US2023193503A1PendingUtilityA1

Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a rotatable substrate

Assignee: SEMSYSCO GMBHPriority: May 11, 2020Filed: May 3, 2021Published: Jun 22, 2023
Est. expiryMay 11, 2040(~13.8 yrs left)· nominal 20-yr term from priority
C25D 17/06C25D 17/007C25D 21/10C25D 17/001C25D 17/008C25D 5/08C23C 18/1628
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Claims

Abstract

The disclosure relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a rotatable substrate, an electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate and a method for a chemical and/or electrolytic surface treatment of a substrate in a process fluid. The distribution system comprises a distribution body. The distribution body comprises a plurality of openings for the process fluid. The openings are arranged in a spiral-shaped pattern on a surface of the distribution body.

Claims

exact text as granted — not AI-modified
1 . A distribution system suitable for a process fluid for chemical and/or electrolytic surface treatment of a rotatable substrate,
 wherein the distribution system comprises a distribution body,   wherein the distribution body comprises a plurality of openings,   wherein some of the openings are configured to provide the process fluid flow and other openings are configured to provide a current density distribution,   wherein the openings for providing the process fluid flow are arranged in a spiral-shaped pattern on a surface of the distribution body, and   wherein the openings for providing the current density distribution are arranged on the surface of the distribution body independently of second portion of the openings for providing the process fluid flow.   
     
     
         2 . The distribution system according to  claim 1 , wherein, in case the substrate is rotating relative to the distribution body, the spiral-shaped pattern enables several areas of the substrate to be exposed to similar process fluid flows and/or similar current density distributions, respectively. 
     
     
         3 . The distribution system according to  claim 1 , wherein the spiral-shaped pattern is formed in that the openings are arranged along an imaginary curve, which winds around a starting point (C) on the distribution body at a continuously increasing distance from the starting point. 
     
     
         4 . The distribution system according to  claim 3 , wherein the starting point (C) is a geometric centre (C) of the distribution body. 
     
     
         5 . The distribution system according to  claim 3 , wherein the starting point (C) is outside a geometric centre (C) of the distribution body. 
     
     
         6 . The distribution system according to  claim 1 , wherein the spiral-shaped pattern is based on an Archimedean spiral. 
     
     
         7 . The distribution system according to  claim 1 , wherein the spiral-shaped pattern is based on a logarithmic spiral. 
     
     
         8 . The distribution system according to  claim 1 , wherein the spiral-shaped pattern is based on a parabolic spiral. 
     
     
         9 . The distribution system according to  claim 1 , wherein the spiral-shaped pattern is based on a square root spiral. 
     
     
         10 . The distribution system according to  claim 1 , wherein the spiral-shaped pattern is based on a hyperbolic spiral. 
     
     
         11 . The distribution system according to  claim 1 , wherein the spiral-shaped pattern is based on a Fibonacci spiral. 
     
     
         12 . The distribution system according to  claim 1 , wherein the spiral-shaped pattern is a combination of two or more spirals. 
     
     
         13 . An electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate, comprising:
 a distribution system according to one of the preceding claims, and   a substrate rotation system,   wherein the substrate rotation system is configured to rotate a substrate relative to a distribution body of the distribution system.   
     
     
         14 . A method for a chemical and/or electrolytic surface treatment of a substrate in a process fluid, comprising:
 providing a distribution system comprising a distribution body with a plurality of openings,   rotating the substrate relative to the distribution system, and   providing the process fluid flow via some of the openings and providing a current density distribution via other openings,   wherein the openings for providing the process fluid flow are arranged in a spiral-shaped pattern on a surface of the distribution body, and   wherein the openings for providing the current density distribution are arranged on the surface of the distribution body independently of the openings for providing the process fluid flow.

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