Substrate processing apparatus, method of temperature measuring, and method of temperature controlling

Abstract

Disclosed are a substrate processing apparatus, a temperature measurement method and a temperature control method. The substrate processing apparatus includes a chamber, a susceptor configured such that a substrate is placeable thereon, a heater unit configured to heat the susceptor, a temperature measurement unit configured to measure temperatures of the substrate, and a controller configured to control the heater unit using the temperatures of the substrate, and the temperature measurement unit includes a first measurement unit configured to measure temperatures of the substrate inside the chamber, a second measurement unit configured to measure temperatures of the substrate outside the chamber, a storage unit configured to store first data measured by the first measurement unit, second data measured by the second measurement unit, and third data calculated using the first data and the second data, and a determiner configured to calculate temperatures of the substrate using the third data.

1 . A substrate processing apparatus comprising:
 a chamber configured to provide a processing space;   a susceptor configured such that a substrate is placeable thereon;   a heater unit configured to heat the susceptor;   a temperature measurement unit configured to measure temperatures of the substrate; and   a controller configured to control the heater unit using the temperatures of the substrate,   wherein the temperature measurement unit comprises:
 a first measurement unit configured to measure temperatures of the substrate inside the chamber; 
 a second measurement unit configured to measure temperatures of the substrate outside the chamber; 
 a storage unit configured to store first data measured by the first measurement unit, second data measured by the second measurement unit, and third data calculated using the first data and the second data; and 
 a determiner configured to calculate temperatures of the substrate using the third data. 
   
     
     
         2 . The substrate processing apparatus according to  claim 1 , wherein the third data comprises difference values between the first data and the second data. 
     
     
         3 . The substrate processing apparatus according to  claim 2 , wherein the determiner calculates the temperatures of the substrate by adding the third data to the second data. 
     
     
         4 . The substrate processing apparatus according to  claim 1 , wherein the second measurement unit is disposed on a slot valve. 
     
     
         5 . The substrate processing apparatus according to  claim 4 , wherein the second measurement unit comprises a plurality of temperature measurement devices. 
     
     
         6 . A temperature measurement method comprising:
 taking a substrate placed inside a chamber out of the chamber;   measuring temperatures of the substrate outside the chamber; and   determining temperatures of the substrate by reflecting correction values, stored in advance, in the temperatures of the substrate measured outside the chamber.   
     
     
         7 . The temperature measurement method according to  claim 6 , wherein, in the measuring the temperatures of the substrate outside the chamber, the temperatures of the substrate is measured around a slot valve. 
     
     
         8 . The temperature measurement method according to  claim 6 , wherein the correction values are generated by:
 storing first data acquired by measuring temperatures of another substrate inside the chamber;   storing second data acquired by measuring temperatures of the substrate outside the chamber; and   storing third data calculated using the first data and the second data as the correction values necessary for temperature measurement.   
     
     
         9 . The temperature measurement method according to  claim 8 , wherein the third data comprises difference values between the first data and the second data. 
     
     
         10 . A temperature control method for controlling a temperature of a unit configured to heat the substrate using the temperatures of the substrate determined using the temperature measurement method according to  claim 9 .