Semiconductor packages with indications of die-specific information

Abstract

Semiconductor device packages and associated methods are disclosed herein. In some embodiments, the semiconductor device package includes (1) a first surface and a second surface opposite the first surface; (2) a semiconductor die positioned between the first and second surfaces; and (3) an indication positioned in a designated area of the first surface. The indication includes a code presenting information for operating the semiconductor die. The code is configured to be read by an indication scanner coupled to a controller.

I/We claim: 
     
         1 . A semiconductor device package, comprising:
 a first surface and a second surface opposite the first surface;   a semiconductor die between the first and second surfaces; and   a machine-readable code indication at the first surface, the machine-readable code indication presenting one or more testing results for the semiconductor die, the one or more testing results comprising one or more voltages, one or more voltage adjustments, one or more currents, one or more current adjustments, one or more delays, or a combination thereof.   
     
     
         2 . The semiconductor device package of  claim 1 , wherein the machine-readable code indication is a first machine-readable code indication, and wherein the semiconductor device package further comprises a second machine-readable code indication presenting the one or more testing results. 
     
     
         3 . The semiconductor device package of  claim 2 , wherein the second machine-readable code indication is positioned at the first surface. 
     
     
         4 . The semiconductor device package of  claim 2 , wherein the second machine-readable code indication is laterally spaced apart from the first machine-readable code indication. 
     
     
         5 . The semiconductor device package of  claim 2 , wherein the machine-readable code indication is positioned at the second surface. 
     
     
         6 . The semiconductor device package of  claim 1 , wherein the semiconductor device package does not include a fuse. 
     
     
         7 . The semiconductor device package of  claim 2 , wherein the first machine-readable code indication comprises a QR code, and wherein the second machine-readable code indication comprises a barcode. 
     
     
         8 . The semiconductor device package of  claim 1 , further comprising a configuration latch configured to receive the one or more testing results for operating the semiconductor die during a power-on process of the semiconductor device package. 
     
     
         9 . The semiconductor device package of  claim 1 , wherein the machine-readable code indication is a first machine-readable code indication, and wherein the one or more testing results comprises a first set of testing results, and wherein the semiconductor device package further comprises a second machine-readable code indication presenting a second set of testing results. 
     
     
         10 . The semiconductor device package of  claim 9 , wherein the second set of testing results is different from the first set of testing results. 
     
     
         11 . The semiconductor device package of  claim 9 , wherein the second set of testing results is generally the same as the first set of testing results. 
     
     
         12 . The semiconductor device package of  claim 9 , wherein the first set of testing results includes a first set of parameters for operating the semiconductor die, and wherein the second set of testing results includes a second set of parameters for operating the semiconductor die. 
     
     
         13 . The semiconductor device package of  claim 9 , wherein the first set of testing results includes a set of parameters for operating the semiconductor die, and wherein the second set of testing results includes information for authenticating the semiconductor device package. 
     
     
         14 . The semiconductor device package of  claim 1 , wherein the machine-readable code indication further includes an address for redundancy or a resistance reference value. 
     
     
         15 . A method of providing information associated with a semiconductor die, comprising:
 testing the semiconductor die to determine one or more testing results including one or more voltages, one or more voltage adjustments, one or more currents, one or more current adjustments, one or more delays, or a combination thereof;   disposing the semiconductor die in a semiconductor device package, the semiconductor device package having a first surface;   forming a machine-readable code indication at the first surface, the machine-readable code indication presenting the one or more testing results for the semiconductor die.   
     
     
         16 . The method of  claim 15 , further comprising loading the one or more testing results into a configuration latch of the semiconductor die during a power-on process of the semiconductor device package. 
     
     
         17 . The method of  claim 15 , wherein the machine-readable code indication is a first machine-readable code indication, and wherein the method further comprises forming a second machine-readable code indication presenting the one or more testing results for the semiconductor die. 
     
     
         18 . The method of  claim 17 , wherein the second machine-readable code indication is formed at the first surface. 
     
     
         19 . The method of  claim 17 , wherein the second machine-readable code indication is formed at a second surface of the semiconductor device package opposite the first surface. 
     
     
         20 . A semiconductor device, comprising:
 a first surface; and   a machine-readable code indication at the first surface, the machine-readable code indication presenting one or more testing results for the semiconductor device, the one or more testing results comprising one or more voltages, one or more voltage adjustments, one or more currents, one or more current adjustments, one or more delays, or a combination thereof.