Semiconductor devices with package-level compartmental shielding and associated systems and methods

Abstract

A mold chase for packaging a compartmentally shielded multifunctional semiconductor is provided. The mold chase generally includes a first cavity and a second cavity separated by a trench plate positioned between a first component and a second component of the multifunctional semiconductor between which a compartmental shield is required. The mold chase is lowered into a molding position over the multifunctional semiconductor and a molding material is injected through an inlet sprue into the first and second cavities to surround the first and second components, respectively. After the molding material is cured, the mold chase is removed and an open trench is formed in the cured molding material by the trench plate. The open trench is filled with a conductive material to form the compartmental shield. A conformal shield may be added to cover the package.

I/We claim: 
     
         1 . A mold chase for packaging a compartmentally shielded multifunctional semiconductor, the mold chase comprising:
 a top panel having an inlet sprue through which a molding material can flow;   a sidewall depending from a perimeter of the top panel and configured to contact a substrate of the multifunctional semiconductor when the mold chase is in a molding position; and   a trench plate projecting from the top panel at a position inward of the side panel, the trench plate configured to at least partially extend toward the substrate between a first component and a second component of the multifunctional semiconductor when the mold chase is in a molding position,   wherein the top panel, the side panel, and the trench plate together form a first cavity and a second cavity configured to receive the molding material.   
     
     
         2 . The mold chase of  claim 1 , wherein the trench plate projects from the top panel to contact the substrate when the mold chase is in a molding position, the trench plate separating the first cavity from the second cavity. 
     
     
         3 . The mold chase of  claim 2 , wherein the trench plate has a passageway to fluidly couple the first cavity and the second cavity to flow the molding material therebetween. 
     
     
         4 . The mold chase of  claim 1 , wherein the trench plate creates an open trench when the mold chase is removed from cured molding material. 
     
     
         5 . The mold chase of  claim 4 , wherein the open trench is between the first and second components of the multifunctional semiconductor and configured to receive a compartmental shield therein. 
     
     
         6 . The mold chase of  claim 1 , wherein the molding material is selected from the group consisting of a resin, an epoxy resin, a silicone-based material, a polyimide, and combinations thereof.