Enhanced semiconductor structures

Abstract

A system in package comprising: one or more component(s); one or more heat spreader(s); and one or more substrate(s) having cavity(ies), wherein said cavity(ies) including a first cavity and a second cavity; said one or more component(s) is/are disposed within said first cavity and exposed to said second cavity; said one or more component(s) is/are coupled to said one or more substrate(s); and said one or more component(s) and said one or more substrate(s) are attached to said one or more heat spreader(s).

What is claimed is: 
     
         1 . A system in package comprising:
 one or more component(s);   one or more heat spreader(s); and   one or more substrate(s) having cavity(ies), wherein   said cavity(ies) including a first cavity and a second cavity;   said one or more component(s) is/are disposed within said first cavity and exposed to said second cavity;   said one or more component(s) is/are coupled to said one or more substrate(s); and   said one or more component(s) and said one or more substrate(s) are attached to said one or more heat spreader(s).   
     
     
         2 . The system in package according to  claim 1 , wherein
 one of said one or more component(s) is electrically and/or optically coupled to said one or more substrate(s) using a flip chip or a wirebond method or a waveguide.   
     
     
         3 . The system in package according to  claim 1 , wherein
 said one or more substrate(s) comprises of waveguide(s) and/or nanowires.   
     
     
         4 . The system in package according to  claim 1 , wherein
 said first cavity is formed using a standoff substrate(s).   
     
     
         5 . The system in package according to  claim 1 , wherein
 one of said one or more component(s) is a power management/regulator or power device or security sub-circuit or tamper detect circuit or router or switch or antenna or radar or phased array or modem or baseband or transceiver or mm-wave subsystem or silicon-on-insulator or amplifier or Field Programmable Gate Array (FPGA) or capacitor or resistor or inductor or processor or memory or sensor or analog-to-digital converter or digital-to-analog converter or electrical-optical converter or optical-electrical converter or Light Emitting Diode (LED) or Application-Specific Integrated Circuit (ASIC) or Through-Silicon Via (TSV) or laser or analog circuit or digital circuit or Serializer/Deserializer (SerDes) or filter or Lens or Graphics Processing Unit (GPU) or magnet or waveguide or wirebond or epoxy mold compound (EMC) or under-fill material or heat-pipe or mirror or fan or bump or fiber or accelerator/co-processor or processor core or nanowire or Microelectromechanical Systems (MEMS) or membrane or heat spreader or energy source or sensing material or piezoelectric or light source or touch screen or display or Liquid Crystal Display (LCD) or organic light-emitting diode (OLED) or battery or Electromagnetic Shield (EMI) coating.   
     
     
         6 . The system in package according to  claim 1 , wherein
 one of said one or more heat spreader(s) comprises of nanowires and/or semiconductor.   
     
     
         7 . The system in package according to  claim 1 , wherein
 said second cavity is attached to said one or more heat spreader(s).   
     
     
         8 . A system in package comprising:
 one or more component(s); and   one or more heat spreader(s), wherein   said one or more heat spreader(s) including a first heat spreader and a second heat spreader;   one or more substrate(s) having cavity(ies), wherein   said one or more substrate(s) including a first cavity and a second cavity;   said one or more component(s) is/are disposed within said first cavity;   said one or more component(s) is/are coupled to said one or more substrate(s);   said one or more component(s) and said one or more substrate(s) are attached to said first heat spreader; and   said second heat spreader is disposed within said second cavity and attached to said one or more component(s).   
     
     
         9 . The system in package according to  claim 8 , wherein
 one of said one or more component(s) is electrically and/or optically coupled to said one or more substrate(s) using a flip chip or a wirebond method or a waveguide.   
     
     
         10 . The system in package according to  claim 8 , wherein
 said one or more substrate(s) comprises of waveguide(s) and/or nanowires.   
     
     
         11 . The system in package according to  claim 8 , wherein
 said first cavity is formed using a standoff substrate(s).   
     
     
         12 . The system in package according to  claim 8 , wherein
 one of said one or more component(s) is a power management/regulator or power device or security sub-circuit or tamper detect circuit or router or switch or antenna or radar or phased array or modem or baseband or transceiver or mm-wave subsystem or silicon-on-insulator or amplifier or Field Programmable Gate Array (FPGA) or capacitor or resistor or inductor or processor or memory or sensor or analog-to-digital converter or digital-to-analog converter or electrical-optical converter or optical-electrical converter or Light Emitting Diode (LED) or Application-Specific Integrated Circuit (ASIC) or Through-Silicon Via (TSV) or laser or analog circuit or digital circuit or Serializer/Deserializer (SerDes) or filter or Lens or Graphics Processing Unit (GPU) or magnet or waveguide or wirebond or epoxy mold compound (EMC) or under-fill material or heat-pipe or mirror or fan or bump or fiber or accelerator/co-processor or processor core or nanowire or Microelectromechanical Systems (MEMS) or membrane or heat spreader or energy source or sensing material or piezoelectric or light source or touch screen or display or Liquid Crystal Display (LCD) or organic light-emitting diode (OLED) or battery or Electromagnetic Shield (EMI) coating.   
     
     
         13 . The system in package according to  claim 8 , wherein
 one of said one or more heat spreader(s) comprises of nanowires and/or semiconductor.   
     
     
         14 . The system in package according to  claim 8 , wherein
 said second cavity is attached to said one or more heat spreader(s).   
     
     
         15 . A system in package comprising:
 one or more component(s);   one or more heat spreader(s); and   one or more substrate(s) having cavity(ies),   said one or more substrate(s) including a first cavity and a second cavity;   said one or more component(s) is/are disposed within said first cavity and exposed to said second cavity;   said one or more component(s) is/are coupled to said one or more substrate(s); and   said one or more heat spreader(s) is/are disposed within said first cavity and attached to said one or more component(s).   
     
     
         16 . The system in package according to  claim 15 , wherein
 one of said one or more component(s) is electrically and/or optically coupled to said one or more substrate(s) using a flip chip or a wirebond method or a waveguide.   
     
     
         17 . The system in package according to  claim 15 , wherein
 said one or more substrate(s) comprises of waveguide(s) and/or nanowires.   
     
     
         18 . The system in package according to  claim 15 , wherein
 said first cavity is formed using a standoff substrate(s).   
     
     
         19 . The system in package according to  claim 15 , wherein
 one of said one or more component(s) is a power management/regulator or power device, security sub-circuit or tamper detect circuit or router or switch or antenna or radar or phased array or modem or baseband or transceiver or mm-wave subsystem or silicon-on-insulator or amplifier or Field Programmable Gate Array (FPGA) or capacitor or resistor or inductor or processor or memory or sensor or analog-to-digital converter or digital-to-analog converter or electrical-optical converter or optical-electrical converter or Light Emitting Diode (LED) or Application-Specific Integrated Circuit (ASIC) or Through-Silicon Via (TSV) or laser or analog circuit or digital circuit or Serializer/Deserializer (SerDes) or filter or Lens or Graphics Processing Unit (GPU) or magnet or waveguide or wirebond or epoxy mold compound (EMC) or under-fill material or heat-pipe or mirror or fan or bump or fiber or accelerator/co-processor or processor core or nanowire or Microelectromechanical Systems (MEMS) or membrane or heat spreader or energy source or sensing material or piezoelectric or light source or touch screen or display or Liquid Crystal Display (LCD) or organic light-emitting diode (OLED) or battery or Electromagnetic Shield (EMI) coating.   
     
     
         20 . The system in package according to  claim 15 , wherein
 said one or more heat spreader(s) comprises of nanowires and/or semiconductor.