Semiconductor devices and methods of manufacturing semiconductor devices

Abstract

A semiconductor device can comprise a substrate dielectric structure and a substrate conductive structure that traverses the substrate dielectric structure and comprises first and second substrate terminals; an electronic component with a component terminal coupled to the first substrate terminal; and a first antenna element with a first element terminal coupled to the second substrate terminal, a first element head side adjacent a first antenna pattern, a first element base side opposite the first element side, and a first element sidewall. The first element terminal can be exposed from the first element dielectric structure at the first element base side or at the first element sidewall. The first antenna pattern can be coupled to the substrate through the first element terminal. The substrate conductive structure can couple the first antenna element to the electronic component. Other examples and methods are also disclosed.

1 . A semiconductor device comprising:
 a substrate comprising:
 a substrate top side; 
 a substrate bottom side; 
 a substrate dielectric structure between the substrate top side and the substrate bottom side; and 
 a substrate conductive structure traversing the substrate dielectric structure and comprising:
 a first substrate terminal; and 
 a second substrate terminal at the substrate top side; 
 
   an electronic component coupled to the substrate and comprising:
 a component terminal coupled to the first substrate terminal; and 
   a first antenna element coupled to the substrate and comprising:
 a first element dielectric structure; 
 a first antenna pattern coupled to the first element dielectric structure; 
 a first element terminal coupled to the second substrate terminal; 
 a first element head side adjacent first antenna pattern; 
 a first element base side opposite the first element side; and 
 a first element sidewall between the first element head side and the first element base side; 
   wherein:
 the first element terminal is exposed from the first element dielectric structure at at least one of the first element base side or the first element sidewall; 
 the first antenna pattern is coupled to the substrate through the first element terminal; 
 the first antenna element is coupled to the substrate outside a footprint of the electronic component; and 
 the substrate conductive structure couples the first antenna element to the electronic component.