Assignee
BROADPAK CORP
US·14 granted patents·5 pending applications·466 citations·filing 2008–2025
Top patents by PatentIndex Score
19 records- 0198US9893004B2Semiconductor interposer integrationBROADPAK CORP·Filed 2015·Granted Feb 13, 2018·226 cites·14 claims
- 0298US8014166B2Stacking integrated circuits containing serializer and deserializer blocks using through silicon viaBROADPAK CORP·Filed 2008·Granted Sep 6, 2011·215 cites·20 claims
- 0395US10515886B2Scalable semiconductor interposer integrationBROADPAK CORP·Filed 2017·Granted Dec 24, 2019·12 cites·60 claims
- 0490US9818680B2Scalable semiconductor interposer integrationBROADPAK CORP·Filed 2015·Granted Nov 14, 2017·7 cites·4 claims
- 0586US2025273553A12.5d/3d system integrationBROADPAK CORP·Filed 2025·Application pending·0 cites
- 0683US10964676B2Semiconductor structure and a method of making thereofBROADPAK CORP·Filed 2018·Granted Mar 30, 2021·2 cites·50 claims
- 0782US2023026177A1Enhanced semiconductor structuresBROADPAK CORP·Filed 2022·Application pending·0 cites
- 0880US10026720B2Semiconductor structure and a method of making thereofBROADPAK CORP·Filed 2016·Granted Jul 17, 2018·2 cites·20 claims
- 0979US2023041977A13d heterogeneous integrations and methods of making thereofBROADPAK CORP·Filed 2022·Application pending·0 cites
- 1078US12327783B23D system integrationBROADPAK CORP·Filed 2023·Granted Jun 10, 2025·0 cites·11 claims
- 1177US10847499B2Stacking integrated circuits containing serializer and deserializer blocks using through viaBROADPAK CORP·Filed 2019·Granted Nov 24, 2020·1 cites·22 claims
- 1276US10522516B2Stacking integrated circuits containing serializer and deserializer blocks using through silicon viaBROADPAK CORP·Filed 2019·Granted Dec 31, 2019·1 cites·2 claims
- 1375US11569208B2Semiconductor structure and method for making thereofBROADPAK CORP·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 1474US12255189B2Secure semiconductor integration and method for making thereofBROADPAK CORP·Filed 2021·Granted Mar 18, 2025·0 cites·20 claims
- 1574US2024355722A1Apparatus and method for making a secured substrateBROADPAK CORP·Filed 2024·Application pending·0 cites
- 1673US11894342B2Stacking integrated circuits containing serializer and deserializer blocks using throughBROADPAK CORP·Filed 2020·Granted Feb 6, 2024·0 cites·13 claims
- 1765US12068231B23D integrations and methods of making thereofBROADPAK CORP·Filed 2022·Granted Aug 20, 2024·0 cites·20 claims
- 1864US2021175162A1Secure semiconductor integrationBROADPAK CORP·Filed 2021·Application pending·0 cites
- 1945US11302617B2Scalable semiconductor interposer integrationBROADPAK CORP·Filed 2019·Granted Apr 12, 2022·0 cites·17 claims
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