Polishing method, polishing apparatus, and non-transitory computer-readable recording medium
Abstract
A polishing method includes: detecting, by an acoustic sensor, an environmental sound including a sound arising from a polishing environment of a substrate to output an environmental sound signal representing the environmental sound from the acoustic sensor; generating an environmental sound spectrum indicating a relationship between a frequency and a sound pressure level from the environmental sound signal; detecting, by the acoustic sensor, a polishing sound of the substrate while pressing the substrate against a polishing pad to polish the substrate, to output a polishing sound signal representing the polishing sound from the acoustic sensor; generating a polishing sound spectrum indicating a relationship between a frequency and a sound pressure level from the polishing sound signal; calculating a difference between the polishing sound spectrum and the environmental sound spectrum to generate a differential spectrum; and monitoring a polishing progress of the substrate based on the differential spectrum.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A polishing method comprising:
detecting, by an acoustic sensor, an environmental sound comprising a sound arising from a polishing environment of a substrate to output an environmental sound signal representing the environmental sound from the acoustic sensor; generating an environmental sound spectrum indicating a relationship between a frequency and a sound pressure level from the environmental sound signal; detecting, by the acoustic sensor, a polishing sound of the substrate while pressing the substrate against a polishing surface of a polishing pad to polish the substrate, to output a polishing sound signal representing the polishing sound from the acoustic sensor; generating a polishing sound spectrum indicating a relationship between a frequency and a sound pressure level from the polishing sound signal; calculating a difference between the polishing sound spectrum and the environmental sound spectrum to generate a differential spectrum; and monitoring a polishing progress of the substrate based on the differential spectrum.
2 . The polishing method according to claim 1 , further comprising:
generating a differential spectrum map indicating over-time changes in the differential spectrum by arranging the differential spectrum along a time axis, wherein the monitoring the polishing progress comprises monitoring the polishing progress based on a change in the sound pressure level in the differential spectrum map.
3 . The polishing method according to claim 1 , wherein
the monitoring the polishing progress comprises detecting a polishing endpoint of the substrate, and the polishing method further comprises ending polishing of the substrate based on the polishing endpoint.
4 . The polishing method according to claim 1 , wherein
the environmental sound spectrum is generated by performing a Fourier transform on the environmental sound signal, and the polishing sound spectrum is generated by performing a Fourier transform on the polishing sound signal.
5 . The polishing method according to claim 1 , wherein
the environmental sound is a sound detected after start of polishing of the substrate.
6 . The polishing method according to claim 1 , wherein
the environmental sound is a sound detected when a polishing apparatus performing polishing of the substrate is operated before polishing the substrate.
7 . The polishing method according to claim 1 , wherein
the generating the environmental sound spectrum comprises: generating a plurality of environmental sound spectra from the environmental sound signals outputted from the acoustic sensor in a predetermined period, calculating a representative value of a sound pressure level for each frequency from the plurality of environmental sound spectra, and generating the environmental sound spectrum indicating a relationship between the frequency and the representative value of the sound pressure level.
8 . The polishing method according to claim 1 , further comprising:
monitoring the polishing environment based on the environmental sound spectrum.
9 . A polishing apparatus comprising:
a polishing table supporting a polishing pad; a polishing head for pressing a substrate against a polishing surface of the polishing pad; an acoustic sensor attached to the polishing table or the polishing head and detecting a sound to output a signal representing the sound; and a processing system generating a frequency spectrum from the signal outputted from the acoustic sensor, wherein the acoustic sensor is configured to:
detect an environmental sound comprising a sound arising from a polishing environment of the substrate to output an environmental sound signal representing the environmental sound, and
detect a polishing sound of the substrate to output a polishing sound signal representing the polishing sound, and
the processing system is configured to:
generate an environmental sound spectrum indicating a relationship between a frequency and a sound pressure level from the environmental sound signal,
generate a polishing sound spectrum indicating a relationship between a frequency and a sound pressure level from the polishing sound signal,
calculate a difference between the polishing sound spectrum and the environmental sound spectrum to generate a differential spectrum, and
monitor a polishing progress based on the differential spectrum.
10 . The polishing apparatus according to claim 9 , wherein
the processing system is configured to:
arrange the differential spectrum along a time axis to generate a differential spectrum map indicating over-time changes in the differential spectrum, and
monitor the polishing progress based on a change in the sound pressure level in the differential spectrum map.
11 . The polishing apparatus according to claim 9 , wherein the processing system is configured to:
monitor the polishing progress to detect a polishing endpoint of the substrate, and end polishing of the substrate based on the polishing endpoint.
12 . The polishing apparatus according to claim 9 , wherein the processing system is configured to:
generate the environmental sound spectrum by performing a Fourier transform on the environmental sound signal, and generate the polishing sound spectrum by performing a Fourier transform on the polishing sound signal.
13 . The polishing apparatus according to claim 9 , wherein the processing system is configured to issue a command to the acoustic sensor to detect the environmental sound after start of polishing of the substrate.
14 . The polishing apparatus according to claim 9 , wherein the processing system is configured to issue a command to the acoustic sensor to detect the environmental sound when the polishing apparatus is operated before polishing the substrate.
15 . The polishing apparatus according to claim 9 , wherein
the processing system is configured to: generate a plurality of environmental sound spectra from the environmental sound signals outputted from the acoustic sensor in a predetermined period, calculate a representative value of a sound pressure level for each frequency from the plurality of environmental sound spectra, and generate the environmental sound spectrum indicating a relationship between the frequency and the representative value of the sound pressure level.
16 . The polishing apparatus according to claim 9 , wherein the processing system is configured to monitor the polishing environment based on the environmental sound spectrum.
17 . A non-transitory computer-readable recording medium recording a program causing a computer to execute:
detecting, by an acoustic sensor, an environmental sound comprising a sound arising from a polishing environment of a substrate to output an environmental sound signal representing the environmental sound from the acoustic sensor; generating an environmental sound spectrum indicating a relationship between a frequency and a sound pressure level from the environmental sound signal; detecting, by the acoustic sensor, a polishing sound of the substrate while pressing the substrate against a polishing surface of a polishing pad to polish the substrate, to output a polishing sound signal representing the polishing sound from the acoustic sensor; generating a polishing sound spectrum indicating a relationship between a frequency and a sound pressure level from the polishing sound signal; calculating a difference between the polishing sound spectrum and the environmental sound spectrum to generate a differential spectrum; and monitoring a polishing progress of the substrate based on the differential spectrum.
18 . The non-transitory computer-readable recording medium according to claim 17 , wherein the program is configured to cause the computer to further execute: generating a differential spectrum map indicating over-time changes in the differential spectrum by arranging the differential spectrum along a time axis, and
the monitoring the polishing progress comprises monitoring the polishing progress based on a change in the sound pressure level in the differential spectrum map.Join the waitlist — get patent alerts
Track US2024424635A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.