Polymer-bound sensitizer

Abstract

A photoresist composition for use in lithographic processes in the fabrication of semiconductor devices such as integrated circuit structures is disclosed. The photoresist composition includes a monomeric sensitizer bounding to a base-soluble long chain polymer.

We claim:  
     
       1. A composition suitable for use in a photoresist formulation, said composition comprising: 
       a monomeric sensitizer selected from the group consisting of chrysenes, pyrenes, fluoranthenes, anthrones, benzophenones, thioxanthones, and anthracenes; and  
       a base-soluble long chain polymer having a molecular weight within the range of 1000 to 250,000, wherein the monomeric sensitizer is bound to the base-soluble long chain polymer and wherein the base-soluble long chain polymer is selected from the group consisting of p-hydroxystyrene-maleic anhydride copolymers, polyhydroxystyrene-p-tertiarybutyl-carbanatostyrene copolymers, poly-4-hydroxystyrene, poly-3-hydroxystyrene polymers, poly-3-methyl-4-hydroxy styrene, poly-2-hydroxystyrene copolymers, phenol-formaldehyde resins, polymethyl methacrylate-tertiary butyl methacrylate-polymethacrylic acid terpolymers, and poly-4-hydroxystyrene-tertiary butyl methacrylate copolymers.  
     
     
       2. A composition suitable for use in a photoresist formulation, said composition comprising; 
       a base-soluble long chain polymer having a hydroxy group; and  
       a monomeric sensitizer bonded to the polymer, wherein the hydroxy group of the base-soluble long chain polymer remaining intact after the monomeric sensitizer is bonded to the polymer.  
     
     
       3. The composition of  claim 2  wherein the monomeric sensitizer comprises between 1 and 25 mole percent of the composition. 
     
     
       4. The composition of  claim 2  wherein the monomeric sensitizer comprises between 1 and 15 mole percent of the composition. 
     
     
       5. The composition of  claim 2 , wherein the monomeric sensitizer is selected from the group consisting of: chrysenes; pyrenes; fluoranthenes; anthrones; benzophenones; thioxanthones; and anthracenes. 
     
     
       6. The composition of  claim 5 , wherein the monomeric sensitizer includes 9-anthracene methanol. 
     
     
       7. The composition of  claim 2 , wherein the base-soluble long chain polymer is selected from the group consisting of: 
       p-hydroxystyrene-maleic anhydride copolymers; polyhydroxystyrene-p-tertiarybutyl-carbanatosyrene copolymers; poly-4-hydroxystyrene; poly-3-hydroxystyrene polymers; poly-3-methyl-4-hydroxy styrene; poly-2-hydroxystyrene copolymers; phenol-formaldehyde resins; polymethyl methacrylate-teriary butyl methacrylate-polymethacrylic acid terpolymers; and poly-4-hydroxystyrene-tertiary butyl methacrylate copolymers.  
     
     
       8. The composition of  claim 7  wherein the base-soluble long chain polymer includes poly-4-hydroxystyrene. 
     
     
       9. The composition of  claim 2  wherein the composition is soluble in a basic developer solution. 
     
     
       10. The composition of  claim 2  wherein the composition includes a sensitizer. 
     
     
       11. The composition of  claim 2  wherein the composition includes a dye. 
     
     
       12. The composition of  claim 2  wherein the composition further comprises acid labile groups. 
     
     
       13. The composition of  claim 2 , in admixure with at least one of a polymer resin, a photoacid generator, a cross-linker and a casting solvent. 
     
     
       14. The composition of  claim 13  wherein: 
       the composition includes an amount in the range of about 1 to about 96 weight percent based on a total solids;  
       the polymer resin includes an amount in the range of about 0 to about 96 weight percent based on the total solids;  
       the photoacid generator includes an amount in the range of about 1 to about 20 weight percent based on the total solids; and  
       the cross-linker includes an amount in the range of about 1 to about 20 weight percent based on the total solids.  
     
     
       15. The composition of  claim 14 , wherein: 
       the composition includes an amount in the range of about 1 to about 40 weight percent based on a total solids; and  
       the polymer resin includes an amount in the range of about 10 to about 96 weight percent based on the total solids.  
     
     
       16. The composition of  claim 2 , wherein a molecular weight includes from about 1,000 to about 250,000.