Inventor · disambiguated record
Andreas Gleissner
Also filed as: GLEISSNER ANDREAS
28 granted patents·20 pending applications·21 citations·filing 2010–2023
92Inventor score
Top patents by PatentIndex Score
48 records- 0187US8485204B2Closed chamber with fluid separation featureOBWEGER RAINER·Filed 2010·Granted Jul 16, 2013·9 cites·13 claims
- 0284US11942356B2Clipping mechanism for fastening a substrate for a surface treatment of the substrateSEMSYSCO GMBH·Filed 2021·Granted Mar 26, 2024·1 cites·6 claims
- 0377US11195730B2Method and apparatus for processing wafer-shaped articlesLAM RES AG·Filed 2019·Granted Dec 7, 2021·2 cites·10 claims
- 0475US9418883B2Device for holding wafer shaped articlesLAM RES AG·Filed 2013·Granted Aug 16, 2016·3 cites·18 claims
- 0570US11566337B2Substrate locking system, device and procedure for chemical and/or electrolytic surface treatmentSEMSYSCO GMBH·Filed 2020·Granted Jan 31, 2023·0 cites·13 claims
- 0669US9597701B2Apparatus for treating surfaces of wafer-shaped articlesLAM RES AG·Filed 2013·Granted Mar 21, 2017·2 cites·9 claims
- 0768US11164748B2Method and device for plating a recess in a substrateSEMSYSCO GMBH·Filed 2019·Granted Nov 2, 2021·1 cites·12 claims
- 0864US11908698B2Method and device for plating a recess in a substrateSEMSYSCO GMBH·Filed 2021·Granted Feb 20, 2024·0 cites·18 claims
- 0961US10490426B2Method and apparatus for processing wafer-shaped articlesLAM RES AG·Filed 2014·Granted Nov 26, 2019·1 cites·29 claims
- 1061US10269615B2Apparatus for treating surfaces of wafer-shaped articlesTSCHINDERLE ULRICH·Filed 2011·Granted Apr 23, 2019·1 cites·20 claims
- 1161US2025034709A1Distribution body for distributing a process gas for treating a substrate by means of the process gasSEMSYSCO GMBH·Filed 2022·Application pending·0 cites
- 1259US12351921B2Distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrateSEMSYSCO GMBH·Filed 2020·Granted Jul 8, 2025·0 cites·21 claims
- 1358US9633890B2Device for treating surfaces of wafer-shaped articles and gripping pin for use in the deviceTSCHINDERLE ULRICH·Filed 2011·Granted Apr 25, 2017·1 cites·18 claims
- 1457US2023250547A1Distribution System for a Process Fluid for a Chemical and/or Electrolytic Surface Treatment of a SubstrateSEMSYSCO GMBH·Filed 2021·Application pending·0 cites
- 1555US2025137161A1Substrate holder for holding a substrate in a chemical and/or electrolytic surface treatment of the substrateSEMSYSCO GMBH·Filed 2022·Application pending·0 cites
- 1655US2024141535A1System for a chemical and/or electrolytic surface treatment of a substrateSEMSYSCO GMBH·Filed 2021·Application pending·0 cites
- 1754US2025333874A1Module kit for a chemical and/or electrolytic surface treatment of a substrateSEMSYSCO GMBH·Filed 2023·Application pending·0 cites
- 1854US2025146165A1System for a chemical and/or electrolytic surface treatment of a substrateSEMSYSCO GMBH·Filed 2022·Application pending·0 cites
- 1953US2024011180A1Distribution system for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrateSEMSYSCO GMBH·Filed 2021·Application pending·0 cites
- 2052US2023313407A1Shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrateSEMSYSCO GMBH·Filed 2021·Application pending·0 cites
- 2151US11965263B2Substrate holding and locking system for chemical and/or electrolytic surface treatmentSEMSYSCO GMBH·Filed 2020·Granted Apr 23, 2024·0 cites·16 claims
- 2250US2023193503A1Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a rotatable substrateSEMSYSCO GMBH·Filed 2021·Application pending·0 cites
- 2349US10056287B2Apparatus for treating surfaces of wafer-shaped articlesLAM RES AG·Filed 2015·Granted Aug 21, 2018·0 cites·19 claims
- 2449US2023075605A1Distribution system for a process fluid and electric current for chemical and/or electrolytic surface treatment of a substrateSEMSYSCO GMBH·Filed 2021·Application pending·0 cites
- 2548US12351935B2Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrateSEMSYSCO GMBH·Filed 2021·Granted Jul 8, 2025·0 cites·19 claims
- 2648US2023095518A1Method for a chemical and/or electrolytic surface treatment of a substrate in a process stationSEMSYSCO GMBH·Filed 2021·Application pending·0 cites
- 2747US9657397B2Apparatus for treating surfaces of wafer-shaped articlesLAM RES AG·Filed 2013·Granted May 23, 2017·0 cites·13 claims
- 2846US11136687B2Substrate locking system, device and procedure for chemical and/or electrolytic surface treatmentSEMSYSCO GMBH·Filed 2018·Granted Oct 5, 2021·0 cites·15 claims
- 2946US2023056444A1Electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrateSEMSYSCO GMBH·Filed 2020·Application pending·0 cites
- 3045US12428746B2Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrateSEMSYSCO GMBH·Filed 2020·Granted Sep 30, 2025·0 cites·4 claims
- 3145US11938522B2Module for chemically processing a substrateSEMSYSCO GMBH·Filed 2020·Granted Mar 26, 2024·0 cites·19 claims
- 3245US2025162176A1Substrate handling device for handling a substrateSEMSYSCO GMBH·Filed 2023·Application pending·0 cites
- 3344US2024145231A1System and method for a surface treatment of a substrate with a liquidSEMSYSCO GMBH·Filed 2022·Application pending·0 cites
- 3441US11105014B2Distribution system for chemical and/or electrolytic surface treatmentSEMSYSCO GMBH·Filed 2018·Granted Aug 31, 2021·0 cites·13 claims
- 3541US2014283994A1Apparatus for treating surfaces of wafer-shaped articlesLAM RES AG·Filed 2013·Application pending·0 cites
- 3640US8974632B2Device and method for treating wafer-shaped articlesTSCHINDERLE ULRICH·Filed 2011·Granted Mar 10, 2015·0 cites·8 claims
- 3740US2013319472A1Method and apparatus for processing wafer-shaped articlesFRANK DIETER·Filed 2012·Application pending·0 cites
- 3838US12261075B2Substrate handling device for a waferSEMSYSCO GMBH·Filed 2020·Granted Mar 25, 2025·0 cites·14 claims
- 3938US2013309048A1Apparatus and method for transporting wafer-shaped articlesGLEISSNER ANDREAS·Filed 2012·Application pending·0 cites
- 4037US9911630B2Apparatus for treating surfaces of wafer-shaped articlesLAM RES AG·Filed 2015·Granted Mar 6, 2018·0 cites·10 claims
- 4136US10167552B2Spin chuck with rotating gas showerheadLAM RES AG·Filed 2015·Granted Jan 1, 2019·0 cites·17 claims
- 4236US9887120B2Apparatus for treating surfaces of wafer-shaped articlesLAM RES AG·Filed 2015·Granted Feb 6, 2018·0 cites·14 claims
- 4336US9548223B2Apparatus for treating surfaces of wafer-shaped articlesFRANK DIETER·Filed 2011·Granted Jan 17, 2017·0 cites·12 claims
- 4435US2013101372A1Method and apparatus for processing wafer-shaped articlesTSCHINDERLE ULRICH·Filed 2011·Application pending·0 cites
- 4534US2017162405A1Spin chuck with heated nozzle assemblyLAM RES AG·Filed 2015·Application pending·0 cites
- 4633US9887122B2Method and apparatus for processing wafer-shaped articlesLAM RES AG·Filed 2016·Granted Feb 6, 2018·0 cites·37 claims
- 4726US9968970B2Spin chuck with in situ cleaning capabilityLAM RES AG·Filed 2015·Granted May 15, 2018·0 cites·6 claims
- 4824US2017162426A1Spin chuck with gas leakage preventionLAM RES AG·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →