Electronic device comprising an electronic chip mounted on top of a support substrate

Abstract

A support substrate has a mounting face with a metal heat transfer layer. Holes are provided to extend at least partially through the metal heat transfer layer. Metal heat transfer elements are disposed in the holes of the metal heat transfer layer of the support substrate. An electronic integrated circuit (IC) chip has a rear face that is fixed to the mounting face of the support substrate via a layer of adhesive material. The metal heat transfer elements disposed in the holes of the metal layer of the support substrate extend to protrude, relative to the mounting face of the support substrate, into the layer of adhesive material.

1 . A method for fabricating an electronic device, comprising:
 producing a metal heat transfer layer at a mounting face of a support substrate;   forming holes in the metal heat transfer layer;   placing metal heat transfer elements in the holes of the metal heat transfer layer, the metal heat transfer elements extending to protrude above the mounting face of the support substrate;   performing a brazing heat treatment to secure the metal heat transfer elements in the holes of the metal heat transfer layer;   depositing a layer of adhesive material on top of the mounting face of the support substrate, wherein protruding parts of the metal heat transfer elements extend to protrude, relative to the mounting face of the support substrate, to be embedded within the layer of adhesive material; and   placing an electronic integrated circuit (IC) chip on top of the layer of adhesive material so as to fix the IC chip on top of the support substrate.   
     
     
         2 . The method according to  claim 1 , further comprising placing electrical connection wires between the IC chip and the support substrate. 
     
     
         3 . The method according to  claim 1 , further comprising producing an encapsulation block on top of the support substrate, in which the IC chip is embedded. 
     
     
         4 . The method according to  claim 1 , wherein surfaces of said protruding parts of the metal heat transfer elements are spaced by a distance from a rear face of the IC chip. 
     
     
         5 . The method according to  claim 1 , wherein an upper surface of the metal heat transfer layer is coplanar with the mounting face of the support substrate. 
     
     
         6 . The method according to  claim 1 , wherein the holes extend completely through the metal heat transfer layer. 
     
     
         7 . The method according to  claim 1 , wherein the adhesive material is glue. 
     
     
         8 . A method for fabricating an electronic device, comprising:
 obtaining a support substrate having a facing mounting face and including a metal heat transfer layer on the facing mounting face;   producing holes in the metal heat transfer layer;   placing metal heat transfer elements in the holes of the metal heat transfer layer;   wherein said metal heat transfer elements protrude above the facing mounting face of the support substrate;   heat treating the metal heat transfer elements in the holes of the metal heat transfer layer   depositing a layer of glue over the facing mounting face of the support substrate;   wherein said layer of glue embeds parts of the heat transfer elements which protrude above to the facing mounting face;   placing an electronic integrated circuit chip over the embedded parts of the heat transfer elements;   wherein said electronic integrated circuit chip is in contact with said layer of glue so as to affix the electronic integrated circuit chip to the support substrate.   
     
     
         9 . The method of  claim 8 , wherein heat treating comprises performing a brazing heat treatment of the metal heat transfer elements in the holes of the metal heat transfer layer; 
     
     
         10 . The method of  claim 8 , further comprising, after placing the electronic integrated circuit chip, connecting electrical connection wires between the electronic integrated circuit chip and the support substrate. 
     
     
         11 . The method of  claim 8 , further comprising, after placing the electronic integrated circuit chip, producing an encapsulation block over the support substrate and which encapsulates the electronic integrated circuit chip. 
     
     
         12 . The method of  claim 8 , wherein surfaces of said parts of the heat transfer elements which protrude above to the facing mounting face are spaced by a distance from a rear face of the electronic integrated circuit chip. 
     
     
         13 . The method of  claim 8 , wherein an upper surface of the metal heat transfer layer is coplanar with the mounting face of the support substrate. 
     
     
         14 . The method of  claim 8 , wherein the holes extend completely through the metal heat transfer layer.