multi stack optical elements using temporary and permanent bonding
Abstract
Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.
Claims
exact text as granted — not AI-modifiedWhat is claimed:
1 . An optical element layer stack comprising:
a substrate having a first side and a second side, comprising one of a CCD, a CMOS, a VCSEL, an LED, an OLED, and a uLED component; and a first layer formed on the first side of the substrate, comprising a plurality of islands each spaced at intervals from one another and comprised of optical element layers.
2 . The optical element layer stack of claim 1 , further comprising a second layer formed on the second side of the substrate, the second layer comprising a plurality of islands each spaced at intervals from one another and comprised of optical element layers.
3 . The optical element layer stack of claim 1 , wherein each of the plurality of islands comprises a cross-sectional dimension selected from the group consisting of a polygonal geometry, a rounded geometry, a tapered geometry, or combinations thereof.
4 . The optical element layer stack of claim 1 , wherein each of the plurality of islands is aligned in one or more rows, each row along one or more horizontal axis extending across and parallel to the second layer, wherein each of the one or more rows of the plurality of islands is parallel to one another.
5 . The optical element layer stack of claim 1 , wherein the plurality of islands comprise an arrangement selected from the group consisting of an ordered array, a random array, a patterned array, or combinations thereof.
6 . The optical element layer stack of claim 2 , wherein the second layer is in alignment with the first layer.
7 . The optical element layer stack of claim 2 , further comprising a third layer formed on the first layer, the third layer comprising a plurality of islands each spaced at intervals from one another and comprised of optical element layers.
8 . The optical element layer stack of claim 7 , further comprising a fourth layer formed on the third layer, the fourth layer comprising a plurality of islands each spaced at intervals from one another and comprised of optical element layers.
9 . The optical element layer stack of claim 8 , further comprising a fifth layer formed on the second layer, the fifth layer comprising a plurality of islands each spaced at intervals from one another and comprised of optical element layers.
10 . The optical element layer stack of claim 9 , further comprising a sixth layer formed on the fifth layer, the sixth layer comprising a plurality of islands each spaced at intervals from one another and comprised of optical element layers.
11 . An optical element layer stack comprising:
a substrate having a first side, comprising one of a CCD, a CMOS, a VCSEL, an LED, an OLED, and a uLED component; a first layer formed on the first side of the substrate, comprising a first plurality of islands each spaced at intervals from one another and comprised of optical element layers; and a second layer formed on the first layer, comprising a second plurality of islands each spaced at intervals from one another and comprised of optical element layers.
12 . The optical element layer stack of claim 11 , wherein each of the islands in the first and second plurality of islands comprises a cross-sectional dimension selected from the group consisting of a polygonal geometry, a rounded geometry, a tapered geometry, or combinations thereof.
13 . The optical element layer stack of claim 11 , wherein the second layer is in alignment with the first layer.
14 . The optical element layer stack of claim 11 , wherein each of the first and second plurality of islands comprises an arrangement selected from the group consisting of an ordered array, a random array, a patterned array, or combinations thereof.
15 . The optical element layer stack of claim 11 , further comprising a third layer formed on the second layer, the third layer comprising a plurality of spaced apart islands comprised of optical element layers.
16 . The optical element layer stack of claim 15 , further comprising a third layer formed on the second layer, the third layer comprising a plurality of spaced apart islands comprised of optical element layers.
17 . An optical element layer stack comprising:
a substrate having a first side and a second side, comprising one of a CCD, a CMOS, a VCSEL, an LED, an OLED, and a uLED component; a first layer formed on the first side of the substrate, comprising a plurality of islands comprised of optical element layers, the islands separated by trenches.
18 . The optical element layer stack of claim 17 further comprising a second layer formed on the second side of the first substrate comprising a plurality of islands comprised of optical element layers, the islands separated by trenches.
19 . The optical element layer stack of claim 18 further comprising a third layer comprising a plurality of islands of optical element layers separated by trenches, formed on the first layer.
20 . The optical element layer stack of claim 19 further comprising a fourth layer comprising a plurality of islands of optical element layers separated by trenches, formed on the third layer.Join the waitlist — get patent alerts
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