Chemical mechanical polishing device and method

Abstract

A chemical mechanical polishing device for spraying a gas on a polishing pad for poshing a substrate includes a first gas supplier configured to supply a first gas of a high pressure, a second gas supplier configured to supply a second gas, a spraying nozzle including a first outlet port connected to the first gas supplier and configured to spray the first gas on the polishing pad and a second outlet port connected to the second gas supplier and configured to spray the second gas on the polishing pad, an automatic regulating valve connected to each of the first gas supplier and the second gas supplier and configured to regulate supply of the first gas and the second gas to the spraying nozzle, and a controller configured to control the automatic regulating valve. In an embodiment, the controller may be configured to control the automatic regulating valve such that the spraying nozzle sprays the first gas of high pressure to cool the polishing pad and sprays the second gas to prevent water vapor from condensing around the outlet port.

1 . A chemical mechanical polishing device for spraying a gas on a polishing pad for poshing a substrate, the chemical mechanical poshing device comprising:
 a first gas supplier configured to supply a first gas of a high pressure for cooling a polishing pad;   a second gas supplier configured to supply a second gas for preventing water vapor from condensing;   a spraying nozzle comprising a first outlet port connected to the first gas supplier and configured to spray the first gas on the polishing pad and a second outlet port connected to the second gas supplier and configured to spray the second gas on the polishing pad;   an automatic regulating valve connected to each of the first gas supplier and the second gas supplier and configured to regulate supply of the first gas and the second gas to the spraying nozzle; and   a controller configured to control the automatic regulating valve,   wherein the controller is configured to control the automatic regulating valve such that the spraying nozzle sprays the first gas of high pressure to cool the polishing pad and sprays the second gas to prevent water vapor from condensing around the outlet port.   
     
     
         2 . The chemical mechanical polishing device of  claim 1 , wherein,
 based on cross-sections of the first outlet port and the second outlet port,   the first outlet port is positioned at a center, and   the second outlet port is formed to enclose a circumference of the first outlet port.   
     
     
         3 . The chemical mechanical polishing device of  claim 2 , wherein,
 based on the cross-sections of the first outlet port and the second outlet port,   the first outlet port is formed in a circular shape, and   the second outlet port is formed in an annular shape to enclose the circumference of the first outlet port.   
     
     
         4 . The chemical mechanical device of  claim 2 , wherein a sum of cross-sectional areas of the first gas supplier is greater than a sum of total cross-sectional areas of the first outlet port. 
     
     
         5 . The chemical mechanical device of  claim 1 , further comprising:
 a temperature sensor configured to detect a temperature of the polishing pad,   wherein the controller is configured to feedback-control, based on the temperature of the polishing pad detected by the temperature sensor, the automatic regulating valve.   
     
     
         6 . The chemical mechanical device of  claim 1 , wherein the automatic regulating valve comprises:
 a pressure regulating value configured to regulate spraying pressure of the first gas and the second gas; and   a pressure sensor configured to detect pressure of the first gas and the second gas.   
     
     
         7 . The chemical mechanical polishing device of  claim 1 , wherein the automatic regulating valve comprises:
 a flow rate regulating valve configured to regulate a flow rate of the first gas and a flow rate of the second gas; and   a flow rate sensor configured to detect the flow rate of the first gas and the flow rate of the second gas.   
     
     
         8 . The chemical mechanical polishing device of  claim 1 , wherein the controller is configured to control the automatic regulating valve to supply the first gas through the spraying nozzle and then additionally supply the second gas for a predetermined time. 
     
     
         9 . The chemical mechanical polishing device of  claim 1 , wherein the controller is configured to control the automatic regulating valve to supply the first gas and the second gas simultaneously through the spraying nozzle. 
     
     
         10 . The chemical mechanical polishing device of  claim 1 , wherein the controller is configured to control the automatic regulating valve such that the first gas and the second gas sprayed through the spraying nozzle are sprayed in a way that pressure of the first gas is different from pressure of the second gas. 
     
     
         11 . The chemical mechanical polishing device of  claim 1 , wherein the spraying nozzle comprises a mixing flow path and an outlet port fluidly connected to the mixing flow path and configured to spray, to outside, the first gas and the second gas mixed in the mixing flow path. 
     
     
         12 . The chemical mechanical polishing device of  claim 1 , wherein
 the first gas comprises at least one of carbon dioxide, ammonia, and butane, and   the second gas comprises an inert gas.   
     
     
         13 . A substrate polishing system comprising:
 a polishing pad configured to polish a substrate; and   a chemical mechanical polishing device disposed on the polishing pad and configured to spray a gas on the polishing pad,   wherein the chemical mechanical polishing device comprises:
 a first gas supplier configured to supply a first gas of high pressure; 
 a second gas supplier configured to supply a second gas; 
 a spraying nozzle fluidly connected to the first gas supplier and the second gas supplier and comprising an outlet port to spray the first gas and the second gas on the polishing pad; 
 an automatic regulating valve connected to each of the first gas supplier and the second gas supplier and configured to regulate supply of the first gas and the second gas to the spraying nozzle; 
 a controller configured to control the automatic regulating valve; and 
 a temperature sensor configured to detect a temperature of the polishing pad, and 
   wherein the controller is configured to:
 control the automatic regulating valve such that the spraying nozzle sprays the first gas of high pressure to cool the polishing pad and sprays the second gas to prevent water vapor from condensing around the outlet port; and 
 feedback-control, based on the temperature of the polishing pad detected by the temperature sensor, the automatic regulating valve.