Curing apparatus

Abstract

A curing apparatus for drying bonding material that is used for bonding, for example, chips to a lead frame for semiconductor devices including a plurality of heating blocks which are spacedly installed in a conveying direction of workpieces and each of the heating blocks is provided with heat-insulating plates on its lower surface, both side surfaces and both end surfaces so as to facilitate temperature control of each of the heating blocks.

I claim: 
     
       1. A curing apparatus equipped with a plurality of separate heating blocks which are installed, with gaps between each of said plurality of separate heating blocks, in a conveying direction of workpieces in which chips are bonded to lead frames by a paste and which are used to heat said workplaces, said curing apparatus being characterized in that heat-insulating plates are fastened to a lower surface, both side surfaces oriented in said conveying direction of said workplaces and both end surfaces oriented perpendicular to said conveying direction of said workplaces of a main body of each of said plurality of separate heating blocks whereby a temperature of each of said plurality of separate heating blocks can be controlled more accurately and easily. 
     
     
       2. A curing apparatus according to claim 1, wherein a hot plate is fastened to an upper surface of said main body of each of said plurality of separate heating blocks. 
     
     
       3. A curing apparatus equipped with a plurality of heating blocks which are spacedly installed in a conveying direction of workpieces on which a past has been applied in order to bond elements on said workpieces, said curing apparatus being characterized in that each of said plurality of heating blocks is separately covered with heat-insulating plates except for an upper top surface thereof.