Edge polishing drum for wafers and edge polishing equipment for wafers including the same

Abstract

An edge polishing drum for wafers is disclosed. The edge polishing drum includes a body part having a disc shape, and a polishing part extending inclinedly from an edge of the body part toward a first face of the body part. The polishing part includes an inner surface surrounding a polishing area adjacent to the first face of the body part. The inner surface of the polishing part includes a first surface extending from the first face of the body part, and a second surface configured to contact an edge area of a wafer to be polished. The second surface includes a first area having a 2-1th angle with respect to the first face of the body part, and a second area having a 2-2th angle with respect to the first face of the body part. The first area is disposed between the first face of the body part and the second area.

What is claimed is: 
     
         1 . An edge polishing drum for wafers comprising:
 a body part having a disc shape; and   a polishing part extending inclinedly from an edge of the body part toward a first face of the body part,   wherein the polishing part comprises an inner surface surrounding a polishing area adjacent to the first face of the body part,   wherein the inner surface of the polishing part comprises a first surface extending from the first face of the body part and a second surface configured to contact an edge area of a wafer to be polished,   wherein the second surface comprises a first area having a 2-1th angle with respect to the first face of the body part, and a second area having a 2-2th angle with respect to the first face of the body part, and   wherein the first area is disposed between the first face of the body part and the second area.   
     
     
         2 . The edge polishing drum according to  claim 1 , wherein the first area and the second area have an equal width, and surround the polishing area. 
     
     
         3 . The edge polishing drum according to  claim 1 , wherein the first area and the second area are continuously disposed while surrounding the polishing area. 
     
     
         4 . The edge polishing drum according to  claim 1 , wherein the 2-2th angle is greater than the 2-1th angle. 
     
     
         5 . The edge polishing drum according to  claim 1 , wherein the 2-1th angle is 11°. 
     
     
         6 . The edge polishing drum according to  claim 1 , wherein the 2-2th angle is 30°. 
     
     
         7 . The edge polishing drum according to  claim 1 , wherein the first surface has a first angle with respect to the first face of the body part, and the first angle is greater than the 2-1th angle and the 2-2th angle. 
     
     
         8 . The edge polishing drum according to  claim 1 , wherein the edge polishing drum has a first rotation axis, and the first rotation axis is tilted with respect to a direction perpendicular to the first face of the body part. 
     
     
         9 . The edge polishing drum according to  claim 8 , wherein a tilting angle of the first rotation axis is 2°. 
     
     
         10 . The edge polishing drum according to  claim 1 , further comprising:
 polishing pads respectively provided in the first area and the second area of the second surface of the polishing part.   
     
     
         11 . Edge polishing equipment for wafers comprising:
 the edge polishing drum for wafers according to  claim 1 ; and   a wafer support chuck disposed to be spaced apart from the first face of the body part of the edge polishing drum while facing the first surface.   
     
     
         12 . The edge polishing equipment according to  claim 11 , wherein a first rotation axis of the edge polishing drum is tilted from a second rotation axis of the wafer support chuck. 
     
     
         13 . The edge polishing equipment according to  claim 12 , wherein the second rotation axis is inclined by a predetermined angle with respect to a direction perpendicular to the first face of the body part.