Elastic membrane, polishing head, and polishing method

Abstract

An elastic membrane that can improve elasticity is disclosed. The elastic membrane has a pressing portion and a partition wall having a bulging structure.

What is claimed is: 
     
         1 . An elastic membrane applicable to a polishing head for polishing a substrate, comprising:
 a pressing portion configured to press against the substrate; and   a partition wall having a bulging structure configured to form a pressurizing chamber for applying a pressing force to the pressing portion.   
     
     
         2 . The elastic membrane according to  claim 1 ,
 wherein the partition wall has a first wall portion and a second wall portion configured to form the bulge structure, and   wherein the first wall portion and the second wall portion have:
 a wide portion configured to be spaced apart from each other; and 
 a clamp portion configured to be connected to the wide portion and be close to each other. 
   
     
     
         3 . The elastic membrane according to  claim 1 ,
 wherein the partition wall has a first wall portion and a second wall portion having a V-shaped cross-section configured to be close to each other toward the pressing portion, and   wherein the first wall portion and the second wall portion are connected to each other at the pressing portion.   
     
     
         4 . The elastic membrane according to  claim 1 ,
 wherein the partition wall has a first wall portion, a second wall portion, and a third wall portion having a Y-shaped cross section, and   wherein the third wall portion is connected to the first wall portion and the second wall portion, and extends from a connection portion between the first wall portion and the second wall portion toward the pressing portion.   
     
     
         5 . The elastic membrane according to  claim 1 ,
 wherein the partition wall has a first pressure chamber and a second pressure chamber arranged on both sides of the pressurizing chamber, and   wherein the pressurizing chamber is arranged above the first pressure chamber and the second pressure chamber.   
     
     
         6 . The elastic membrane according to  claim 1 ,
 wherein the elastic membrane has a peripheral wall constituting an outer shape of the elastic membrane, and   wherein the partition wall has a peripheral wall side wall portion being arranged adjacent to the peripheral wall and extending at an angle relative to the pressing portion.   
     
     
         7 . A polishing head comprising:
 an elastic membrane according to  claim 1 ; and   a head body configured to hold the elastic membrane.   
     
     
         8 . The polishing head according to  claim 7 ,
 wherein the head body comprises a partition wall holder configured to hold the partition wall, and   wherein at least a portion of the partition wall holder is arranged in the pressurizing chamber.   
     
     
         9 . The polishing head according to  claim 8 ,
 wherein the polishing head has a widthwise gap formed between the partition wall and the partition wall holder.   
     
     
         10 . A polishing method comprising:
 holding a substrate by an elastic membrane configured to press against the substrate;   supplying a fluid to a pressure chamber formed by a pressing portion configured to press against the substrate, while holding the substrate, to press the substrate against a polishing pad; and   supplying a fluid to a pressurizing chamber formed by a partition wall having a bulge structure, to apply a pressing force to the pressing portion.   
     
     
         11 . The polishing method according to  claim 10 ,
 wherein holding the substrate comprises supplying a fluid to the pressurizing chamber and forming a vacuum in the pressure chamber to form a suction space on a lower surface of the pressing portion and suck the substrate.   
     
     
         12 . The polishing method according to  claim 10 ,
 wherein the polishing method comprises, after polishing of the substrate, forming a vacuum in the pressurizing chamber and supplying a fluid to the pressure chamber to release the substrate from the elastic membrane.   
     
     
         13 . The polishing method according to  claim 10 ,
 wherein the partition wall has a first wall portion and a second wall portion configured to form the bulging structure, and   wherein the first wall portion and the second wall portion have:
 a wide portion configured to be spaced apart from each other; and 
 a clamp portion configured to be connected to the wide portion and be close to each other. 
   
     
     
         14 . The polishing method according to  claim 10 ,
 wherein the partition wall has a first wall portion and a second wall portion having a V-shaped cross-section configured to be close to each other toward the pressing portion, and   wherein the first wall portion and the second wall portion are connected to each other at the pressing portion.   
     
     
         15 . The polishing method according to  claim 10 ,
 wherein the partition wall has a first wall portion, a second wall portion, and a third wall portion having a Y-shaped cross section, and   wherein the third wall portion is connected to the first wall portion and the second wall portion, and extends from a connection portion between the first wall portion and the second wall portion toward the pressing portion.   
     
     
         16 . The polishing method according to  claim 10 ,
 wherein the elastic membrane has a peripheral wall constituting an outer shape of the elastic membrane, and   wherein the partition wall has a peripheral wall side wall portion being arranged adjacent to the peripheral wall and extending at an angle relative to the pressing portion.