Inventor · disambiguated record
Chee Voon Tan
Also filed as: TAN CHEE VOON
11 granted patents·11 pending applications·13 citations·filing 2009–2024
82Inventor score
Top patents by PatentIndex Score
22 records- 0183US9478484B2Semiconductor packages and methods of formation thereofINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2012·Granted Oct 25, 2016·7 cites·24 claims
- 0271US9111772B1Electronic array and chip packageINFINEON TECHNOLOGIES AG·Filed 2014·Granted Aug 18, 2015·3 cites·25 claims
- 0368US10886199B1Molded semiconductor package with double-sided coolingINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 5, 2021·1 cites·20 claims
- 0468US2023282553A1Power electronic assembly and power module for embedding in a printed circuit boardINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0567US11699640B2Power semiconductor module for PCB embedding, power electronic assembly having a power module embedded in a PCB, and corresponding methods of productionINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jul 11, 2023·0 cites·17 claims
- 0665US2023049564A1Semiconductor Package with Lead Tip Inspection FeatureINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 0763US9263421B2Semiconductor device having multiple chips mounted to a carrierINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 16, 2016·2 cites·17 claims
- 0862US2023051100A1Semiconductor package having a lead frame and a clip frameINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 0960US2025062273A1Package with Vertical Electronic Components Held Together by a ClipINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1058US11587800B2Semiconductor package with lead tip inspection featureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Feb 21, 2023·0 cites·11 claims
- 1157US2025140729A1Molded power package with vertical interconnectINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1257US2025140734A1Molded power die package with vertical interconnectINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1355US11515244B2Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufactureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 29, 2022·0 cites·11 claims
- 1455US2025054842A1Package with concave wettability and/or metallization layerINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1552US11302613B2Double-sided cooled molded semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 12, 2022·0 cites·20 claims
- 1651US2024006260A1Encapsulated package with exposed electrically conductive structures and sidewall recessINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1751US2023230903A1Semiconductor chip, chip system, method of forming a semiconductor chip, and method of forming a chip systemINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1850US2025096082A1Interconnect clip for vertically stacked die arrangementINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1947US11211356B2Power semiconductor package and method for fabricating a power semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Dec 28, 2021·0 cites·17 claims
- 2040US8664753B2Semiconductor device with protruding component portion and method of packagingLEE TECK SIM·Filed 2009·Granted Mar 4, 2014·0 cites·25 claims
- 2140US2021313294A1Semiconductor package and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 2231US10037934B2Semiconductor chip package having contact pins at short side edgesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Jul 31, 2018·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →