Distribution system for a process fluid and electric current for chemical and/or electrolytic surface treatment of a substrate

Abstract

The invention relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a distribution method for a process fluid for chemical and/or electrolytic surface treatment of a substrate and a data processing device. The distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate comprises a distribution body and a shield element. The distribution body comprises a plurality of openings for the process fluid. The shield element is configured to at least partially cover at least one of the plurality of openings to limit a flow of the process fluid through the distribution body.

1 .- 15 . (canceled) 
     
     
         16 . A distribution system for a process fluid for electrolytic surface treatment of a substrate, comprising:
 a distribution body, and   a shield element,   
       characterized in that the distribution body comprises a plurality of openings for the process fluid and an electrical current, wherein some of the openings are drain holes, configured to direct the electric current, and wherein the drain holes are through holes extending between a front face of the distribution body directed towards the substrate and a rear face of the distribution body opposite to the front face, and wherein other openings are jet holes configured to direct the process fluid onto the substrate, and 
       wherein the shield element is configured to at least partially cover at least one of the plurality of openings to limit a flow of the process fluid and/or a flow of the electrical current through the distribution body so that a flow of the process fluid is modified through the distribution body and/or the electrical current distribution of the substrate is altered. 
     
     
         17 . The distribution system according to  claim 16 , further comprising a process unit configured to control a coverage of the openings by the shield element based on a predetermined local deposition rate for a local portion of the substrate to be treated. 
     
     
         18 . The distribution system according  17 , wherein the process unit is further configured to determine the local deposition rate based on a local density of structures to be applied on the local portion of the substrate. 
     
     
         19 . The distribution system according to  claim 17 , wherein the process unit is configured to control the coverage of the openings by the shield element to limit an electrical current distribution for chemical and/or electrolytic surface treatment of the substrate. 
     
     
         20 . The distribution system according to  claim 16 , wherein the shield element is a plate shaped to cover an array of openings. 
     
     
         21 . The distribution system according to  claim 16 , wherein the shield element is movable relative to the distribution body. 
     
     
         22 . The distribution system according to  claim 16 , wherein the shield element is mechanically, electro-statically and/or magnetically connected to the distribution body. 
     
     
         23 . The distribution system according to  claim 16 , wherein the shield element comprises a plurality of stencils to be inserted at least partially in at least some of the plurality of openings of the distribution body. 
     
     
         24 . The distribution system according to  claim 23 , wherein at least one of the stencils comprises boreholes. 
     
     
         25 . A distribution method for a process fluid for electrolytic surface treatment of a substrate, comprising the following steps:
 providing a distribution body, wherein the distribution body comprises a plurality of openings for the process fluid and an electrical current, wherein some of the openings are drain holes, configured to direct the electric current, and wherein the drain holes are through holes extending between a front face of the distribution body directed towards the substrate and a rear face of the distribution body opposite to the front face, and wherein other openings are jet holes configured to direct the process fluid onto the substrate,   providing a shield element, wherein the shield element is configured to at least partially cover at least one of the plurality of openings to limit a flow of the process fluid and/or a flow of the electrical current through the distribution body, so that a flow of the process fluid is modified through the distribution body and/or the electrical current distribution of the substrate is altered, and   controlling the flow of process fluid through the distribution body by the shield element.   
     
     
         26 . A data processing device configured to carry out the method steps of  claim 25 .