Inventor · disambiguated record
Jong Sik Paek
Also filed as: PAEK JONG S · PAEK JONG SIK
80 granted patents·23 pending applications·1,145 citations·filing 2001–2025
99Inventor score
Files withAMKOR TECHNOLOGY INC55MICRON TECHNOLOGY INC19AMKOR TECH SINGAPORE HOLDING PTE LTD17PAEK JONG SIK5JIN JUNG GI2
Top patents by PatentIndex Score
103 records- 0198US11942430B2Stacked die modules for semiconductor device assemblies and methods of manufacturing stacked die modulesMICRON TECHNOLOGY INC·Filed 2021·Granted Mar 26, 2024·4 cites·20 claims
- 0298US9000586B2Semiconductor device and manufacturing method thereofDO WON CHUL·Filed 2012·Granted Apr 7, 2015·49 cites·20 claims
- 0398US6927478B2Reduced size semiconductor package with stacked diesAMKOR TECHNOLOGY INC·Filed 2002·Granted Aug 9, 2005·193 cites·16 claims
- 0497US8362612B1Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2010·Granted Jan 29, 2013·53 cites·20 claims
- 0597US6858919B2Semiconductor packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Feb 22, 2005·130 cites·16 claims
- 0696US9484331B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2014·Granted Nov 1, 2016·18 cites·26 claims
- 0795US9391043B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Jul 12, 2016·12 cites·20 claims
- 0895US9048125B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Jun 2, 2015·20 cites·20 claims
- 0995US7335986B1Wafer level chip scale packageAMKOR TECHNOLOGY INC·Filed 2005·Granted Feb 26, 2008·57 cites·20 claims
- 1095US6759737B2Semiconductor package including stacked chips with aligned input/output padsAMKOR TECHNOLOGY INC·Filed 2001·Granted Jul 6, 2004·105 cites·24 claims
- 1194US10079157B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Sep 18, 2018·9 cites·20 claims
- 1294US9466580B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Oct 11, 2016·9 cites·20 claims
- 1394US8058726B1Semiconductor device having redistribution layerJIN JUNG GI·Filed 2008·Granted Nov 15, 2011·52 cites·1 claims
- 1492US7446422B1Wafer level chip scale package and manufacturing method for the sameAMKOR TECHNOLOGY INC·Filed 2005·Granted Nov 4, 2008·26 cites·7 claims
- 1592US6953988B2Semiconductor packageAMKOR TECHNOLOGY INC·Filed 2004·Granted Oct 11, 2005·60 cites·16 claims
- 1691US10032740B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jul 24, 2018·5 cites·13 claims
- 1791US9966276B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted May 8, 2018·5 cites·20 claims
- 1891US9418922B2Semiconductor device with reduced thicknessAMKOR TECHNOLOGY INC·Filed 2014·Granted Aug 16, 2016·12 cites·17 claims
- 1990US10297466B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted May 21, 2019·4 cites·20 claims
- 2090US9219042B2Semiconductor device and manufacturing method thereofPAEK JONG SIK·Filed 2013·Granted Dec 22, 2015·10 cites·19 claims
- 2189US8446017B2Stackable wafer level package and fabricating method thereofPAEK JONG SIK·Filed 2009·Granted May 21, 2013·22 cites·13 claims
- 2288US9818685B2Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layersAMKOR TECHNOLOGY INC·Filed 2016·Granted Nov 14, 2017·4 cites·20 claims
- 2386US9929113B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Mar 27, 2018·3 cites·22 claims
- 2486US7808105B1Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2007·Granted Oct 5, 2010·14 cites·18 claims
- 2586US6846704B2Semiconductor package and method for manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2003·Granted Jan 25, 2005·37 cites·20 claims
- 2686US6700187B2Semiconductor package and method for manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2002·Granted Mar 2, 2004·37 cites·20 claims
- 2785US9536858B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 3, 2017·3 cites·20 claims
- 2885US6740950B2Optical device packages having improved conductor efficiency, optical coupling and thermal transferAMKOR TECHNOLOGY INC·Filed 2002·Granted May 25, 2004·40 cites·18 claims
- 2985US2024304583A1Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 3084US9123543B1Semiconductor device and manufacturing method thereofJIN JUNG GI·Filed 2011·Granted Sep 1, 2015·8 cites·18 claims
- 3184US2024258253A1Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 3283US11043464B2Semiconductor device having upper and lower redistribution layersAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2018·Granted Jun 22, 2021·2 cites·18 claims
- 3383US9478517B2Electronic device package structure and method of fabricating the sameAMKOR TECHNOLOGY INC·Filed 2013·Granted Oct 25, 2016·6 cites·20 claims
- 3483US2024266189A1Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 3582US11101144B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Aug 24, 2021·2 cites·21 claims
- 3682US10679952B2Semiconductor device having an encapsulated front side and interposer and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Jun 9, 2020·2 cites·22 claims
- 3782US8618658B1Semiconductor device and fabricating method thereofPAEK JONG SIK·Filed 2010·Granted Dec 31, 2013·7 cites·13 claims
- 3882US2024387499A1Face-to-face semiconductor device with fan-out porchMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3981US12051684B2Face-to-face semiconductor device with fan-out porchMICRON TECHNOLOGY INC·Filed 2023·Granted Jul 30, 2024·0 cites·16 claims
- 4080US2024243084A1Wafer level fan out semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 4179US7045893B1Semiconductor package and method for manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2004·Granted May 16, 2006·32 cites·17 claims
- 4279US2023223365A1Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Application pending·0 cites
- 4378US11764161B2Ground connection for semiconductor device assemblyMICRON TECHNOLOGY INC·Filed 2019·Granted Sep 19, 2023·2 cites·8 claims
- 4478US11749665B2Face-to-face semiconductor device with fan-out porchMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 5, 2023·0 cites·17 claims
- 4578US9406638B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 2, 2016·2 cites·20 claims
- 4678US2023057803A1Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layersAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Application pending·0 cites
- 4776US11842970B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Dec 12, 2023·0 cites·20 claims
- 4876US11515174B2Semiconductor devices with package-level compartmental shielding and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 29, 2022·2 cites·8 claims
- 4976US10199322B2Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layersAMKOR TECHNOLOGY INC·Filed 2017·Granted Feb 5, 2019·1 cites·20 claims
- 5076US2025316545A1Semiconductor device with a porous air ventMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
Showing the top 50 of 103 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →