P
US4906894AExpiredUtilityPatentIndex 92

Photoelectron beam converting device and method of driving the same

Assignee: CANON KKPriority: Jun 19, 1986Filed: Mar 28, 1989Granted: Mar 6, 1990
Est. expiryJun 19, 2006(expired)· nominal 20-yr term from priority
Inventors:MIYAWAKI MAMORUMASUDA YUKIOARAI RYUICHIMIZUSAWA NOBUTOSHIISHIWATARI TAKAHIKOODA HITOSHI
H01J 1/34H01J 2201/3423
92
PatentIndex Score
25
Cited by
18
References
2
Claims

Abstract

A photoelectron beam converting device including a semiconductor substrate having a p-n junction formed between an n-type region and a p-type region and an opening portion formed on the side of the semiconductor substrate. An electron beam is generated by a light which enters from the opening portion and by a reverse voltage to be applied to the p-n junction.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A photoelectric conversion device for electron emission comprising: an n-type semiconductor region having an electron emission surface for emitting electrons on one side thereof;   a first p-type semiconductor region doped with a p-type impurity of a predetermined concentration being disposed on said n-type semiconductor region at a side opposite of said electron emission surface, said first p-type semiconductor region thereby forming a p-n junction with said n-type semiconductor region;   a second p-type semiconductor region doped with a p-type impurity of a concentration less than the predetermined concentration of said first p-type semiconductor region, said second p-type semiconductor being arranged surrounding said first p-type semiconductor region on one side of said second p-type semiconductor region; and   means for applying a reverse bias voltage to the p-n junction,   wherein said second p-type semiconductor region has a concave portion, on a side opposite to the side surrounding said first p-type semiconductor region, for receiving incident light.   
     
     
       2. A photoelectric conversion device for electron emission comprising: a p-type semiconductor region doped with a p-type impurity of a predetermined high concentration;   an n-type semiconductor region disposed on at least a portion of said p-type semiconductor region forming a p-n junction on one side thereof, said n-type semiconductor region having an electron emission surface for emitting electrons at a side opposite to the p-n junction;   at least one region disposed between said n-type semiconductor and said p-type semiconductor, wherein said at least one region comprises a material selected from the group consisting of a non-doped semiconductor and an insulator;   a photoconductive region disposed on said p-type semiconductor region on a side opposite to the side in which the p-n junction is formed; and   means for applying reverse bias voltage to the p-n junction.

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