Process for preparing high-adhesion and high-solubility poly (amide-imide-ester)

Abstract

A high-solubility and high-adhesion poly(amide-imide-ester) resin prepared from a monomer composition comprising: (a) a diisocyanate such as diphenylmethane 4,4'diisocyanate; (b) a trimellitic anhydride; and (c) a bis-anhydride of trimellitic anhydride such as 1,2 bis(trimellitate)ethane dianhydride, dissolved in an appropriate solvent system. Each of the trimellitic anhydride and the bisanhydride of trimellitic anhydride constitutes 1 to 40%, on a molar basis, of the monomer composition and the amount of the diisocyanate is about 1.0 to 1.2 times, also on a molar basis, the sum of the trimellitic anhydride and the bis-anhydride of trimellitic anhydride. In an alternate embodiment, a fourth component (d) diacid such as isophthalic acid can be added to the monomer composition. After the polymerization reaction, the poly(amide-imide-ester) resin so produced can be diluted with a variety of organic solvents, such as xylene and dimethylacetamide, etc., and directly coated onto a copper foil to make polymer/metal laminates without going through an intermediate step involving polyamic acid.

What is claimed is: 
     
       1. A poly(amide-imide-ester) resin prepared from a monomer composition dissolved in an organic solvent, said monomer composition comprising: (a) a diisocyanate;   (b) a trimellitic anhydride; and   (c) a bis-anhydride of trimellitic anhydride; wherein each of said trimellitic anhydride and said bis-anhydride of trimellitic anhydride constituting 1 to 40%, on a molar basis, of said monomer composition, and the amount of said diisocyanate equaling about 1.0 to 1.2 times, also on a molar basis, the sum of said trimellitic anhydride and said bis-anhydride of trimellitic anhydride, wherein said poly(amide-imide-ester) is soluble in dimethylacetamide (DMAC), dimethylformamide (DMF), or N-methyl-2-pyrrolidone (NMP).   
     
     
       2. The poly(amide-imide-ester) resin of claim 1 wherein said monomer composition further comprises about 1 to 40 mol % of a diacid, and said diisocyanate equaling about 1.0 to 1.2 times, on a molar basis, the sum of said trimellitic anhydride, said bis-anhydride of trimellitic anhydride, and said diacid. 
     
     
       3. The poly(amide-imide-ester) resin of claim 2 wherein said diacid is isophthalic acid represented by the following formula: ##STR6## 
     
     
       4. The poly(amide-imide-ester) resin of claim 2 wherein said diacid is an aliphatic diacid represented by the following formula: ##STR7## wherein n is an integer from 1 to 12. 
     
     
       5. The poly(amide-imide-ester) resin of claim 1 wherein said diisocyanate is diphenylmethane 4,4'-diisocyanate represented by the following formula ##STR8## 
     
     
       6. The poly(amide-imide-ester) resin of claim 1 wherein said bis-anhydride of trimellitic anhydride is 1,2 bis(trimellitate)ethane dianhydride represented by the following formula: ##STR9## 
     
     
       7. The poly(amide-imide-ester) resin of claim 1 wherein said diisocyanate is selected from the group consisting of diphenylmethane 4,4'-diisocyanate, hexamethylene diisocyanate, trans-cyclohexane 1,4-diisocyanate, isophorone diisocyanate, 2,2,4- and 2,4,4-trimethylene diisocyanate, m-tetramethylxylene diisocyanate, p-tetramethylxylene diisocyanate, dicyclohexylmethane 4,4'-diisocyanate, m-phenylene diisocyanate, toluene 2,4-diisocyanate, and diphenylmethane 2,4'-diisocyanate. 
     
     
       8. The poly(amide-imide-ester) resin of claim 1 wherein said bis-anhydride of trimellitic anhydride is selected from the group consisting of 2,2'-bis(p-trimellitoxy phenyl) propane dianhydride and p-phenylene bis(trimellitate) dianhydride. 
     
     
       9. A process for making poly(amide-imide-ester) resin comprising the steps of: (a) preparing a monomer composition containing at least a diisocyanate, a trimellitic anhydride and a bis-anhydride of trimellitic anhydride dissolved in a solvent system, wherein the molar proportions of said trimellitic anhydride and said bis-anhydride of trimellitic anhydride relative to the total moles of the monomers are from 1 to 40%, the moles of said diisocyanate equaling about 1.0 to 1.2 times the sum of said trimellitic anhydride and said bis-anhydride of trimellitic anhydride; and   (b) heating said monomer composition to effectuate a polymerization reaction; wherein said poly(amide-imide-ester) is soluble in dimethylacetamide (DMAC), dimethylformamide (DMF), or N-methyl-2-pyrrolidone (NMP).   
     
     
       10. The poly(amide-imide-ester) resin of claim 9 wherein said monomer composition further comprises about 1 to 40 mol % of a diacid, and said diisocyanate equaling about 1.0 to 1.2 times, on a molar basis, the sum of said trimellitic anhydride, said bis-anhydride of trimellitic anhydride, and said diacid. 
     
     
       11. The process of making the poly(amide-imide-ester) resin of claim 10 wherein said diacid is isophthalic acid or an aliphatic diacid represented by the following formula: ##STR10## wherein n is an integer from 1 to 12. 
     
     
       12. The process of making the poly(amide-imide-ester) resin of claim 9 wherein: (a) said diisocyanate is selected from the group consisting of diphenylmethane 4,4'diisocyanate, hexamethylene diisocyanate, trans-cyclohexane 1,4-diisocyanate, isophorone diisocyanate, 2,2,4- and 2,4,4-trimethylene diisocyanate, m-tetramethylxylene diisocyanate, p-tetramethylxylene diisocyanate, dicyclohexylmethane 4,4'-diisocyanate, m-phenylene diisocyanate, toluene 2,4-diisocyanate, and diphenylmethane 2,4'-diisocyanate; and   (b) said bis-anhydride of trimellitic anhydride is selected from the group consisting of 1,2 bis(trimellitate)ethane dianhydride, 2,2'-bis(p-trimellitoxy phenyl) propane dianhydride and p-phenylene bis(trimellitate) dianhydride.