System and method for chemical mechanical polishing pad replacement

Abstract

A system and method for chemical mechanical polishing (“CMP”) pad replacement on a CMP processing tool. A platen carrier having two or more platens is positioned within a platen cleaning process module. Each platen includes a CMP pad affixed thereto, and is capable of being independently rotated during operations. When a pad requires replacement, the platen carrier rotates towards a pad tearer tool, which extends and pivots to remove the used pad from the platen as the carrier rotates. A pad tape replacement module is positioned above the CMP tool with pad tape extending from a supply roll to a recycle roll. As the pad tape transits through the module, a backing of the tape is separated and recycled. A pad disposed in the pad tape is then applied to a platen via a pressure roller.

What is claimed is: 
     
         1 . A method for in-situ chemical mechanical polishing (CMP) pad replacement in an associated CMP tool, comprising:
 receiving, at a controller including a processor in communication with memory, an output from a pad wear detection module corresponding to a state of a CMP pad on a first platen of a platen carrier, the output indicating a CMP pad wear state requiring replacement of the CMP pad;   rotating the platen carrier toward a pad tearer tool movably positioned adjacent to the platen carrier;   engaging the pad tearer tool to remove the CMP pad on the first platen;   rotating the platen carrier and positioning a pad tape replacement module proximate to the first platen, the pad tape replacement module including a pad tape supply having a plurality of pads disposed therein; and   rolling, via a pressure roller of the pad tape replacement module, a pad disposed in the pad tape supply onto the first platen of the platen carrier.   
     
     
         2 . The method of  claim 1 , further comprising detecting, via a pad bubble detection module, at least one deformity in the pad on the first platen. 
     
     
         3 . The method of  claim 2 , further comprising rotating the platen carrier toward the pad tearer tool to remove a pad on a second platen. 
     
     
         4 . The method of  claim 1 , further comprising advancing the pad tape supply to position a new pad over the second platen. 
     
     
         5 . The method of  claim 4 , further comprising separating a backing layer from the pad tape supply prior to advancing the pad tape supply. 
     
     
         6 . The method of  claim 1 , further comprising generating an alert responsive to an output of the pad wear detection module. 
     
     
         7 . The method of  claim 1 , wherein the pad tape replacement module comprises: a pad tape supply, a backing recycle roller, the pressure roller, and a pad tape recycle roller. 
     
     
         8 . The method of  claim 1 , wherein the platen carrier is four-platen carrier or a two platen carrier. 
     
     
         9 . The method of  claim 1 , wherein the pad tape comprises a pad layer, a backing layer, and an adhesive. 
     
     
         10 . The method of  claim 1 , wherein the pad tape is precut into pads corresponding to a size of the first platen. 
     
     
         11 . A chemical mechanical polishing (CMP) pad replacement system comprising:
 a pad tape replacement module configured to removably engage a platen of an associated CMP processing tool, the CMP processing tool comprising:   a rotatable platen carrier including the platen attached thereon,   a first CMP pad affixed to the platen,   a pad wear detection module configured to output a state of the first CMP pad affixed to the platen, and   a pad tearer tool configured to engage the platen to remove the first CMP pad therefrom;   the pad tape replacement module comprising:
 a pad tape supply roller storing pad tape, and 
 a pressure roller, 
   a CMP tool controller in data communication with the pad tape replacement module and the associated CMP processing tool, the CMP tool controller including a processor in communication with memory, wherein the memory stores instructions which are executed by the processor causing the processor to:   receive an output from the pad wear detection module corresponding to a state of the first CMP pad on the platen attached to the platen carrier;   position the pad tape replacement module proximate to the platen responsive to an output of the pad wear detection module indicating a CMP pad wear state requiring replacement of the first CMP pad;   rotate the platen carrier toward the pad tearer tool movably positioned adjacent to the platen carrier;   engage the pad tearer tool to remove the first CMP pad on the platen;   rotate the platen carrier to be proximate to the pad tape replacement module, and   roll, via the pressure roller, a second CMP pad from the pad tape onto the platen attached to the platen carrier.   
     
     
         12 . The system of  claim 11 , further comprising a pad bubble detection module configured to detect at least one deformity in the first CMP pad on the platen. 
     
     
         13 . The system of  claim 12 , wherein the memory further stores instructions which are executed by the processor causing the processor to rotate the platen carrier toward the pad tearer tool to remove the first CMP pad on the platen. 
     
     
         14 . The system of  claim 11 , wherein the pad tape comprises a pad layer, a backing layer, and an adhesive, and wherein at least one backing removal roller is configured to separate the backing layer from the pad tape. 
     
     
         15 . The system of  claim 11 , wherein the platen carrier is four-platen carrier or a two-platen carrier. 
     
     
         16 . A chemical mechanical polishing (CMP) device, comprising:
 a platen carrier positioned within an interior chamber of the CMP device and comprising a plurality of independently rotatable platens coupled thereto;   a polishing pad affixed to each of the independently rotatable platens;   a rotation motor coupled to a central shaft of the platen carrier and configured to rotate the platen carrier;   a platen rotation motor removably coupled to at least one platen, the platen rotation motor configured to rotate the at least one platen during chemical mechanical polishing operation; and   a pad tape replacement module configured to removably engage one of the plurality of independently rotatable platens, the pad tape replacement module comprising:   a pad tape supply roller storing pad tape,   at least one backing removal roller,   a backing recycle roller,   a pressure roller, and   a pad tape recycle roller.   
     
     
         17 . The device of  claim 16 , further comprising a support structure configured to support the platen rotation motor, wherein the support structure is movable relative to the central shaft via a sweep motor. 
     
     
         18 . The device of  claim 16 , wherein each of the plurality of platens further comprises a corresponding drive coupling mechanism configured to engage with the platen rotation motor. 
     
     
         19 . The device of  claim 16 , further comprising a pad tearer tool positioned within the chamber, the pad tearer tool configured to rotate and engage the platens to remove a pad therefrom. 
     
     
         20 . The device of  claim 16 , wherein the platen carrier is four-platen carrier or a two platen carrier.