Method of forming a probe for an atomic force microscope

Abstract

A probe (10,30,40) for forming images of surfaces (11) facilitates simultaneous formation of both thermal and atomic force microsocopy images. The probe (10,30,40) includes a heat sensing assembly (15) that has a heat sensing element (19,38,42). An electrically isolating and thermally conductive tip (22,48) projects from the heat sensing assembly. The probe (10) also has a reflective element (24) that is positioned between a first end of the heat sensing assembly (15) and the electrically isolating and thermally conductive tip (22).

We claim: 
     
       1. A method of forming a probe for an atomic force microscope comprising: forming a heat sensing assembly having a spring constant of approximately 0.5 to 15 newtons/meter, and including a heat sensing element;   forming an electrically insulating and thermally conducting tip on the heat sensing element; and forming a reflective element on said heat sensing assembly.   
     
     
       2. The method of claim 1 wherein forming the heat sensing assembly includes applying a first thermocouple conductor to a first portion of a surface of a flexible cantilever, applying a second thermocouple conductor to a second portion of the surface of the flexible cantilever wherein a portion of the second thermocouple conductor overlays a portion of the first thermocouple conductor for forming the heat sensing element. 
     
     
       3. The method of claim 2 wherein applying the first thermocouple conductor and applying the second thermocouple conductor includes sputtering the first thermocouple conductor and the second thermocouple conductor onto the surface. 
     
     
       4. The method of claim 2 wherein forming the electrically insulating and thermally conducting tip on the heat sensing element includes covering the heat sensing element with an electrical insulator. 
     
     
       5. The method of claim 1 wherein forming the electrically insulating and thermally conducting tip on the heat sensing element includes attaching a diamond shard to the heat sensing element. 
     
     
       6. The method of claim 11 further including attaching the heat sensing assembly to a rigid support.