Inventor · disambiguated record
Didier Campos
Also filed as: CAMPOS DIDIER
6 granted patents·4 pending applications·12 citations·filing 2017–2024
74Inventor score
Files withST MICROELECTRONICS GRENOBLE 27ST MICROELECTRONICS INT NV1ST MICROELECTRONICS SA1STMICROELECTRONICS (GRENOBLE 2) SAS1
Top patents by PatentIndex Score
10 records- 0189US9870947B1Method for collective (wafer-scale) fabrication of electronic devices and electronic deviceSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2017·Granted Jan 16, 2018·8 cites·19 claims
- 0285US11355851B2Electronic device comprising an integrated electromagnetic antennaST MICROELECTRONICS SA·Filed 2020·Granted Jun 7, 2022·2 cites·27 claims
- 0383US11302672B2Interconnected stacked circuitsST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Apr 12, 2022·2 cites·18 claims
- 0467US12308347B2Interconnected stacked circuitsST MICROELECTRONICS GRENOBLE 2·Filed 2022·Granted May 20, 2025·0 cites·18 claims
- 0561US2022384298A1Electronic device comprising an electronic chip mounted on top of a support substrateST MICROELECTRONICS GRENOBLE 2·Filed 2022·Application pending·0 cites
- 0659US11488884B2Electronic device comprising an electronic chip mounted on top of a support substrateST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Nov 1, 2022·0 cites·40 claims
- 0757US2024339375A1Heat sink fastened on the substrate of a package of integrated circuitsST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0845US2023081711A1Wire bonding toolST MICROELECTRONICS GRENOBLE 2·Filed 2022·Application pending·0 cites
- 0941US11107742B2Electronic devices and fabricating processesST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Aug 31, 2021·0 cites·6 claims
- 1040US2020152586A1Electronic device including an electronic chip and an antennaST MICROELECTRONICS GRENOBLE 2·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →