Shielded module fabrication methods and devices

Abstract

Shielded module fabrication methods and devices. In some embodiments, a carrier assembly can be provided for processing of packaged modules. The carrier assembly can include a plate having a first side that defines a plurality of openings, and an adhesive layer implemented on the first side of the plate. The adhesive layer can define a plurality of openings arranged to substantially match the openings of the plate, with each opening of the adhesive layer being dimensioned such that the adhesive layer is capable of providing an adhesive engagement between an underside perimeter portion of a package and a perimeter portion about the corresponding opening of the first side of the plate.

1 . A carrier assembly for processing packaged modules, comprising:
 a plate having a first side that defines a plurality of openings; and   an adhesive layer implemented on the first side of the plate, the adhesive layer defining a plurality of openings arranged to substantially match the openings of the plate, each opening of the adhesive layer dimensioned such that the adhesive layer is capable of providing an adhesive engagement between an underside perimeter portion of a package and a perimeter portion about the corresponding opening of the first side of the plate.   
     
     
         2 - 31 . (canceled)