Inventor · disambiguated record
Kyoung Yeon Lee
Also filed as: LEE KYOUNG YEON
27 granted patents·9 pending applications·25 citations·filing 2013–2025
94Inventor score
Top patents by PatentIndex Score
36 records- 0193US10553542B2Semiconductor package with EMI shield and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Feb 4, 2020·9 cites·20 claims
- 0292US12046798B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jul 23, 2024·2 cites·16 claims
- 0387US10818569B2Semiconductor device and a method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2018·Granted Oct 27, 2020·4 cites·20 claims
- 0486US12300584B2Semiconductor device including heat sink with exposed side from encapsulant and a method of manufacturing thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted May 13, 2025·0 cites·20 claims
- 0585US12243834B2Semiconductor package with EMI shield and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Mar 4, 2025·0 cites·20 claims
- 0685US11018079B2Land structure for semiconductor package and method thereforAMKOR TECHNOLOGY INC·Filed 2017·Granted May 25, 2021·3 cites·13 claims
- 0784US12476171B2Land structure for semiconductor package and method thereforAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Nov 18, 2025·0 cites·15 claims
- 0880US12431611B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 0980US11967567B2Semiconductor package with EMI shield and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Apr 23, 2024·0 cites·20 claims
- 1080US11075170B2Semiconductor package with EMI shield and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jul 27, 2021·1 cites·21 claims
- 1179US11915998B2Semiconductor device and a method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Feb 27, 2024·0 cites·20 claims
- 1279US2025192008A1Semiconductor device and a method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 1378US10020263B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jul 10, 2018·3 cites·20 claims
- 1477US12278154B2Semiconductor device and a method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Apr 15, 2025·0 cites·19 claims
- 1573US11637073B2Semiconductor package with EMI shield and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Apr 25, 2023·0 cites·17 claims
- 1673US11417589B2Semiconductor device and a method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Aug 16, 2022·0 cites·20 claims
- 1773US2024047852A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 1872US11908779B2Land structure for semiconductor package and method thereforAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Feb 20, 2024·0 cites·19 claims
- 1970US11742565B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 2070US11664289B2Semiconductor device and a method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted May 30, 2023·0 cites·11 claims
- 2170US9054089B2Lead frame package having discharge holes and method of manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2013·Granted Jun 9, 2015·2 cites·20 claims
- 2269US9911685B2Land structure for semiconductor package and method thereforAMKOR TECHNOLOGY INC·Filed 2016·Granted Mar 6, 2018·1 cites·17 claims
- 2367US12489101B2Electronic devices having inner electronic component interposed between substrates and method of manufacturing the sameAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Dec 2, 2025·0 cites·20 claims
- 2462US10840169B2Semiconductor device and a method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Nov 17, 2020·0 cites·17 claims
- 2561US11101540B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Aug 24, 2021·0 cites·23 claims
- 2660US2025336740A1Electronic devices and a methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 2759US2025149429A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 2858US2025022857A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 2955US2024234232A9Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Application pending·0 cites
- 3054US2024096858A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Application pending·0 cites
- 3152US9129975B2Method of forming a thin substrate chip scale package device and structureAMKOR TECHNOLOGY INC·Filed 2013·Granted Sep 8, 2015·0 cites·19 claims
- 3250US11521918B2Semiconductor device having component mounted on connection bar and lead on top side of lead frame and method of manufacturing semiconductor device thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Dec 6, 2022·0 cites·18 claims
- 3346US9633932B2Lead frame package having discharge hole and method of manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2015·Granted Apr 25, 2017·0 cites·20 claims
- 3446US9293398B2Land structure for semiconductor package and method thereforAMKOR TECHNOLOGY INC·Filed 2013·Granted Mar 22, 2016·0 cites·18 claims
- 3545US2015332991A1Method of forming a thin substrate chip scale package device and structureAMKOR TECHNOLOGY INC·Filed 2015·Application pending·0 cites
- 3635US2017323863A1Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →