Inventor · disambiguated record
Tzong-Ming Lee
Also filed as: LEE TZONG-MING
38 granted patents·16 pending applications·229 citations·filing 1990–2024
97Inventor score
Files withIND TECH RES INST34MATSUSHITA ELECTRIC WORKS LTD4LEU CHYI-MING3J & A TECH CORPORATION2LEE TZONG-MING2
Top patents by PatentIndex Score
54 records- 0193US8207256B2Organic/inorganic hybrid material and fabrication method thereofLEU CHYI-MING·Filed 2010·Granted Jun 26, 2012·12 cites·20 claims
- 0292US10399310B2Resin film, laminate, optical member, gas barrier material and touch sensor substrateSUMITOMO CHEMICAL CO·Filed 2016·Granted Sep 3, 2019·5 cites·11 claims
- 0387US7057277B2Chip package structureMATSUSHITA ELECTRIC WORKS LTD·Filed 2004·Granted Jun 6, 2006·53 cites·22 claims
- 0485US7662307B2Composition for thermal interface materialIND TECH RES INST·Filed 2006·Granted Feb 16, 2010·5 cites·14 claims
- 0582US7504138B2Liquid crystal display deviceIND TECH RES INST·Filed 2005·Granted Mar 17, 2009·7 cites·4 claims
- 0681US8674011B2Organic/inorganic hybrid material and fabrication method thereofLEU CHYI-MING·Filed 2010·Granted Mar 18, 2014·2 cites·20 claims
- 0780US7651744B2Liquid crystal displayIND TECH RES INST·Filed 2005·Granted Jan 26, 2010·4 cites·20 claims
- 0879US7727600B2Liquid crystal display deviceIND TECH RES INST·Filed 2008·Granted Jun 1, 2010·5 cites·5 claims
- 0978US9029003B2Electrode assembly of lithium secondary batterySULAIMAN LO ANGELIA·Filed 2012·Granted May 12, 2015·4 cites·6 claims
- 1078US8465675B2Encapsulation materialKUAN MIN-TSUNG·Filed 2010·Granted Jun 18, 2013·4 cites·14 claims
- 1177US5602213AHeat resistant composition bismaleimide-modified polyurethaneIND TECH RES INST·Filed 1993·Granted Feb 11, 1997·24 cites·14 claims
- 1274US7662449B2Liquid crystal displayIND TECH RES INST·Filed 2006·Granted Feb 16, 2010·5 cites·28 claims
- 1373US2025129212A1Porous film and copper clad laminateIND TECH RES INST·Filed 2024·Application pending·0 cites
- 1468US9412921B2Module structureIND TECH RES INST·Filed 2013·Granted Aug 9, 2016·1 cites·11 claims
- 1566US7061103B2Chip package structureMATSUSHITA ELECTRIC WORKS LTD·Filed 2004·Granted Jun 13, 2006·14 cites·16 claims
- 1663US7834070B2Halogen-free and thermal resistant compositionIND TECH RES INST·Filed 2007·Granted Nov 16, 2010·3 cites·14 claims
- 1763US6809130B2Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the sameIND TECH RES INST·Filed 2003·Granted Oct 26, 2004·11 cites·11 claims
- 1862US8323553B2Method for manufacturing a substrate with surface structure by employing photothermal effectLEE TZONG-MING·Filed 2009·Granted Dec 4, 2012·3 cites·7 claims
- 1961US10141083B2Transparent conductive film composite and transparent conductive filmIND TECH RES INST·Filed 2014·Granted Nov 27, 2018·0 cites·5 claims
- 2059US7965441B2Optical film with super low retardation and polarizing plate containing the sameIND TECH RES INST·Filed 2007·Granted Jun 21, 2011·2 cites·17 claims
- 2159US7230331B2Chip package structure and process for fabricating the sameMATSUSHITA ELECTRIC WORKS LTD·Filed 2004·Granted Jun 12, 2007·8 cites·5 claims
- 2256US11180611B2Oligomer or polymer with carbonate segment chemical structureJ & A TECH CORPORATION·Filed 2019·Granted Nov 23, 2021·0 cites·4 claims
- 2356US8268413B2Liquid crystal display deviceLEU CHYI-MING·Filed 2010·Granted Sep 18, 2012·0 cites·14 claims
- 2455US5514747APolyamide-imide-modified polyurethane insulation enamel compositionIND TECH RES INST·Filed 1995·Granted May 7, 1996·19 cites·18 claims
- 2554US5310850AHeat resistant poly(urethane amideimide) composition and method for preparing the sameIND TECH RES INST·Filed 1992·Granted May 10, 1994·10 cites·18 claims
- 2653US2014140012A1Module structureIND TECH RES INST·Filed 2013·Application pending·0 cites
- 2752US10590258B2Carbon fiber precursor composition and method for preparing carbon fiber precursorIND TECH RES INST·Filed 2017·Granted Mar 17, 2020·0 cites·22 claims
- 2852US5112926AThermal-resistant resin composition for printed circuit boards based on triazine modified epoxy resin blendsIND TECH RES INST·Filed 1991·Granted May 12, 1992·9 cites·14 claims
- 2952US2024201529A1Display panelIND TECH RES INST·Filed 2023·Application pending·0 cites
- 3051US8883956B2PolyimidesIND TECH RES INST·Filed 2012·Granted Nov 11, 2014·0 cites·8 claims
- 3151US2008211997A1Polarizing plates and liquid crystal displays comprising the sameIND TECH RES INST·Filed 2008·Application pending·0 cites
- 3247US10005881B2Wavelength-converting polymers, method for fabricating the same, and wavelength-converting devices employing the sameIND TECH RES INST·Filed 2015·Granted Jun 26, 2018·0 cites·20 claims
- 3347US2008193822A1Proton conducting membrane of polymer blend and process for preparing poly(amide imide) used thereinUNIV TSINGHUA·Filed 2008·Application pending·0 cites
- 3446US10988574B2Method of producing oligomer or polymer with carbonate segment chemical structureJ & A TECH CORPORATION·Filed 2019·Granted Apr 27, 2021·0 cites·20 claims
- 3546US2009235754A1Encapsulation composition for pressure signal transmission and sensorIND TECH RES INST·Filed 2009·Application pending·0 cites
- 3646US2007148469A1Encapsulation composition for pressure signal transmission and sensorTSENG FENG-PO·Filed 2006·Application pending·0 cites
- 3746US2006261499A1Chip package structureMATSUSHITA ELECTRIC WORKS LTD·Filed 2006·Application pending·0 cites
- 3845US2007072339A1Process for fabricating chip package structureCHEN KAI-CHI·Filed 2006·Application pending·0 cites
- 3945US2011091732A1Polyamic acid resin composition and polyimide film prepared therefromIND TECH RES INST·Filed 2010·Application pending·0 cites
- 4045US2017326851A1Optical film, flexible device member comprising the optical film, and resin compositionSUMITOMO CHEMICAL CO·Filed 2017·Application pending·0 cites
- 4144US7486442B2Polarizer protective film, polarizing plate, and visual displayIND TECH RES INST·Filed 2004·Granted Feb 3, 2009·1 cites·19 claims
- 4244US6627684B2Dielectric compositions having two steps of laminating temperaturesIND TECH RES INST·Filed 2001·Granted Sep 30, 2003·0 cites·7 claims
- 4342US2010219369A1Composition of thermal interface materialIND TECH RES INST·Filed 2010·Application pending·0 cites
- 4440US5268432AHeat resistant modified bismaleimide adhesive compositionIND TECH RES INST·Filed 1992·Granted Dec 7, 1993·10 cites·10 claims
- 4540US2018327603A1Anthraquinone compounds and use thereofIND TECH RES INST·Filed 2017·Application pending·0 cites
- 4639US2012009353A1Method for manufacturing a substrate with surface structure by employing photothermal effectLEE TZONG-MING·Filed 2011·Application pending·0 cites
- 4738US2004212080A1[chip package structure and process for fabricating the same]Filed 2004·Application pending·0 cites
- 4837US5470936AProcess for preparing high-adhesion and high-solubility poly (amide-imide-ester)IND TECH RES INST·Filed 1993·Granted Nov 28, 1995·3 cites·12 claims
- 4936US2007142540A1Composition of thermal interface materialCHIOU KUO-CHAN·Filed 2006·Application pending·0 cites
- 5034US5130407AHydantoin or barbituric acid-extended epoxy resinIND TECH RES INST·Filed 1991·Granted Jul 14, 1992·2 cites·1 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →