Method and system for optimizing optical inspection of patterned structures

Abstract

A system for use in metrology of a patterned structure, the system including a data input utility configured to receive a first type of data related to the patterned structure, the first type of data was obtained by a first type of metrology system and comprises first type measurements and first geometrical information regarding the patterned structure. The data input utility is also configured to receive a second type of data related to the patterned structure, the second type of data was obtained by a second type of metrology system and comprises second type measurement results and second geometrical information regarding the patterned structure; the second type of metrology system differs from the first type of metrology system; and a data processing and analyzing utility configured to determine values of parameters of interest based on the first type of data and the second type of data.

We claim: 
     
         1 . A system for use in metrology of a patterned structure, the system comprising:
 a data input utility configured to receive:
 (a) first type of data related to the patterned structure, the first type of data was obtained by a first type of metrology system and comprises first type measurements and first geometrical information regarding the patterned structure; 
 (b) second type of data related to the patterned structure, the second type of data was obtained by a second type of metrology system and comprises second type measurement results and second geometrical information regarding the patterned structure; the second type of metrology system differs from the first type of metrology system; and 
   a data processing and analyzing utility configured to determine values of parameters of interest based on the first type of data and the second type of data.   
     
     
         2 . The system according to  claim 1 , wherein the parameters of interest comprise (i) a first parameter of interest that is related to the first type of metrology and (ii) a second parameter of interest that is related to the second type of metrology. 
     
     
         3 . The system according to  claim 2 , wherein the first parameter of interest is a parameter of a first model for interpreting the first type of measurements. 
     
     
         4 . The system according to  claim 3 , wherein the second parameter of interest is a parameter of a second model for interpreting the second type of measurements. 
     
     
         5 . The system according to  claim 4 , wherein the data processing and analyzing utility is configured to determine values of parameters of interest by applying an iterative process, wherein the iterative process comprises updating the first model based on the second type of data to provide a currently updated first model, and updating the second model based on the first type of data. 
     
     
         6 . The system according to  claim 4 , wherein the updating of the first model comprises optimizing the first model, and wherein the updating of the second model comprises optimizing the second model. 
     
     
         7 . The system according to  claim 6 , wherein the optimizing of the first model and the optimizing of the second model provides an optimized first model and an optimized second model that once used provide an enhanced performance of the first type metrology system and an enhanced performance of the second type metrology system that cannot be obtained separately. 
     
     
         8 . The system according to  claim 1 , wherein the first type of metrology system is an imaging metrology system and wherein the second type of metrology system is an non-imaging metrology system. 
     
     
         9 . The system according to  claim 1 , wherein the second type of metrology system is a helium ion beam microscopy system. 
     
     
         10 . The system according to  claim 1 , wherein the second type of metrology system is an atomic force microscope. 
     
     
         11 . The system according to  claim 1 , wherein the first type of metrology system is a scatterometry metrology system. 
     
     
         12 . The system according to  claim 1 , wherein the first type of metrology system is an optical critical dimension (OCD) metrology system and wherein the second type of metrology system is a scanning electron microscope (SEM). 
     
     
         13 . The system according to  claim 12 , wherein the first type of data comprises critical dimension (CD) values obtained by the OCD metrology system, the second type of data comprises CD values obtained by the SEM, wherein the data processing and analyzing utility are configured to determine the values of parameters of interest by correlating between the CD values obtained by the OCD metrology system and the CD values obtained by the SEM. 
     
     
         14 . The system according to  claim 12 , wherein the first type of data comprises side wall angle (SWA) values obtained by the OCD metrology system, the second type of data comprises SWA values obtained by the SEM, wherein the data processing and analyzing utility are configured to determine the values of parameters of interest by correlating between the SWA values obtained by the OCD metrology system and the SWA values obtained by the SEM. 
     
     
         15 . The system according to  claim 1 , wherein the first type measurements and the second type measurements are taken from measurement sites of a substrate that comprises the patterned structure. 
     
     
         16 . The system according to  claim 15 , wherein the data processing and analyzing utility configured to adjust the first type measurements by using correlation curves to provide adjusted first type measurements, and use the adjusted first type measurements during a data interpretation process applied on the second type of data. 
     
     
         17 . The system according to  claim 15 , wherein the data processing and analyzing utility is configured to reduce a number of floating parameters of the data interpretation process. 
     
     
         18 . The system according to  claim 15 , wherein the data processing and analyzing utility is configured to stabilize measurements of non-floating parameters. 
     
     
         19 . A computer implemented method for use in metrology of a patterned structure, the method comprising:
 receiving, by a data input utility, (a) first type of data related to the patterned structure, the first type of data was obtained by a first type of metrology system and comprises first type measurements and first geometrical information regarding the patterned structure; and (b) second type of data related to the patterned structure, the second type of data was obtained by a second type of metrology system and comprises second type measurement results and second geometrical information regarding the patterned structure; the second type of metrology system differs from the first type of metrology system; and   determining, by a data processing and analyzing utility, values of parameters of interest based on the first type of data and the second type of data.   
     
     
         20 . A non-transitory computer readable medium that stores instructions for:
 receiving, by a data input utility, (a) first type of data related to the patterned structure, the first type of data was obtained by a first type of metrology system and comprises first type measurements and first geometrical information regarding the patterned structure; and (b) second type of data related to the patterned structure, the second type of data was obtained by a second type of metrology system and comprises second type measurement results and second geometrical information regarding the patterned structure; the second type of metrology system differs from the first type of metrology system; and   determining, by a data processing and analyzing utility, values of parameters of interest based on the first type of data and the second type of data.