Electronic device

Abstract

An electronic device and a method of manufacturing an electronic device are provided. The electronic device includes an electronic component, a carrier, and a lead. The electronic component has a lateral surface. The carrier supports the electronic component. The lead is electrically connected to the electronic component and disposed adjacent to the lateral surface of the electronic component. The carrier and the lead are configured to block an electromagnetic wave between the electronic component and an external of the electronic device.

What is claimed is: 
     
         1 . An electronic device, comprising:
 an electronic component having a lateral surface;   a carrier supporting the electronic component; and   a lead electrically connected to the electronic component and disposed adjacent to the lateral surface of the electronic component,   wherein the carrier and the lead are configured to block an electromagnetic wave between the electronic component and an external of the electronic device.   
     
     
         2 . The electronic device of  claim 1 , further comprising a connecting element connected to the electronic component through the carrier, wherein the connecting element has a curved surface covered by an encapsulant. 
     
     
         3 . The electronic device of  claim 1 , further comprising an encapsulant encapsulating the carrier and the lead, wherein a portion of the lead is exposed by the encapsulant and a portion of the carrier is exposed by the encapsulant. 
     
     
         4 . The electronic device of  claim 3 , further comprising a protective layer covering the portion of the lead and the portion of the carrier, wherein the protective layer is configured to block the electromagnetic wave between the electronic component and the external of the electronic device. 
     
     
         5 . The electronic device of  claim 4 , wherein the protective layer and the encapsulant comprise a substantially identical material. 
     
     
         6 . The electronic device of  claim 1 , wherein the lead has a curved surface, and the carrier has a curved surface facing the curved surface of the lead. 
     
     
         7 . The electronic device of  claim 6 , wherein the curved surface of the lead and the curved surface of the carrier have different curvatures. 
     
     
         8 . The electronic device of  claim 2 , wherein the connecting element has a first upper surface, a second upper surface, and a first latch structure extending from the first upper surface toward the second upper surface. 
     
     
         9 . The electronic device of  claim 8 , wherein the connecting element has a second latch structure matching a corner of the carrier. 
     
     
         10 . The electronic device of  claim 9 , further comprising an encapsulant encapsulating the electronic component and in contact with the first latch structure and the second latch structure. 
     
     
         11 . An electronic device, comprising:
 an encapsulant; and   a conductive structure encapsulated by the encapsulant and comprising:
 a carrier; 
 a connecting element supporting the carrier and having a first upper surface exposed from the encapsulant; and 
 a first lead spaced apart from the connecting element and having a first upper surface exposed from the encapsulant, 
   wherein an area of the first upper surface of the connecting element is less than an area of the first upper surface of the first lead.   
     
     
         12 . The electronic device of  claim 11 , wherein the connecting element directly contacts the carrier, and the first lead is spaced apart from the carrier. 
     
     
         13 . The electronic device of  claim 11 , wherein a width of the first upper surface of the connecting element is less than a width of the first upper surface of the first lead in a cross-sectional view. 
     
     
         14 . The electronic device of  claim 11 , further comprising a second lead adjacent to the first lead, wherein the first upper surface of the connecting element is between the first lead and the second lead. 
     
     
         15 . The electronic device of  claim 11 , wherein the connecting element has a bottom surface opposite to the first upper surface of the connecting element and exposed by the encapsulant, and an area of the bottom surface is greater than the area of the first upper surface of the connecting element. 
     
     
         16 . The electronic device of  claim 15 , wherein the connecting element has a first edge and a second edge, and the first edge and the second edge overlap the bottom surface of the connecting element in a direction perpendicular to the bottom surface. 
     
     
         17 . The electronic device of  claim 16 , wherein the connecting element has a second upper surface covered by the encapsulant, a first side extending from the first edge to the second upper surface, and a second side extending from the second edge to the second upper surface, and wherein the first side is non-parallel with the second side. 
     
     
         18 . An electronic device, comprising:
 an electronic component;   an encapsulant encapsulating the electronic component and having a top surface and a lateral surface; and   a lead disposed at a side of the electronic component and having a top surface substantially aligned with the top surface of the encapsulant, a lateral surface substantially aligned with the lateral surface of the encapsulant, a curved surface extending between the top surface of the lead and the lateral surface of the lead.   
     
     
         19 . The electronic device of  claim 18 , wherein the curved surface and the lateral surface of the lead have different surface roughnesses. 
     
     
         20 . The electronic device of  claim 18 , further comprising a carrier supporting the electronic component, wherein the carrier has a top surface substantially aligned with the top surface of the lead.