Automatic decapsulation system utilizing an integrated spacer/protection plate

Abstract

An automatic decapsulation system for a device is disclosed. The system comprises an etch plate, an etch head, a sheet coupled to the etch head, a rubber gasket disposed between the etch head and the sheet, and an integrated spacer and protection plate for securing the device without damaging the backside of the device during decapsulation. In one embodiment of the present invention, the integrated spacer and protection plate is adjustable to accommodate devices of varying sizes.

What is claimed is:  
     
       1. An automatic decapsulation system for a device having a front side and a backside, wherein the front side is decapsulated, the system comprising: 
       an etch plate;  
       an etch head for providing an etchant;  
       a sheet coupled to the etch plate via a rubber gasket, the sheet for providing a gasket plate for the device and a seal between the device and the etch head; and  
       a plate containing a plurality of movable bars for securing the device without damaging the backside of the device; wherein the plurality of bars slide toward and away from one another in a longitudinal direction along a notched slot in the plate; and  
       wherein a step is provided on an end of each bar, the stepped end being closest to a middle line of the plate, such that the stepped end of each bar face each other.  
     
     
       2. The system of  claim 1 , wherein the plate has a top surface and a bottom surface, the bottom surface having a trench with at least two tiers, a first tier being substantially the same size as the device such that the device fits within the first tier. 
     
     
       3. The system of  claim 2 , wherein a second tier of the trench is smaller in size than the first tier, such that a rim is formed between the first tier and the second tier. 
     
     
       4. The system of  claim 3 , wherein the plate has a thickness and the at least two tiers has an overall height that is less than the thickness of the integrated spacer and protection plate. 
     
     
       5. The system of  claim 4 , wherein the plate is positioned over the device, the device fitting within the trench formed by the first tier, and the rim formed between the first tier and the second tier resting on the backside of the device; and 
       wherein, the second tier forms a space above the backside, such that the device is protected from damage during decapsulation.  
     
     
       6. The system of  claim 5 , wherein the device is a ball grid array package having a plurality of solder balls on the backside. 
     
     
       7. The system of  claim 6 , wherein the rim rests on an area of the device not containing the plurality of solder balls, and 
       wherein, the second tier has a height exceeding a diameter of a solder ball, such that the plurality of solder balls is protected during decapsulation.  
     
     
       8. The system of  claim 7 , wherein the rim is approximately 0.5 mm wide. 
     
     
       9. The system of  claim 7 , wherein the height of the second tier ranges from approximately 0.30 mm to 0.60 mm. 
     
     
       10. The system of  claim 1 , wherein the plurality of bars are adjusted to form a first opening having substantially the same size as a side of the device, the first opening being located on a bottom surface of the plate facing the device; and 
       wherein a second opening is formed above the first opening, the second opening being smaller than the first opening by a width equal to twice a width of the step.  
     
     
       11. The system of  claim 10 , wherein the plate has a thickness and the first and second openings has an overall height less than the thickness of the plate. 
     
     
       12. The system of  claim 11 , wherein the device is a ball grid array package having a plurality of solder balls on the backside. 
     
     
       13. The system of  claim 12 , wherein the step rests on an area of the device not containing the plurality of solder balls, and 
       wherein, the second opening has a height exceeding a diameter of a solder ball, such that the plurality of solder balls is protected during decapsulation.  
     
     
       14. The system of  claim 13 , wherein the step is approximately 0.5 mm wide. 
     
     
       15. The system of  claim 13 , wherein the height of the second opening ranges from approximately 0.30 mm to 0.60 mm. 
     
     
       16. The system of  claim 1 , wherein the plate comprises a polytetrafluoroethylene sheet, the polytetrafluoroethylene sheet having an approximate thickness of 0.125 inches. 
     
     
       17. The system of  claim 1 , wherein the plate further comprising a plurality of pins for keeping the plurality of bars in place.