Power electronic assembly and power module for embedding in a printed circuit board

Abstract

A power module for PCB embedding includes: a leadframe; a power semiconductor die with a first load terminal and control terminal at a first side of the die and a second load terminal at the opposite side, the second load terminal soldered to the leadframe; a first metal clip soldered to the first load terminal and forming a first terminal of the power module at a first side of the power module; and a second metal clip soldered to the control terminal and forming a second terminal of the power module at the first side of the power module. The leadframe forms a third terminal of the power module at the first side of the power module, or a third metal clip is soldered to the leadframe and forms the third terminal. The power module terminals are coplanar within +/−30 μm at the first side of the power module.

What is claimed is: 
     
         1 . A power electronic assembly, comprising:
 a printed circuit board (PCB); and   a power module embedded in the PCB,   wherein the power module comprises:
 a leadframe; 
 a power semiconductor die having a first load terminal and a control terminal at a first side of the power semiconductor die and a second load terminal at a second side opposite the first side, the second load terminal being soldered to the leadframe; 
 a first metal clip soldered to the first load terminal and forming a first terminal of the power module at a first side of the power module; and 
 a second metal clip soldered to the control terminal and forming a second terminal of the power module at the first side of the power module, 
   wherein the leadframe extends to the first side of the power module and forms a third terminal of the power module at the first side of the power module, or a third metal clip is soldered to the leadframe and forms the third terminal of the power module,   wherein the PCB includes electrically conductive vias that extend through one or more insulating layers of the PCB and contact the first terminal, the second terminal and the third terminal of the power module at the first side of the power module.   
     
     
         2 . The power electronic assembly of  claim 1 , wherein the first terminal, the second terminal and the third terminal of the power module are coplanar within +/−30 μm at the first side of the power module. 
     
     
         3 . The power electronic assembly of  claim 1 , wherein the power module is a molded module. 
     
     
         4 . The power electronic assembly of  claim 1 , wherein the first metal clip of the power module has a plurality of slots configured as a reservoir for accommodating solder paste used to solder the first metal clip to the first load terminal of the power semiconductor die. 
     
     
         5 . The power electronic assembly of  claim 1 , wherein the second metal clip of the power module has one or more slots configured as a reservoir for accommodating solder paste used to solder the second metal clip to the control terminal of the power semiconductor die. 
     
     
         6 . The power electronic assembly of  claim 1 , wherein the first metal clip of the power module has a plurality of slots configured as a reservoir for accommodating solder paste used to solder the first metal clip to the first load terminal of the power semiconductor die, and wherein the second metal clip of the power module has one or more slots configured as a reservoir for accommodating solder paste used to solder the second metal clip to the control terminal of the power semiconductor die. 
     
     
         7 . The power electronic assembly of  claim 1 , wherein the power semiconductor die has a thickness less than 100 μm, and wherein each of the first load terminal, the second load terminal and the control terminal of the power semiconductor die comprises Cu and has a thickness less than 10 μm. 
     
     
         8 . The power electronic assembly of  claim 1 , wherein the third terminal of the power module at the first side of the power module is formed by a region of the leadframe that extends to the first side of the power module. 
     
     
         9 . The power electronic assembly of  claim 1 , wherein the third terminal of the power module at the first side of the power module is formed by the third metal clip soldered to the leadframe. 
     
     
         10 . A power module for embedding in a printed circuit board (PCB), the power module comprising:
 a leadframe;   a power semiconductor die having a first load terminal and a control terminal at a first side of the power semiconductor die and a second load terminal at a second side opposite the first side, the second load terminal being soldered to the leadframe;   a first metal clip soldered to the first load terminal and forming a first terminal of the power module at a first side of the power module; and   a second metal clip soldered to the control terminal and forming a second terminal of the power module at the first side of the power module,   wherein the leadframe extends to the first side of the power module and forms a third terminal of the power module at the first side of the power module, or a third metal clip is soldered to the leadframe and forms the third terminal of the power module,   wherein the first terminal, the second terminal and the third terminal of the power module are coplanar within +/−30 μm at the first side of the power module.   
     
     
         11 . The power module of  claim 10 , wherein the first metal clip has a plurality of slots configured as a reservoir for accommodating solder paste used to solder the first metal clip to the first load terminal of the power semiconductor die. 
     
     
         12 . The power module of  claim 10 , wherein the second metal clip has one or more slots configured as a reservoir for accommodating solder paste used to solder the second metal clip to the control terminal of the power semiconductor die. 
     
     
         13 . The power module of  claim 10 , wherein the power semiconductor die and part of the leadframe are embedded in a molding compound. 
     
     
         14 . The power module of  claim 10 , wherein the first metal clip has a plurality of slots configured as a reservoir for accommodating solder paste used to solder the first metal clip to the first load terminal of the power semiconductor die, and wherein the second metal clip has one or more slots configured as a reservoir for accommodating solder paste used to solder the second metal clip to the control terminal of the power semiconductor die. 
     
     
         15 . The power module of  claim 10 , wherein the power semiconductor die has a thickness less than 100 μm, and wherein each of the first load terminal, the second load terminal and the control terminal of the power semiconductor die comprises Cu and has a thickness less than 10 μm. 
     
     
         16 . The power module of  claim 10 , wherein the third terminal of the power module at the first side of the power module is formed by a region of the leadframe that extends to the first side of the power module. 
     
     
         17 . The power module of  claim 10 , wherein the third terminal of the power module at the first side of the power module is formed by the third metal clip soldered to the leadframe.