Apparatus and method for handling substrates

Abstract

An apparatus and method are provided for handling substrates that are provided with an inner hole. The apparatus includes an inner gripper in the form of an inner hole gripper, and an outer gripper that is embodied as a vacuum gripper and is provided with a ring in which are disposed a plurality of suction devices. A control unit controls the inner and outer grippers such that they are moved relative to one another, while they grasp one and the same substrate, for deforming or bending the substrate. According to the method, a first substrate is grasped by the inner hole gripper, is brought into contact with an outer gripper, and is grasped by the outer gripper. The inner hole gripper is released and moved through the hole in the first substrate and then grasps a second substrate. After releasing the second substrate, the inner hole gripper again grasps the first substrate and the inner and outer grippers are moved relative to one another to bend the first substrate, whereupon the center portion of the bent first substrate is brought into contact with the second substrate. Thereafter, the remaining portions of the first substrate are brought into contact with the second substrate.

What is claimed is:  
     
       1. An apparatus for handling substrates that are provided with an inner hole, said apparatus comprising: 
       an inner hole gripper;  
       an outer gripper embodied as a vacuum gripper, wherein said outer gripper is provided with a ring in which are disposed a plurality of suction devices; and  
       a control unit for controlling said inner hole gripper and said outer gripper such that they are moved relative to one another; while they grasp one and the same substrate, for bending or deforming said substrate.  
     
     
       2. An apparatus according to  claim 1 , wherein said ring has a convexly bent shape. 
     
     
       3. An apparatus according to  claim 1 , wherein said inner hole gripper is vertically moveable. 
     
     
       4. An apparatus according  claim 1 , wherein said inner hole gripper has an outer diameter that is less than an inner diameter of said inner hole of said substrates. 
     
     
       5. An apparatus according to  claim 1 , wherein said inner hole gripper is pneumatically actuateable. 
     
     
       6. An apparatus according to  claim 1 , wherein said inner and outer grippers are actuateable independently of one another. 
     
     
       7. An apparatus according to  claim 1 , wherein said apparatus is horizontally moveable for transporting said substrates. 
     
     
       8. Method for handling substrates that are provided with an inner hole, including the steps of: 
       grasping a first substrate with an inner hole gripper;  
       bringing said first substrate into contact with an outer gripper;  
       grasping said first substrate with said outer gripper;  
       releasing contact between said inner hole gripper and said first substrate;  
       moving said inner hole gripper through said inner hole of said first substrate;  
       grasping a second substrate with said inner hole gripper;  
       releasing said second substrate;  
       again grasping said first substrate with said inner hole gripper;  
       moving said inner hole gripper relative to said outer gripper in order to bend said first substrate;  
       bringing a central portion of said bent first substrate into contact with said second substrate; and  
       bringing a remainder of said first substrate into contact with said second substrate.  
     
     
       9. A method according to  claim 8 , wherein said step of bringing said first substrate into contact with said outer gripper is effected via a vertical movement. 
     
     
       10. A method according to  claim 8 , wherein said step of bringing said first substrate into contact with said outer gripper is effected by raising said inner hole gripper. 
     
     
       11. A method according  claim 8 , which includes the step of pneumatically controlling said grasping of said first and second substrates with said inner hole gripper. 
     
     
       12. A method according to  claim 8 , wherein said step of grasping said first substrate with said outer gripper is effected via a vacuum. 
     
     
       13. A method according  claim 8 , wherein rim portions of said first substrate are bent away from said second substrate. 
     
     
       14. A method according to  claim 8 , wherein said inner hole gripper and said outer gripper are moved horizontally.