Adjusting the size of conductive lines based upon contact size

Abstract

The present invention is directed to a method of forming conductive interconnections in an integrated circuit device to optimize or at least maintain the speed at which signals propagate throughout the integrated circuit device. In one embodiment, the method comprises determining any variation in the size of a contact, as compared to its design size, and varying the size of a conductive line to be coupled to the contact based upon the variation in the size of the contact.

What is claimed: 
     
       1. A method, comprising: determining a variation in a size of a contact as compared to a design size for said contact; and   determining if a size of a conductive line to be coupled to said contact needs to be varied based upon the determined size variation of said contact.   
     
     
       2. The method of claim 1, further comprising varying the size of said conductive line to be coupled to said contact based upon said determined variation in said contact size. 
     
     
       3. The method of claim 2, further comprising increasing the size of said conductive line if said contact size is less than the design size of said contact. 
     
     
       4. The method of claim 2, further comprising increasing a height of a conductive line if said contact size is less than the design size of said contact. 
     
     
       5. The method of claim 1, wherein determining a variation in a size of a contact as compared to a design size for said contact comprises determining a variation in a size of a contact as compared to a design size for said contact after said contact is formed. 
     
     
       6. The method of claim 1, wherein determining a variation in a size of a contact as compared to a design size for said contact comprises determining a variation in a size of a contact as compared to a design size for said contact before said contact is formed. 
     
     
       7. The method of claim 1, wherein determining a variation in a size of a contact as compared to a design size for said contact comprises determining a variation in a diameter of a contact as compared to a design diameter for said contact. 
     
     
       8. The method of claim 1, determining a variation in a size of a contact as compared to a design size for said contact comprises determining a variation in a height of a contact as compared to a design height for said contact. 
     
     
       9. The method of claim 1, wherein determining a variation in a size of a contact as compared to a design size for said contact comprises determining a variation in a diameter of a via in which a contact is to be formed as compared to a design diameter of said via. 
     
     
       10. The method of claim 1, wherein determining a variation in a size of a contact as compared to a design size for said contact comprises determining a variation in a thickness of a dielectric layer in which a plurality of contacts will be formed as compared to a design thickness of said dielectric layer. 
     
     
       11. A method, comprising: determining a variation in a size of a contact as compared to a design size for said contact;   determining if a size of a conductive line to be coupled to said contact needs to be varied based upon the determined size variation of said contact; and   varying the size of said conductive line to be coupled to said contact based upon said determined variation in said contact size.   
     
     
       12. The method of claim 11, wherein determining a variation in a size of a contact as compared to a design size for said contact comprises determining a variation in a size of a contact as compared to a design size for said contact after said contact is formed. 
     
     
       13. The method of claim 11, wherein determining a variation in a size of a contact as compared to a design size for said contact comprises determining a variation in a size of a contact as compared to a design size for said contact before said contact is formed. 
     
     
       14. The method of claim 11, wherein determining a variation in a size of a contact as compared to a design size for said contact comprises determining a variation in a diameter of a contact as compared to a design diameter for said contact. 
     
     
       15. The method of claim 11, determining a variation in a size of a contact as compared to a design size for said contact comprises determining a variation in a height of a contact as compared to a design height for said contact. 
     
     
       16. The method of claim 11, wherein determining a variation in a size of a contact as compared to a design size for said contact comprises determining a variation in a diameter of a via in which a contact is to be formed as compared to a design diameter of said via. 
     
     
       17. The method of claim 11, wherein determining a variation in a size of a contact as compared to a design size for said contact comprises determining a thickness of a dielectric layer in which a plurality of contacts will be formed as compared to a design thickness of said dielectric layer. 
     
     
       18. The method of claim 11, further comprising increasing the size of said conductive line if said contact size is less than the design size of said contact. 
     
     
       19. The method of claim 11, further comprising increasing a height of a conductive line if said contact size is less than the design size of said contact. 
     
     
       20. A method, comprising: forming a via for a contact in a dielectric layer;   determining a variation in a size of said via as compared to a design size for said via; and   determining if a size of a conductive line to be coupled to a contact to be formed in said via needs to be varied based upon the determined size variation of said via.   
     
     
       21. The method of claim 20, further comprising varying the size of the conductive line to be coupled to said contact based upon the determined size variation of said via. 
     
     
       22. The method of claim 20, wherein forming a via for a contact in a dielectric layer comprises etching a via for a contact in a dielectric layer. 
     
     
       23. The method of claim 20, wherein determining a variation in a size of said via as compared to a design size for said via comprises determining a variation in a physical dimension of said via as compared to a design physical dimension for said via. 
     
     
       24. The method of claim 20, wherein determining a variation in a size of said via as compared to a design size for said via comprises determining a variation in a diameter of said via as compared to a design diameter for said via. 
     
     
       25. The method of claim 20, wherein determining a variation in a size of said via as compared to a design size for said via comprises determining a variation in a thickness of a dielectric layer in which said via will be formed as compared to a design thickness for said dielectric layer. 
     
     
       26. A method, comprising: forming a via for a contact in a dielectric layer;   determining a variation in a size of said via as compared to a design size for said via; and   determining if a size of a conductive line to be coupled to a contact to be formed in said via needs to be varied based upon the determined size variation of said via.   
     
     
       27. The method of claim 26, further comprising varying the size of the conductive line to be coupled to said contact based upon the determined size variation of said via. 
     
     
       28. The method of claim 26, wherein forming a via for a contact in a dielectric layer comprises etching a via for a contact in a dielectric layer. 
     
     
       29. The method of claim 26, wherein determining a variation in a size of said via as compared to a design size for said via comprises determining a variation in a physical dimension of said via as compared to a design physical dimension for said via. 
     
     
       30. The method of claim 26, wherein determining a variation in a size of said via as compared to a design size for said via comprises determining a variation in a diameter of said via as compared to a design diameter for said via. 
     
     
       31. The method of claim 26, wherein determining a variation in a size of said via as compared to a design size for said via comprises determining a variation in a thickness of a dielectric layer in which said via will be formed as compared to a design thickness for said dielectric layer. 
     
     
       32. A method, comprising: determining at least one dimension of a contact;   determining a size of a conductive line to be electrically coupled to said contact based upon said determined dimension of said contact; and   forming a conductive line of said determined size.   
     
     
       33. The method of claim 32, wherein determining at least one dimension of a contact comprises measuring a diameter of said contact. 
     
     
       34. The method of claim 32, wherein determining at least one dimension of a contact comprises measuring a height of said contact. 
     
     
       35. The method of claim 32, wherein determining at least one dimension of a contact comprises measuring a thickness of a dielectric layer in which said contact is to be formed. 
     
     
       36. The method of claim 32, wherein determining at least one dimension of a contact comprises measuring a dimension of a via in which said contact will be formed. 
     
     
       37. The method of claim 32, wherein determining a size of a conductive line to be electrically coupled to said contact based upon said determined dimension of said contact comprises calculating a size of a conductive line to be electrically coupled to said contact. 
     
     
       38. The method of claim 32, wherein determining a size of a conductive line to be electrically coupled to said contact based upon said determined dimension of said contact comprises selecting a conductive line of a preselected size based upon said determined dimension of said contact. 
     
     
       39. A method, comprising: determining a variation in a physical dimension of a contact;   determining a physical dimension of a conductive line to be electrically coupled to said contact based upon said determined variation of a physical dimension of said contact; and   forming a conductive line having said determined physical dimension.   
     
     
       40. The method of claim 39, wherein determining a variation in a physical dimension of a contact comprises determining at least one of a height, a width, a length, a thickness, and a diameter of said contact. 
     
     
       41. The method of claim 39, wherein determining a variation in a physical dimension of a contact comprises measuring a thickness of a dielectric layer in which said contact will be formed. 
     
     
       42. The method of claim 39, wherein determining a variation in a physical dimension of a contact comprises measuring a dimension of a via in which said contact will be formed. 
     
     
       43. The method of claim 39, wherein determining a physical dimension of a conductive line to be electrically coupled to said contact based upon said determined variation of a physical dimension of said contact comprises calculating a physical size of a conductive line to be electrically coupled to said contact. 
     
     
       44. The method of claim 39, wherein determining a physical dimension of a conductive line to be electrically coupled to said contact based upon said determined variation of a physical dimension of said contact comprises selecting a conductive line of a preselected physical dimension based upon said determined physical dimension of said contact.