Biasable rotating pedestal

Abstract

Embodiments disclosed herein include an electrostatic chuck. In an embodiment, the electrostatic chuck comprises a pedestal with a support surface for supporting a substrate and a second surface opposite from the support surface, and chucking electrode within the pedestal. In an embodiment, a biasing electrode is within the pedestal, and a heating element is within the pedestal. In an embodiment, the electrostatic chuck further comprises a shaft coupled to the second surface of the pedestal, and a rotation assembly coupled to the shaft to rotate the shaft and the pedestal.

What is claimed is: 
     
         1 . An electrostatic chuck, comprising:
 a pedestal with a support surface for supporting a substrate and a second surface opposite from the support surface;   a chucking electrode within the pedestal;   a biasing electrode within the pedestal;   a heating element within the pedestal;   a shaft coupled to the second surface of the pedestal; and   a rotation assembly coupled to the shaft to rotate the shaft and the pedestal.   
     
     
         2 . The electrostatic chuck of  claim 1 , wherein the rotation assembly is a magnetically driven rotation assembly. 
     
     
         3 . The electrostatic chuck of  claim 1 , wherein the shaft rotates the pedestal, the chucking electrode, the biasing electrode, and the heating device. 
     
     
         4 . The electrostatic chuck of  claim 1 , wherein the heating element comprises resistive heating elements. 
     
     
         5 . The electrostatic chuck of  claim 1 , wherein the heating element comprises a plurality of lamps. 
     
     
         6 . The electrostatic chuck of  claim 1 , wherein the electrostatic chuck is at least partially within a chamber. 
     
     
         7 . The electrostatic chuck of  claim 6 , wherein the shaft is within an outer shaft that does not rotate. 
     
     
         8 . The electrostatic chuck of  claim 7 , wherein the interior of the shaft is configured to be at atmospheric pressure, and a volume between shaft and the interior of the outer shaft is configured to be at a vacuum pressure. 
     
     
         9 . The electrostatic chuck of  claim 1 , further comprising:
 a lifting unit coupled to the shaft, wherein the lifting unit is configured to vertically displace the pedestal.   
     
     
         10 . The electrostatic chuck of  claim 1 , wherein seven wires extend up the shaft to contact the chucking electrode, the biasing electrode, and the heating element. 
     
     
         11 . The electrostatic chuck of  claim 10 , wherein the wires are coupled to a slip-ring connector in order to allow for rotation of the wires. 
     
     
         12 . A semiconductor tool, comprising:
 a chamber;   a first shaft through the chamber, wherein a baffle between the first shaft and the chamber seals the chamber;   a second shaft within the first shaft;   a pedestal over a first end of the second shaft within the chamber; and   a rotation assembly coupled to the second shaft to rotate the second shaft and the pedestal relative to the first shaft.   
     
     
         13 . The semiconductor tool of  claim 12 , wherein the rotation assembly is a magnetic drive assembly. 
     
     
         14 . The semiconductor tool of  claim 13 , wherein a first magnet is attached to the second shaft, and wherein a second magnet is magnetically coupled to the first magnet, and wherein the second magnet is outside the first shaft. 
     
     
         15 . The semiconductor tool of  claim 12 , further comprising a rotating electrical feedthrough below the first shaft and the second shaft. 
     
     
         16 . The semiconductor tool of  claim 15 , wherein the rotating electrical feedthrough is a slip-ring feedthrough. 
     
     
         17 . The semiconductor tool of  claim 15 , wherein conductive wires pass from the rotating electrical feedthrough to components in the pedestal. 
     
     
         18 . The semiconductor tool of  claim 17 , wherein the components in the pedestal comprise a chucking electrode, a bias electrode, and a heating element. 
     
     
         19 . A semiconductor tool, comprising:
 a chamber;   a pedestal within the chamber, wherein the pedestal comprises a chucking electrode, a bias electrode, and a heating element;   a first shaft through a bottom of the chamber;   a second shaft through the bottom of the chamber and within the first shaft, wherein the pedestal is coupled to the second shaft;   a baffle between a portion of the first shaft and the chamber to seal the chamber;   a vacuum feedthrough at an end of the second shaft opposite from the pedestal; and   a radio frequency (RF) rotary feedthrough below the vacuum feedthrough.   
     
     
         20 . The semiconductor tool of  claim 19 , wherein the RF rotary feedthrough is a slip-ring feedthrough.