Cooling apparatus of electronic devices

Abstract

A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.

What is claimed is: 
     
       1. A cooling apparatus for electronic devices, the cooling apparatus comprising: thermal conductive members each provided with a plurality of first fins;   second fins engagable with said first fins so as to transmit heat from said first fins to a housing;   setting spaces formed of grooves provided in each of said first and second fins extending transversely through each of said first and second fins in a direction substantially perpendicular to said first and second fins; and   linear spring members accommodated in said setting spaces and extending in a direction transverse to a longitudinal axis of said first and second fins, whereby each of said thermal conductive members is urged in a direction toward the surface of each of said electronic devices mounted on a circuit substrate.   
     
     
       2. A cooling apparatus according to claim 1, wherein each of said setting spaces includes a first groove having a depth not less than half of a height of said first fins, provided in a central portion of said first fins in a direction of a width of said first fins and extending perpendicular to said first fins, and a second groove having a depth not less than half of a height of said second fins, provided in said second fins at a position corresponding to said first grooves of said first fins. 
     
     
       3. A cooling apparatus according to claim 2, wherein each of said linear spring members is a leaf spring. 
     
     
       4. A cooling apparatus according to claim 1, wherein each of said leaf spring members is a linear spring.