Wafer edge polishing drum and wafer edge polishing equipment including the same

Abstract

Disclosed are a wafer edge polishing drum and wafer edge polishing equipment including the same. The wafer edge polishing drum includes a body part having a disc shape and a polishing part extending from a peripheral portion of a first surface of the body part while being inclined with respect to the first surface of the body part. The polishing part includes an inner surface surrounding a polishing area adjacent to the first surface of the body part. The inner surface of the polishing part includes a first surface extending from the first surface of the body part and a second surface formed so as to be brought into contact with an edge area of a wafer. The second surface of the polishing part has a second angle with respect to the first surface of the body part, and the second angle is variable.

What is claimed is: 
     
         1 . A wafer edge polishing drum comprising:
 a body part having a disc shape; and   a polishing part extending from a peripheral portion of a first surface of the body part while being inclined with respect to the first surface of the body part,   wherein the polishing part includes an inner surface surrounding a polishing area adjacent to the first surface of the body part,   wherein the inner surface of the polishing part comprises a first surface extending from the first surface of the body part and a second surface formed so as to be brought into contact with an edge area of a wafer, and   wherein the second surface of the polishing part has a second angle with respect to the first surface of the body part, the second angle being variable.   
     
     
         2 . The wafer edge polishing drum according to  claim 1 , wherein the second angle is varied from 18 degrees to 30 degrees. 
     
     
         3 . The wafer edge polishing drum according to  claim 1 , wherein the first surface of the polishing part has a first angle with respect to the first surface of the body part, and
 wherein the first angle is larger than the second angle.   
     
     
         4 . The wafer edge polishing drum according to  claim 1 , have a first rotation axis perpendicular to the first surface of the body part. 
     
     
         5 . The wafer edge polishing drum according to  claim 1 , further comprising a plurality of polishing pads provided on the second surface of the polishing part,
 wherein the plurality of polishing pads is spaced apart from each other.   
     
     
         6 . The wafer edge polishing equipment comprising:
 a wafer edge polishing drum comprising a body part having a disc shape and a polishing part extending from a peripheral portion of a first surface of the body part while being inclined with respect to the first surface of the body part,
 wherein the polishing part includes an inner surface surrounding a polishing area adjacent to the first surface of the body part, the inner surface of the polishing part comprises a first surface extending from the first surface of the body part and a second surface formed so as to be brought into contact with an edge area of a wafer, the second surface of the polishing part has a second angle with respect to the first surface of the body part, and the second angle is variable; and 
 a wafer support chuck disposed so as to face the first surface of the body part of the wafer edge polishing drum while being spaced apart from the first surface of the body part. 
   
     
     
         7 . The wafer edge polishing equipment according to  claim 6 , wherein the second angle is varied from 18 degrees to 30 degrees. 
     
     
         8 . The wafer edge polishing equipment according to  claim 6 , wherein the first surface of the polishing part has a first angle with respect to the first surface of the body part, and
 wherein the first angle is larger than the second angle.   
     
     
         9 . The wafer edge polishing equipment according to  claim 6 , wherein the wafer edge polishing drum has a first rotation axis, and
 wherein the first rotation axis is perpendicular to the first surface of the body part.   
     
     
         10 . The wafer edge polishing equipment according to  claim 6 , further comprising a plurality of polishing pads provided on the second surface of the polishing part,
 wherein the plurality of polishing pads is spaced apart from each other.   
     
     
         11 . The wafer edge polishing equipment according to  claim 6 , wherein the wafer edge polishing drum has a first rotation axis, and
 wherein the first rotation axis is tilted with respect to a second rotation axis of the wafer support chuck.   
     
     
         12 . The wafer edge polishing equipment according to  claim 11 , wherein the second rotation axis is tilted to a predetermined angle with respect to a direction perpendicular to the first surface of the body part.