Plating membrane

Abstract

A plating membrane includes a support structure extending radially outward from a nozzle that is to direct a flow of a plating solution toward a wafer. The plating membrane also includes a frame, supported by the support structure, having an inner wall that is angled outward from the nozzle. The outward angle of the inner wall relative to the nozzle directs a flow of plating solution from the nozzle in a manner that increases uniformity of the flow of the plating solution toward the wafer, reduces the amount of plating solution that is redirected inward toward the center of the plating membrane, reduces plating material voids in trenches of the wafer (e.g., high aspect ratio trenches), and/or the like.

What is claimed is: 
     
         1 . A plating tool, comprising:
 a controller configured to cause a plating solution to be directed toward a wafer; and   a plating membrane, comprising:
 a frame having an inner wall that is angled outward from a center of the plating membrane,
 wherein an angle of the inner wall is configured to eliminate redirection of the plating solution by the inner wall inward toward the center of the plating membrane. 
 
   
     
     
         2 . The plating tool of  claim 1 , further comprising:
 an anode; and   a power supply connected to the anode and the wafer.   
     
     
         3 . The plating tool of  claim 2 , wherein the power supply is configured to apply a voltage across the anode and the wafer. 
     
     
         4 . The plating tool of  claim 3 , wherein the controller is further configured to:
 cause the power supply to apply the voltage across the anode and the wafer; and   cause the power supply to stop applying the voltage across the anode and the wafer.   
     
     
         5 . The plating tool of  claim 2 , wherein the anode is configured to release plating material into the plating solution. 
     
     
         6 . The plating tool of  claim 1 , further comprising:
 a nozzle;   one or more return lines;   a pump connected to the controller; and   wherein the controller is further configured to:
 cause the pump to pump the plating solution from the one or more return lines to the nozzle. 
   
     
     
         7 . The plating tool of  claim 6 , wherein the controller is further configured to:
 adjust a speed or rate at which the plating solution is pumped through the nozzle.   
     
     
         8 . A plating membrane, comprising:
 a support structure; and   a frame attached to the support structure, wherein the frame comprises:
 an inner wall that is angled radially outward from a center of the plating membrane,
 wherein an angle of the inner wall is configured to eliminate redirection of a solution, that is output from the center of the plating membrane, by the inner wall inward toward the center of the plating membrane. 
 
   
     
     
         9 . The plating membrane of  claim 8 , wherein the support structure comprises a support member extending outward from the center of the plating membrane. 
     
     
         10 . The plating membrane of  claim 8 , further comprising:
 a filter attached to the support structure, wherein the filter is configured to filter the solution.   
     
     
         11 . The plating membrane of  claim 8 , wherein the inner wall is angled along an inner circumference of the frame in a uniform manner. 
     
     
         12 . The plating membrane of  claim 8 , wherein the support structure comprises a plurality of support members located at various locations about a circumference of the plating membrane. 
     
     
         13 . The plating membrane of  claim 12 , wherein the plurality of support members are unevenly spaced about the circumference of the plating membrane. 
     
     
         14 . The plating membrane of  claim 8 , wherein the frame further comprises an attachment point configured to attach the plating membrane to a plating tool. 
     
     
         15 . A plating membrane, comprising:
 a support structure; and   a frame attached to the support structure,
 wherein the frame comprises:
 an inner wall that is angled radially outward from a center of the plating membrane, and 
 
 wherein the frame is configured to:
 eliminate redirection of a solution, that is output from the center of the plating membrane, by the inner wall inward toward the center of the plating membrane. 
 
   
     
     
         16 . The plating membrane of  claim 15 , wherein the inner wall is angled in a uniform manner. 
     
     
         17 . The plating membrane of  claim 15 , wherein the support structure comprises a plurality of support members spaced evenly about a circumference of the plating membrane. 
     
     
         18 . The plating membrane of  claim 15 , wherein the frame is circular. 
     
     
         19 . The plating membrane of  claim 15 , wherein the frame further comprises an attachment point configured to attach to a wall of a plating tool. 
     
     
         20 . The plating membrane of  claim 15 , wherein the support structure is configured to be integrated with a nozzle.