Composition for etching and method for manufacturing semiconductor device using same

Abstract

A composition for etching and a method of manufacturing a semiconductor device, the method including an etching process of using the composition for etching, are provided. The composition for etching includes a first inorganic acid; any one first additive selected from the group consisting of phosphorous acid, an organic phosphite, a hypophosphite, and mixtures thereof, and a solvent. The composition for etching is a high-selectivity composition for etching that can selectively remove a nitride film while minimizing the etch rate for an oxide film and does not have a problem such as particle generation, which adversely affects device characteristics.

1 . A semiconductor element comprising:
 a cell gate structure formed on a substrate on which a plurality of interlayer insulating layers and a plurality of gate electrode layers are alternatively stacked, wherein the cell gate structure formed by selectively etching a plurality of nitride layers by a composition for the selective etching,   wherein the composition for etching comprises:   a first inorganic acid,   a first additive, being any one selected from a group consisting of phosphorous acid, an organic phosphite, a hypophosphite, and mixtures thereof,   a second additive comprising a compound selected from Chemical Formulas 300, 350, and their combination, and   a solvent,   wherein:   
       
         
           
           
               
               
           
         
         (In Chemical Formula 300, each R 1  to R 4  is each independently selected from a group consisting of a hydrogen atom, a halogen atom, a hydroxyl group, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an aminoalkyl group having 1 to 10 carbon atoms, and an aminoalkoxy group having 1 to 10 carbon atoms, and an aryl group having 6 to 30 carbon atoms, 2 or 3 of R 1  to R 4  are hydroxy groups, and at least one of R 1  to R 4  is an alkoxy group having 1 to 10 carbon atoms, an aminoalkyl group having 1 to 10 carbon atoms or an aminoalkoxy group having 1 to 10 carbon atoms.) 
       
       
         
           
           
               
               
           
         
         (In Chemical Formula 350, each R 2  to R 5  is each independently selected from a group consisting of a hydrogen atom, a halogen atom, a hydroxyl group, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an aminoalkyl group having 1 to 10 carbon atoms, and an aminoalkoxy group having 1 to 10 carbon atoms, and an aryl group having 6 to 30 carbon atoms, 2 or 3 of R 2  to R 5  are hydroxy groups, and at least one of R 2  to R 5  is an alkoxy group having 1 to 10 carbon atoms, an aminoalkyl group having 1 to 10 carbon atoms or an aminoalkoxy group having 1 to 10 carbon atoms, n is an integer from 1 to 4.) 
       
     
     
         2 . The semiconductor element of  claim 1 , wherein the composition for etching comprises the first additive at a proportion of 0.01% to 15% by weight, the first inorganic acid at a proportion of 70% to 99% by weight, the second additive at a proportion of 0.01% to 20% by weight, and the solvent as the balance.