Electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate

Abstract

The invention relates to an electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate, a module for chemical and/or electrolytic surface treatment of a substrate in a process fluid, a use of the electrochemical deposition system or the module for chemical and/or electrolytic surface treatment for a metal deposition application and a manufacturing method for an electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate. The electrochemical deposition system comprises an anode, an anode enclosure, and a single electrolyte. The anode enclosure extends at least partially around the anode. The anode enclosure comprises a membrane. The anode and the anode enclosure are arranged in the single electrolyte. The single electrolyte is the only electrolyte of the electrochemical deposition system.

1 . An electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate, comprising:
 an anode,   an anode enclosure, and   a single electrolyte,   wherein the anode enclosure at least partially extends around the anode,   wherein the anode enclosure comprises a membrane,   wherein the anode and the anode enclosure are arranged in the single electrolyte, and   wherein the single electrolyte is the only electrolyte of the electrochemical deposition system.   
     
     
         2 . The electrochemical deposition system according to  claim 1 , wherein the anode is inert. 
     
     
         3 . The electrochemical deposition system according to  claim 1 , wherein the anode enclosure is arranged as a flow divider around the anode to direct gas formed during deposition away from the substrate to be treated. 
     
     
         4 . The electrochemical deposition system according to  claim 1 , wherein the membrane tilted relative to the surface of the anode. 
     
     
         5 . The electrochemical deposition system according to  claim 1 , wherein the anode enclosure comprises a cover element arranged in an opening of the anode enclosure, which reduces a diameter of the opening of the anode enclosure. 
     
     
         6 . The electrochemical deposition system according to  claim 1 , wherein the membrane is a bi-directional liquid permeable membrane. 
     
     
         7 . The electrochemical deposition system according to  claim 6 , wherein the bi-directional liquid permeable membrane is non-ionic specific. 
     
     
         8 . The electrochemical deposition system according to  claim 6 , wherein the bi-directional liquid permeable membrane is made of polypropylene. 
     
     
         9 . A module for chemical and/or electrolytic surface treatment of a substrate in a process fluid, comprising:
 the electrochemical deposition system according  claim 1 , and   a distribution body,   wherein the distribution body is arranged in an electrolyte of the electrochemical deposition system and comprises a plurality of openings.   
     
     
         10 . The module according to  claim 9 , wherein the distribution body is a diffusor plate configured to distribute a field of electrical current relative to the substrate. 
     
     
         11 . The module according to  claim 9 , wherein the distribution body is a high speed plate configured to distribute a flow of the electrolyte relative to the substrate and to distribute a field of electrical current relative to the substrate. 
     
     
         12 . A method of chemical and/or electrolytic surface treatment comprising metal deposition application with the electrochemical deposition system of  claim 1 . 
     
     
         13 . The method according to  claim 12 , wherein the metal deposition application is a copper deposition application. 
     
     
         14 . The method according to  claim 12 , wherein the metal deposition application is a dual damascene deposition application. 
     
     
         15 . A manufacturing method for an electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate, comprising the following steps:
 providing an anode,   arranging an anode enclosure at least partially around the anode, and   arranging the anode and the anode enclosure in a single electrolyte, wherein the anode enclosure comprises a membrane, and wherein the single electrolyte is the only electrolyte of the electrochemical deposition method.